BM78SPPS5MC2,RN4678 Bluetooth® 4.0 Dual mode Module • Features: Bluetooth Classic (BR/EDR) and Low Energy (LE) Complete , Fully Certified, Embedded 2.4 GHz Bluetooth® Version 4.0 IC Bluetooth SIG Certified Transparent UART mode for seamless serial data over UART interface Easy to configure with Windows GUI or direct by MCU Firmware can be field upgradable via UART Compact surface mount module: 22 x 12 x 2.
Delivering local connectivity for the Internet of Things (IoT), the IC bridges your product to Smart Phones and Tablets for convenient data transfer, control and access to cloud applications. It supports GAP, SDP, SPP, and GATT profiles. Data is transferred over the Bluetooth link by sending/receiving data via transparent UART mode, making it easy to integrate with any processor or Microcontroller with a UART interface.
BM78SPPS5MC2 , RN4678 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced.
BM78SPPS5MC2 , RN4678 1.0 DEVICE OVERVIEW The BM78 is a complete, fully certified, embedded 2.4 GHz Bluetooth® version 4.0 (BR/EDR/LE) wireless IC. It incorporates an on-board Bluetooth stack, cryptographic accelerator, power management subsystem, 2.4 GHz transceiver, and RF power amplifier (see Figure 1). With the BM78, designers can embed Bluetooth functionality rapidly into virtually any device. • • • • • The BM78 provides cost and time-to-market savings as a self-contained Bluetooth solution.
BM78SPPS5MC2 , RN4678 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 FIGURE 1‐2: BM78SPPS5NC2 PIN DIAGRAM FIGURE 1‐3: BM78SPP05NC2 PIN DIAGRAM 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 TABLE 1‐1: PIN DESCRIPTION S5 03 Symbol pin pin 1 -GND 2 -GND 3 1 GND 4 2 BAT_IN Type Description Power Power Power Power Ground reference Ground reference Ground reference Battery Input. Main positive supply input. Connect to 10uF (X5R/X7R) capacitor. Software Button H: Power On / L: Power Off Internal 3.3V LDO regulator output. Connect to 10uF (X5R/X7R) capacitor. I/O positive supply input. Ensure VDD_IO and MCU I/O voltages are compatible. Internal 1.8V LDO regulator output.
BM78SPPS5MC2 , RN4678 26 24 P3_3 DIO Configurable Control or Indication pin (when configured as input: internal pull-up) 27 25 P3_4 DIO Configurable Control or Indication pin (when configured as input: internal pull-up) 28 26 P3_6 DIO (Do Not Connect) 29 27 P3_7 DIO Configurable Control or Indication pin (when configured as input: internal pull-up) 30 28 LED1 DO Status LED 31 29 GND Power Ground reference -30 BT_RF AIO External antenna connection (50 ohm) 32 -GND Power Ground reference 33 -GND Power Gro
BM78SPPS5MC2 , RN4678 1.1 Power Tree Figures 2-1 : Power Tree 1.2 UART Interface Figures 2-2 : Power and MCU interface examples. Figure 2‐2 shows an example power scheme using a 3.3 volt to MCU VDD. Battery power is applied to BAT_IN pin. From the LDO33_O pin, voltage can be routed the VDD_IO pin and external circuitry including the MCU. This power scheme ensures that BM78 and MCU I/O voltages are compatible. CAUTION: The internal 3.
BM78SPPS5MC2 , RN4678 2.0 Bluetooth behavior auto/manual pattern configuration Power ON Auto Pattern Setting Enabled Disabled Configure Mode Manual Pattern Auto Pattern 2.1 auto pattern 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 Configure mode Access State Standby mode Link back mode Pairing Procedure Link state Connected mode Shutdown state Shutdown mode 2.2 Manual pattern 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 2.3 UI setting NOTE: Please reference “Application Note_IS1678S_Draft.docx” and “IS1678S Command Set v0 97 20140924.docx.” 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 3.0 Control and Indication I/O Pins I/O pins P0_0, P0_5, P1_7, P3_1, P3_2, P3_3, P3_4 and P3_7 are configurable control and indication I/O. Control signals are input to the BM78. Indication signals are output from the BM78. Table 4‐1 shows configurable I/O pin assignment to control and indication signals. Note: that RTS can only be assigned to P0_0 and CTS is assigned to P1_7. Configuring the BM78 can reference the “Application Note_IS1678S_Draft.
BM78SPPS5MC2 , RN4678 3.1 UI setting 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 4.0 Status Indication I/O Pins I/O pins P1_5 and P0_4 are Status Indicator 1 and 2 signals respectively. Together they provide status indication to the MCU as shown in Table 4‐1. TABLE 4‐1: STATUS INDICATION P1_5 P0_4 /STATUS_IND_1 /STATUS_IND_2 H H H L L H L L Indication Power-on to setting default and Shutdown State. HH status should be stable for at least 500ms Access state Link state (UART data between being and stop transmitted) Link state (UART data stop transmitted) 4.
