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Table Of Contents

MRF89XAM9A

Data Sheet

915 MHz Ultra Low-Power Sub-GHz

Transceiver Module

Summary of content (34 pages)

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Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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MRF89XAM9A 915 MHz Ultra Low-Power Sub-GHz Transceiver Module Features RF/Analog Features • Module designed from the MRF89XA Integrated Ultra Low-Power, Sub-GHz Transceiver IC. • Supports MiWi™ Development Environment Proprietary Wireless Networking Protocols • 4-Wire Serial Peripheral Interface (SPI) with Interrupts • Small Size: 0.7" x 1.1" (17.8 mm x 27.
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MRF89XAM9A Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 3 2.0 Circuit Description ........................................................................................................................................................................ 9 3.0 Regulatory Approval .......................................................................
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MRF89XAM9A 1.0 DEVICE OVERVIEW 1.1 The simplified block diagram of the MRF89XAM9A module is shown in Figure 1-1. The module is based on the Microchip Technology MRF89XA Ultra Low-Power Sub-GHz Transceiver Integrated Circuit (IC). The module interfaces to many popular Microchip PIC® microcontrollers through a 3-wire serial SPI interface, two chip selects (Configuration and Data), two interrupts — Interrupt Request 0 (IRQ0) and Interrupt Request 1 (IRQ1), Reset, Power and Ground as shown in Figure 1-2.
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MRF89XAM9A TABLE 1-1: PIN DESCRIPTION Pin Symbol Type Description 1 GND Power Ground 2 RESET DI Reset Pin 3 CSCON DI Serial Interface Configure Chip Select 4 IRQ0 DO Interrupt Request Output 5 SDI DI Serial Interface Data Input 6 SCK DI Serial Interface Clock 7 SDO DO Serial Interface Data Output 8 CSDATA DI Serial Interface Data Chip Select 9 IRQ1 DO Interrupt Request Output 10 Vin Power Power Supply 11 GND Power Ground 12 GND Power Ground FIGURE 1-2:
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MRF89XAM9A 1.2 Mounting Details The MRF89XAM9A is a surface mountable module. Module dimensions are shown in Figure 1-3. The module PCB is 0.032" thick with castellated mounting holes on the edge. Figure 1-4 is the recommended host PCB footprint for the MRF89XAM9A. The MRF89XAM9A has an integrated PCB antenna. For the best performance, follow the mounting details shown in Figure 1-5. It is recommended that the module be mounted on the edge of the host PCB and an area around the antenna, approximately 3.
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MRF89XAM9A FIGURE 1-5: MOUNTING DETAILS Keep area around antenna (approximately 3.4 (6.8 cm) inches) clear of metallic structures for best performance 3.4” Edge of PCB 3.4” 0.470” 0.4” 0.4” Host PCB Top Copper Ground Plane (Antenna Counterpoise): Extend the host PCB top copper ground plane under and to the left and right side of the module at least 0.4 inches (1 cm) for best antenna performance. DS00000A-page 6 Preliminary © 2011 Microchip Technology Inc.
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MRF89XAM9A 1.3 1.3.2 Operation The MRF89XAM9A module is based on the Microchip Technology MRF89XA Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver IC. Data communication and module configuration are documented in the “MRF89XA Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver Data Sheet” (DS70622). This section emphasizes operational settings that are unique to the MRF89XAM9A module design that must be followed for proper operation. 1.3.
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MRF89XAM9A 2.0 CIRCUIT DESCRIPTION 2.1 Module Schematic The MRF89XAM9A module is based on the Microchip Technology MRF89XA Ultra Low-Power, Integrated ISM Band sub-GHz Transceiver IC. The serial I/O (CSCON, CSDATA, SCK, SDO and SDI), RESET, IRQ0 and IRQ1 pins are brought out to the module pins. Crystal X1 is a 12.8 MHz crystal with a frequency tolerance of ±10 ppm at 25°C. The RFIO output is matched to the SAW filter FL1 and further matched to the PCB trace antenna.
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MRF89XAM9A DS00000A-page 10 Preliminary Designators not used: C6, L5 Note: MRF89XAM9A SCHEMATIC FIGURE 2-2: © 2011 Microchip Technology Inc.
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MRF89XAM9A TABLE 2-1: MRF89XAM9A BILL OF MATERIALS Desi gnat or Value Description Manufacturer Part Number C1 0.047 µF Capacitor, Ceramic, 10V, ±10%, X7R, SMT 0402 Murata GRM155R71A473KA01D C2 0.22 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT 0402 Murata GRM155R71C224KA12D C3 1 µF Capacitor, Ceramic, 6.3V, ±10%, X5R, SMT 0603 Murata GRM188R60J105KA01D C4 30 pF Capacitor, Ceramic, 50V, ±5%, UHI-Q NP0, SMT 0402 Johanson Technology 250R07S300JV4T C5 1.
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MRF89XAM9A 2.2 Printed Circuit Board FIGURE 2-5: LAYER 2 — GROUND PLANE FIGURE 2-6: LAYER 3 — POWER PLANE The MRF89XAM9A module PCB is constructed with high temperature FR4 material, four layers and 0.032 inches thick. The layers are shown in Figure 2-3 through Figure 2-8. The stack up of the PCB is shown in Figure 2-9 FIGURE 2-3: FIGURE 2-4: TOP SILK SCREEN TOP COPPER © 2011 Microchip Technology Inc.
