Datasheet of Bluetooth BM77SPPS5MC2 Module ISSC Technologies Corp. Revision History Date Revision Content Version 2013/07/03 First Version 1.0 2013/07/09 Add descriptions in current consumption part 1.1 2013/08/20 Update UART baud rate information 1.2 2013/10/01 Update current consumption & Timing Sequence photo 1.
Content 1. Introduction ..................................................................................................................... 3 1.1. Major Components ................................................................................................................................ 3 1.2. Features ............................................................................................................................................... 3 1.3. Application ................................
1. Introduction Part Name: ISSC BM77SPPS5MC2 Bluetooth module Part Number: BM77SPPS5MC2-xxxxxx The ISSC BM77SPPS5MC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for iPad logos) and Bluetooth standard SPP/ BLE electronic accessories via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0/ 4.0 + EDR.
2. Product Specification 2.1. Chipset 2 6x6 mm 40 pin QFN IS1677NM 2.2. Interfaces - Multi function GPIO interface - Bluetooth RF interface - UART up to 921600 bps - I2C for external EEPROM and authentication chip CONFIDENTIAL © 2000~2012 iSSC Technologies Corp.
3. Hardware Architecture Block Diagram Power Tree 4. Compatibility Requirements The BM77SPPS5MC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility and reliability, and software compatibility test. CONFIDENTIAL © 2000~2012 iSSC Technologies Corp.
5. Environmental Requirements 5.1. Temperature Conditions Operating Temperature Non-Operating Temperature Minimum -10 ℃ -40℃ Maximum +70 ℃ +85 ℃ Conditions Operating Humidity Non-Operating Humidity Minimum 10% 5% Maximum 90% 95% 5.2. Humidity CONFIDENTIAL © 2000~2012 iSSC Technologies Corp.
Appendix A: Dimension and Foot Print 1. Dimension - Dimension: 22 mm* 12 mm* 1.86 mm (Length* Width* Height) - Tolerance: +/- 0.25 mm 2. Suggested Load Board Foot Print Appendix B: Product Image Appendix C: Reflow Profile 1.) Follow: IPC/JEDEC J-STD-020 C 2.) Condition: CONFIDENTIAL © 2000~2012 iSSC Technologies Corp.
Average ramp-up rate (217℃ to peak): 1~2℃/sec max. Preheat：150~200C、60~180 seconds Temperature maintained above 217℃ : 60~150 seconds Time within 5℃ of actual peak temperature: 20 ~ 40 sec. Peak temperature：250+0/-5℃ or 260+0/-5℃ Ramp-down rate : 3℃/sec. max. Time 25℃ to peak temperature : 8 minutes max. Cycle interval：5 minus Slope: 1~2℃/ sec max. (217℃ to peak) Peak: 250+0/-5℃ Or 260+0/-5℃ Ramp down rate: Max. 3℃/sec. 217℃ Preheat: 150~200℃ 20~40 sec. 60~180 sec. 60~150 sec.
Appendix E: Reversion History Version Date History 0.2 2012/8/15 Modified support baud rate 0.3 2012/10/31 Modified the values of Calibration LDO18 Fixed for module schematic 0.4 2013/01/30 Modified Figure Error in page_15 1.0 2013/07/03 First Version 1.1 2013/07/09 Add descriptions in current consumption part 1.2 2013/08/20 Update UART Baud rate information 1.3 2013/10/01 Update current consumption & Timing Sequence photo CONFIDENTIAL © 2000~2012 iSSC Technologies Corp.