BM78SPPS5MC2 , RN4678 5.0 Software Button (SW_BTN) The Software Button (SW_BTN) input pin powers the BM78 on (high) or off (low) in to S4 mode. Figures 5‐1 : SW_BTN Time (high) @APP mode Note: A. P0_4/P1_5 state: Refer to table5-1 B. Reset is floating. Figures 5‐2 : SW_BTN Time (low) at access states. Note: A. SW_BTN pull low can’t active on Shutdown State. B. Reset is floating. Figures 5‐3 : SW_BTN Time (low) at link states. 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 Note: C. *1: this time by iPhone LE mode disconnect time. D. SW_BTN pull low can’t active on Shutdown State. E. Reset is floating. 6.0 WAKE UP The Wake Up input pin wakes the BM78 from shutdown mode (active low). Figures 6‐1 : WAKE_UP Time at Shutdown State. 7.0 EXTERNAL RESET A watchdog timer capable of reset the chip. It has an integrated Power-On Reset (POR) circuit that resets all circuits to a known power-on state.
BM78SPPS5MC2 , RN4678 Note: a. Auto pattern can use external reset. b. Manual pattern can use external reset and reset command. 8.0 LED DRIVER There are one dedicate LED drivers to control the LEDs. The LED can be connected directly with BM78. The LED max current is 4 mA and it has 16 steps to trim Brightness. LDO33_O LED1 BM78 The status LED (LED1) indicates: Standby Link Back Low Battery Inquiry Link Page Each indication is a configurable flashing sequence.
BM78SPPS5MC2 , RN4678 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 10.0 Throughput The BM78 UART pins TXD and RXD connect to the UART pins of the host MCU. It is highly recommended to use hardware flow control pins RTS and CTS. The BM78 hardware flow control is disabled by default and must be configured to enable. The UART Baud is configurable. The available signal rates are listed in Table 10‐1. TABLE 10‐1: UART BAUD Baud Crystal Frequency (MHz) Actual Baud Error Rate (%) 921600 460800 16 16 941176 457143 2.12 -0.79 307200 16 307692 0.
BM78SPPS5MC2 , RN4678 BR/EDR mode 115200 bps Normal Throughput(byte/s) LE mode 115200 bps Normal Throughput(byte/s) LE mode 921600 bps Normal Throughput(byte/s) 2015 Microchip Technology Inc. Android Samsung Note3/Android 4.3 echo Tx echo Rx Tx Rx 11312.2 10548.5 9842.5 11436.4 iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)} RX Rx TX (response) (Reliable Burst Transmit) 7935.2 3337.3 7082.1 iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)} RX Rx TX (response) (Reliable Burst Transmit) 8063.
BM78SPPS5MC2 , RN4678 11.0 Mounting Details The BM78 SPPS5NC2 physical dimensions are shown in Figure 11-1, recommended host PCB footprint in Figure 11-2, and mounting suggestion in Figure 11-3. There should not be top copper layer near the test pin area shown in Figure 11-2. When laying out the host PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in Figure 11-3. A low-impedance ground plane will ensure best radio performance (best range, lowest noise).
BM78SPPS5MC2 , RN4678 FIGURE 11‐1: BM78SPPS5NCS MODULE DIMENSIONS FIGURE 11‐2: BM78SPPS5NC2 RECOMMEDED PCB FOOTPRINT 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 FIGURE 11‐3: BM78SPPS5NCS HOST PCB MOUNTING SUGGESTION >4.7mm Top and Bottom Copper layer keep out area >6.4mm Edge of host PCB Top Copper Layer Bottom Copper Layer 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 FIGURE 11‐4: BM78SPP05NCS MODULE DIMENSIONS FIGURE 11‐5: BM78SPP05NC2 RECOMMEDED PCB FOOTPRINT 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 FIGURE 11‐6: BM78SPP05NCS HOST PCB MOUNTING SUGGESTION Top Copper Layer Bottom Copper Layer 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 12.0 ANTENNA PLACEMENT RULE For Bluetooth product, antenna placement will affect whole system performance. Antenna need free space to transmit RF signal, it can’t be surround by GND plane. Here are some examples of good and poor placement on a Main Application board with GND plane. FIGURE 12-1: KEEP OUT AREA SUGGESTION FOR ANTENNA For more detail free space of antenna placement design, you can reference the design rule of antenna produce vendor. 2015 Microchip Technology Inc.
BM78SPPS5MC2 , RN4678 12-2 BM78SPPS5NC2 Ceramic Chip Antenna The BM78SPPS5NC2 module contains an integral ceramic chip antenna. The antenna performance on the module is shown in Figure 12-2. FIGURE 12‐2: BM78SPPS5NC2 ANTENNA RADIATION PATTERN Gain (dBi) 5.0 0.0 Y-ax is x is X-a -5.0 Z-axis -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 Frequency Max Gain Efficiency 2015 Microchip Technology Inc. 2450 MHz 1.63 dBi 71.
