ZigBee Module Instruction manual Version: 20220918 Online Version
Contents Contents 1 Overview 2 1.1 Features ................................................................................................2 1.2 Applications ....................................................................................... 2 1.3 Change history ................................................................................... 2 2 Module interfaces 4 2.1 Dimensions and package .................................................................... 4 2.2 Pin definition..................
Contents ZTU-ZB01 is a Zigbee module that Milfra has developed. It consists of a highly integrated RF chip (RT582), and a few peripherals. ZTU-ZB01 is embedded with ARM® Cortex® -M3 CPU, internal MCU for MAC, Boot ROM, 208KB SRAM total (CPU + MCU), and rich peripheral resources.
1 Overview 1 Overview Based on ZTU-ZB01, you can develop Zigbee products as required. 1.1 Features • • • • Embedded with a low-power 32-bit CPU processor The maximum clock rate: 48 MHz Wide operating voltage: 1.8 to 3.6 V (2.8V or higher is recommended) Peripherals: 17 general-purpose input/output (GPIO), 3 universal asynchronous receiver/transmitter (UART), and 4 analog-to-digital converters (ADC) • Zigbee connectivity – Support 802.15.4 MAC/PHY – Working channels 11 to 26 @2.400 to 2.
2 Module interfaces 2 Module interfaces 2.1 Dimensions and package ZTU-ZB01 has 3 rows of pins with a 1.4± 0.1 mm pin spacing. The ZTU-ZB01 dimensions are 20.3± 0.35 mm (L)× 15.8± 0.35 mm (W) × 3± 0.15 mm (H).
2 Module interfaces 2.
2 Module interfaces Pin number Symbol I/O type Functio 2 D7 I/O Common I/O pin, which corresponds to D7 (Pin 7) of IC 3 C0 I/O Common I/O pin, which corresponds to C0 (Pin 31) of IC 4 SWS I/O Burning pin, which corresponds to SWS (Pin 30) of IC 5 B6 I/O ADC pin, which corresponds to B6 (Pin 28) of IC 6 A0 I/O Common I/O pin, which corresponds to A0 (Pin 29) of IC 7 A1 I/O Common I/O pin, which corresponds to A1 (Pin 23) of IC 8 C2 I/O Support hardware PWM and correspond to C2
2 Module interfaces Pin number Symbol I/O type Function 11 B4 I/O Support hardware PWM and correspond to B4 (Pin 9) on the internal IC 12 B5 I/O Support hardware PWM and correspond to B5 (Pin 8) on the internal IC 13 GND P Power supply reference ground 14 VCC P Power supply pin (3.
2 Module interfaces Note: P indicates a power supply pin and I/O indicates an input/output pin.
3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ta Operating temperature -40 105 °C VBAT Power supply voltage 1.8 (2.8V or higher is recommended) 3.6 V ESD voltage (human body model) TAMB-25°C - 2 KV ESD voltage (machine model) TAMB-25°C - 0.2 KV 3.
3 Electrical parameters Minimum value Typical value Maximum value Unit Parameter Description VIH I/O high-level input VDD*0.7 - - V VOL I/O low-level output - - VDD*0.2 V VOH I/O high-level output VDD*0.8 - - V 3.3 TX and RX power consumption Peak value (Typical value) Unit Working status Mode Rate Transmit power/receive Transmit - 250Kbps +0 dBm 15 mA Transmit - 250Kbps +10 dBm 25 mA Receive - 250Kbps Constantly receive 11 mA 3.
3 Electrical parameters Working status, Ta = 25°C Maximum value (Typical value) Unit Quick network connection state The module is in the fast network connection state 20 mA Network connection state The module is connected to the network 19 mA Deep sleep mode Deep sleep mode, reserve 32-KB SRAM 4.
4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.405 to 2.480 GHz Zigbee standard IEEE 802.15.4 Data transmission rate 250 Kbps Antenna type PCB antenna with a gain of 1.0 dBi, IPEX optional 4.
4 RF parameters 4.
5 Requirements on power-on sequence 5 Requirements on power-on sequence The Z2 chip has requirements on the power-on sequence. During the power-on process, the system starts when the RST pin reaches 1.62V. At this time, the VCC needs to reach more than 1.8V within 10ms. Because the RST pin has the RC link, the VCC of the bare module is much more than 1.8V when the RST reaches 1.62V.
5 Requirements on power-on sequence below 0.6V, the module will probably crash when it is restarted. It is required that the power supply pin VCC_3.3V of the module needs to be connected with a dummy load of 1K to release power quickly. You can refer to the following figure which shows parts of power-driven links.
6 Antenna 6 Antenna 6.1 Antenna type ZTU-ZB01 uses only the onboard PCB antenna. The ZTU-ZB01-IPEX module can use the IPEX antenna. 6.2 Antenna interference reduction To ensure the optimal Zigbee performance when the Zigbee module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.
7 Packaging information and production instructions 7 Packaging information and production instructions 7.1 Mechanical dimensions The PCB dimensions are 20.3± 0.35 mm (L)× 15.8± 0.35 mm (W) × 1± 0.1 mm (H).
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7 Packaging information and production instructions 7.4 Diagram of PCB footprint Diagram of PCB footprint-SMT: Please contact our sales staff to obtain the package file. 7.5 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT.
7 Packaging information and production instructions needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
7 Packaging information and production instructions • The total exposure time has lasted for over 168 hours since unpacking. • More than 12 months have passed since the sealing of the bag. 4.
7 Packaging information and production instructions • A: Temperature axis • B: Time axis • C: Liquidus temperature: 217 to 220°C • D: Ramp-up slope: 1 to 3°C/s • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C • F: Duration above the liquidus: 50 to 70s • G: Peak temperature: 235 to 245°C • H: Ramp-down slope: 1 to 4°C/s Note: The above curve is just an example of the solder paste SAC305.
7 Packaging information and production instructions Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 °C Soldering temperature 360± 20°C Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260± 5°C NA NA Ramp-down slope ≤6°C/s NA NA 24 / 30
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8 MOQ and packaging information 8 MOQ and packaging information Product model MOQ (pcs) Shipping packaging method ZTU-ZB01 4400 Tape reel 26 / 30 The number of modules per reel The number of reels per carton 1100 4
9 Appendix: Statement 9 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
9 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
9 Appendix: Statement Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.
9 Appendix: Statement module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is a single module. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces.
9 Appendix: Statement 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific “antenna type”)).
9 Appendix: Statement Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.
9 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
