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FMLR-6X-P-MA62X

1/13

FMLR-

6X-P-MA62X

WOLRD SMALLEST HIGH PERFORMANCE

LORAWAN

IOT MODUL

Smallest FMLR subGHz low

power wireless module with

MAX32625/26 and Semtech

SX1261

FMLR-6X-P-MA62X LoRa

and

LoRaWAN

IoT module enables devices

and sensors to communicate at low data

rates or over long distance. The integrated

SX1261 transceiver supports a frequency

range from 902 - 928 MHz. Power con-

sumption can be optimized to run on a

small-sized battery. The integrated low

power ARM Cortex- M4 microcontroller

has sufﬁcient resources available to run

user applications.

The FMLR-6X-P-MA62X supports a vast

number of modulation schemes such as

LoRa

, (G)FSK, (G)MSK, ASK, and OOK.

KEY BENEFITS

▪ Semtech SX1261 based long range Lo-

RaWAN

IoT module

▪ Line-of-sight range of up to 100km

▪ Maxim ARM Cortex-M4 MCU

▪ Secure MCU option with MAX32626

▪ Customer application on MCU

▪ Fully FCC and CE certiﬁed

▪ Tiny footprint: 8.5 x 9.3 mm

APPLICATIONS

▪ Wearable sensor devices

▪ Long range, low data rate IoT sensors

▪

Asset Tracking and monitoring

▪ Smart agriculture, farming and city

Summary of content (13 pages)

PAGE 1
FMLR6X-P-MA62X WOLRD SMALLEST HIGH PERFORMANCE LORAWAN® IOT MODUL Smallest FMLR subGHz low power wireless module with MAX32625/26 and Semtech SX1261 FMLR-6X-P-MA62X LoRa® and ® LoRaWAN IoT module enables devices KEY BENEFITS ▪ and sensors to communicate at low data Semtech SX1261 based long range LoRaWAN® IoT module rates or over long distance. The integrated ▪ Line-of-sight range of up to 100km SX1261 transceiver supports a frequency ▪ Maxim ARM Cortex-M4 MCU range from 902 - 928 MHz.
PAGE 2
Document Information ABOUT File name FMLR-6X-P-MA62X datasheet Document type Datasheet Date 03.02.2021 Revision 1.3.151 REVISION HISTORY Date Release Changes 03.02.2021 1.0 Initial revision 2021/03/03 1.1 New template 2021/08/09 1.2 Updated FCC info 2021/11/09 1.
PAGE 3
Functional Description The world’s smallest FMLR-6X-P-MA62X LoRa® and LoRaWAN® IoT module provides wireless connectivity to devices, systems and sensors communicating with low data rates or over a long distance. The integrated Semtech transceiver supports a frequency range from 902 928 MHz. Power consumption can be optimized to run on a small-sized battery. The integrated ARM Cortex-M4 32-bit microcontroller runs entire RF stacks and has sufficient resources available to run user applications.
PAGE 4
Technical Specifications CORE COMPONENTS LoRa® Transceiver Semtech SX1261 Microcontroller Maxim MAX32625IWYL+ Core Cortex-M4, 96 MHz Flash Memory 256 kB RAM 128 kB MECHANICAL SPECIFICATIONS Weight 1.3 g Dimensions 8.5 x 9.3 x 1.8 mm OPERATING CONDITIONS Temperature -40 – 85 °C Humidity 0 – 95% RH, non-condensing ABSOLUTE MAXIMUM RATINGS Parameter Min Max Unit Ext. main supply voltage (VDD_1V8) -0.3 1.89 V Ext. I/O supply voltage (VDD_IO) -0.3 3.
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OPERATING CONDITIONS Parameter Min Typ Max Unit Standard operating voltage main supply (VDD_1V8) 1.8 1.8 1.89 V Standard operating voltage for I/O (VDD_IO) 1.8 1.8 1.89 V Digital IO pin input / output voltage see datasheet of MAX32625 Current consumption, TX mode (+10 dBm) 15 mA Current consumption, TX mode (+14 dBm) 35 mA Current consumption, RX mode 4.2 Current consumption, sleep mode 5.1 10.1 2.5 mA µA Highest receiver sensitivity -135 dBm RF output power 13.
PAGE 6
Pad MCU Pad MCU # name pad Description # name pad Description 1 GND GND Ground (VSS) 23 P3.6 P3.6 GPIO 2 ANT RF Out (50 Ohms) 24 SDA P3.4 I2C M 1A SDA 3 GND GND Ground (VSS) 25 SCL P3.5 I2C M 1A SCL 4 GND GND Ground (VSS) 26 P3.2 P3.2 GPIO 5 P0.2 P0.2 GPIO 27 P2.2 P2.2 GPIO 6 AIN0 AIN0 Analog In 0 28 P2.3 P2.3 GPIO 7 AIN1 AIN1 Analog In 1 29 P2.1 P2.1 GPIO 8 AIN3 AIN3 Analog In 3 30 CS P2.7 SPI CS 9 U2ATX P3.
PAGE 7
Module Footprint Figure 3: FMLR-6X-P-MA62X Footprint (Bottom View) FMLR FOOTPRINT DIMENSIONS Dimension (see Figure 3: FMLR-6X-P-MA62X Footprint) Min Typ D 8.5 E 9.3 D1 7.4 E1 8.2 e 0.7 b 0.4 L 0.7 d1 2.05 e1 2.
PAGE 8
Tape Information All dimensions in mm FMLR-6X-P-MA62X Maxim SX1261 8/13
PAGE 9
Recommended Soldering Conditions The following graph shows a typical temperature profile for the module soldering process. The exact values to be used in production is highly depending on other parameters of the soldering process, such as soldering paste, PCB design, soldering process, etc. Reflow process should be finished within 1 cycle.
PAGE 10
Device Options n n n FMLR-61-P-MA626 n n n n SX1262 n SX1261 FMLR-61-P-MA625 4Mbit Flash 20 kB RAM RF 256 kB flash MCU OPTIONS Cortex-M4+ PRODUCT ID FMLR-62-P-MA625 n FMLR-62-P-MA626 n Options for other MAX3262x variants are available on request.
PAGE 11
Additional Documentation FCC CAUTION: Antenna Manufacturer: Molex Antenna Model： 1052620001 Antenna type: External Antenna gain: 2 dBi Host product manufacturers that they need to provide a physical or e-label stating, “Contains FCC ID: 2AUQEF64CH” with their finished product. Only those antennas with same type and lesser gain filed under this FCC ID can be used with this device.
PAGE 12
FCC RF RADIATION EXPOSURE STATEMENT: 1. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 2. This equipment complies with RF radiation exposure limits set forth for an uncontrolled environment. 3.This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.
PAGE 13
Keep in touch Miromico AG Gallusstrasse 4 CH-8006 Zürich Switzerland info@miromico.ch www.miromico.ch https://forum.miromico.ch DISCLAIMER We reserve the right to make technical changes, which serve to improve the product, without prior notification.