13.0 Electrical Characteristics Recommended Operating Conditions Rating Min Typ Max Storage temperature range -65ºC +25ºC +150ºC Ambient Operating temperature range -20ºC +25ºC +70ºC Relative Humidity (Operating) 10% 90% Relative Humidity (Storage) 10% 90% HBM ±2KV MM 200V ESD HTOL (*1) 1000 hrs Supply voltage : BAT_IN 3.2V 4.3V SW_BTN 1.7V 4.3V LED1 3.6V Reset VTH,res threshold voltage 1.6V IOH 12mA IOL 12mA VIL input logic levels low -0.3V 0.
1.8V LDO (*1)(*2) Min Operation Temperature -20 (*3) Input Voltage (Vin) 2.0 Output Current (VIN=3.0v/load regulation with 80mV drop) Quiescent Current (Vin <3.0V) Typ Max 70 3.6 Unit ℃ V 100 mA 13 uA 1) With 1uF capacitors at LDO18_O as the condition of IP verification. 2) Output voltage can calibration by MP tool 3.3V LDO (*1)(*2) Min Operation Temperature -20 Input Voltage (Vin) 3.2 Output Current (VIN=3.6v / load regulation with 100mV drop) Quiescent Current(VIN=3.6v) Typ Max 70 4.
Operating Current (including bandgap) Shutdown Current 1 1 mA uA 1) SAR_BAT is shorted to BAT_IN internally for battery voltage detection. Intensity controllable LED driver Operation Temperature Open-drain Voltage Current Step Programmable Current Range Intensity control Power down open-drain current Shutdown Current Min -20 Typ Max 70 3.6 0.
14.0 Radio Characteristics: Transmitter Performance (25℃ ℃) Min BDR power EDR power LE power Typ Max 2 0 2 Bluetooth specification -6 ~ +4 -6 ~ +4 -20 ~ +10 Unit dBm NOTE: 1) The RF Transmit power calibrated during production using MP Tool software and MT8852 Bluetooth Test equipment. 2) Test condition: VCC_RF= 1.80V, temperature=25 ºC.
15.0 System Current Consumption SUPPLY CONSUMPTION – CLASSIC (1) Parameter Standby mode Current (avg.) Units : mA Current2.543 shutdown mode 0.187 Connected + Sniff, Master (no data) 0.541 Connected + Sniff, Slave (no data) 0.551 Data, Master 10.67 Data, Slave 14.
3 G G G 33 32 GND BAT_IN SW_BTN LDO33_0 VDD_IO BAT_IN C1 10u/16V LDO33_O WAKEUP BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P0_4 P1_5 P12 / SCL P13 / SDA GND LED1 P3_7 P3_6 P3_4 P3_3 P3_2 P3_1 HCI_TXD HCI_RXD 31 30 29 28 27 26 25 24 23 22 2 P3_7 P3_6 P3_4 P3_3 P3_2 P3_1 UART_TXD UART_RXD 1 Reset for I2C IC LDO33_O LED1 LED-B P0_4 P1_5 1 Status_IND 1 MCU P0_0 P1_7 1 UART CTS / RTS 15 16 17 18 19 20 21 P1_7 P0_5 P0_0 P2_0 P2_4 EAN RST_N P0_4 P1_5 P1_2 P1_3 Functional GPIO
1.0 REGULATORY APPROVAL This section outlines the regulatory information for the BM78SSPS5MC2 module for the following countries: • United States • Canada • Europe • Australia • Japan • Korea • Taiwan • China 1.2 United States The BM78SSPS5MC2 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212 Modular Transmitter approval.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
1.3 Canada The BM78SPPS5MC2 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. 1.3.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The host device shall be properly labeled to identify the module within the host device.
1.3.2 RF EXPOSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). (Get direct quote from Certificate and place here) 1.3.3 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ 1.
EMC Radio Notified Body Opinion EN 301 489-1 V1.8.1 (2008-04) EN 301 489-17 V2.1.1 (2009-05) EN 300 328 V1.7.1 (2006-10) 1.4.3 (3.1(b)) (3.2) HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/.
• testing. The integrator should contact their conformance laboratory to determine if this testing is required. There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html 1.6.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM78 module must follow Japan marking requirements.
1.8.1 LABELING AND USER INFORMATION REQUIREMENTS The BM77 module is labeled with its own NCC mark and certificate number as below: (Number) The user’s manual should contain below warning (for RF device) in traditional Chinese: 注意 ! 依據 低功率電波輻射性電機管理辦法 第十二條 經型式認證合格之低功率射頻電機，非經許可， 公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計 之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信； 經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性 電機設備之干擾。 1.8.
FIGURE 20-1: Reflow Profile Standard : IPC/JEDEC J-STD-020 Condition : Preheat：150~200℃、60~120 seconds Average ramp-up rate (217℃ to peak): 3℃/sec max. Temperature maintained above 217℃ : 60~150 seconds Time within 5℃ of peak temperature: 30 ~ 40 seconds. Peak temperature：260 +5/-0 ℃ Ramp-down rate (peak to 217℃) : 6℃/sec. max. Time 25℃ to peak temperature : 8 minutes max.
Soldering Recommendations Stereo module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The module can be soldered to the main PCB using standard leaded and lead-free solder reflow profiles.
A.3.3 HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70‐03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are: • Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.
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