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MRF89XAM9A FIGURE 2-7: BOTTOM COPPER FIGURE 2-9: PCB LAYER STACK UP FIGURE 2-8: 1/2 oz. Copper BOTTOM SILK SCREEN Top Copper 8 mil FR4 1/2 oz. Copper Ground Plane 0.032” ±0.005” 12 mil FR4 1/2 oz. Copper Power Plane 8 mil FR4 1/2 oz. Copper © 2011 Microchip Technology Inc.
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MRF89XAM9A 2.3 PCB Antenna FIGURE 2-10: The PCB antenna is fabricated on the top copper trace. Figure 2-11 shows the trace dimensions. The layers below the antenna have no copper traces. The ground and power planes under the components serve as a counterpoise to the PCB antenna. Additional ground plane on the host PCB will substantially enhance the performance of the module. For best performance, place the module on the host PCB by following the recommendations in Section 1.2, Mounting Details. 16.
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MRF89XAM9A FIGURE 2-12: SIMULATED 2D RADIATION PATTERN FIGURE 2-13: SIMULATED 3D RADIATION PATTERN © 2011 Microchip Technology Inc.
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MRF89XAM9A FIGURE 2-14: SIMULATED PCB ANTENNA IMPEDANCE FIGURE 2-15: SIMULATED PCB ANTENNA VSWR © 2011 Microchip Technology Inc.
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MRF89XAM9A 3.0 REGULATORY APPROVAL The MRF89XAM9A module has received regulatory approvals for modular devices in the United States and Canada. Modular approval allows the end user to place the MRF89XAM9A module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment.
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MRF89XAM9A 3.1.1.2 OOK Modulation The following settings configure the MRF89XAM9A for narrowband operation that conform to the requirements of Part 15.249. Part 15.249 requires a much lower power setting than is allowed in Part 15.247.
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MRF89XAM9A 3.2 3.2.1 Canada The MRF89XAM9A module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The host device shall be properly labeled to identify the module within the host device.
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MRF89XAM9A 4.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Ambient temperature under bias.............................................................................................................. -40°C to +85°C Storage temperature .............................................................................................................................. -55°C to +125°C Voltage on VIN with respect to VSS .........................................................................................
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MRF89XAM9A TABLE 4-1: RECOMMENDED OPERATING CONDITIONS Parameter Min Typ Max Unit Condition Ambient Operating Temperature -40 — +85 °C — Supply Voltage for RF, Analog and Digital Circuits 2.1 — 3.6 V — Supply Voltage for Digital I/O 2.1 — 3.6 V — Input High Voltage (VIH) 0.5 * VIN — VIN + 0.3 V — Input Low Voltage (VIL) -0.3V — 0.2 * VIN V — — VIN + 1.5 V — AC Peak Voltage on Open Collector Outputs (IO)(1) VIN – 1.5 Note 1: At minimum, VIN – 1.
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MRF89XAM9A TABLE 4-4: Symbol PLL PARAMETERS AC CHARACTERISTICS(1) Parameter Min Typ Max Unit Condition Frequency Ranges 902 — 928 MHz — BRFSK Bit Rate (FSK) 1.56 — 40 kbps NRZ BROOK Bit Rate (OOK) 1.56 — 16 kbps NRZ FDFSK Frequency Deviation (FSK) 33 50 200 kHz — FXTAL Crystal Oscillator Frequency 9 12.8 — MHz — FSSTP Frequency Synthesizer Step — 2 — kHz Variable, depending on the frequency TSOSC Oscillator Wake-up Time — 1.
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MRF89XAM9A RECEIVER AC CHARACTERISTICS(1) TABLE 4-5: Symbol RSF RSO Parameter Min Typ Max Unit Condition Sensitivity (FSK) — -107 — dBm 915 MHz, BR = 25 kbps, fdev = 50 kHz, fc = 100 kHz — -103 — dBm 915 MHz, BR = 66.7 kbps, fdev = 100 kHz, fc = 200 kHz — -113 — dBm 915 MHz, 2 kbps NRZ fc – fo = 50 kHz, fo = 50 kHz — -106 — dBm 915 MHz, 16.
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MRF89XAM9A TABLE 4-6: Symbol RFOP TRANSMITTER AC CHARACTERISTICS(1) Description Min Typ Max Unit Condition RF Output Power, Programmable with 8 Steps of typ. 3 dB — +12.5 — dBm Maximum power setting — -8.
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MRF89XAM9A APPENDIX A: REVISION HISTORY Revision A (May 2011) This is the Initial release of the document. © 2011 Microchip Technology Inc.
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MRF89XAM9A THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
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MRF89XAM9A READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
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MRF89XAM9A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. PART NO Device M X Module Module Type T Example: -X Tape and Temperature Reel Range Device MRF89XAM9A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver module Temperature Range I a) MRF89XAM9A-I/RM: Industrial temperature tray.
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