BM62/64 Bluetooth® 4.2 Stereo Audio Module Features • Qualified for Bluetooth v4.2 specification • Supports A2DP 1.3, AVRCP 1.6, HFP 1.6, HSP 1.2 and SPP 1.2 • Supports Bluetooth 4.
BM62/64 Peripherals Description • Built-in lithium-ion and lithium-polymer battery charger (up to 350 mA) • Integrated 1.
BM62/64 Table of Contents 1.0 Device Overview ...................................................................................................................................................... 5 2.0 Audio...................................................................................................................................................................... 15 3.0 Transceiver ......................................................................................................................
BM62/64 NOTES: DS60001403C-Page 4 Preliminary 2017 Microchip Technology Inc.
BM62/64 1.0 DEVICE OVERVIEW Windows-based utility. The BM62 and BM64 Stereo Audio modules are built around Microchip Technology IS2062 and IS2064 SoCs. The IS2062/64 SoC integrates the Bluetooth 4.2 dualmode radio transceiver, Power Management Unit (PMU), a crystal and DSP. Users can configure the BM62/64 module by using the UI tool and DSP tool, a FIGURE 1-1: Note: The UI and DSP tools are available for download from the Microchip web site at: www.microchip.com/BM62 and www.microchip.com/BM64.
BM62/64 Figure 1-3 illustrates the Multi-speaker application using the BM64 module. FIGURE 1-3: DS60001403C-Page 6 MULTI-SPEAKER APPLICATION USING BM62/64 MODULE Preliminary 2017 Microchip Technology Inc.
BM62/64 Table 1-1 provides the key features of the BM62/64 module. TABLE 1-1: BM62/64 KEY FEATURES Feature BM62 CLASS 2 Application Stereo/mono Headset/Speaker Stereo Pin count 2 Dimensions (mm ) PCB antenna BM64 CLASS 2 BM64 CLASS 1 Multi-speaker/Soundbar Stereo Stereo 37 43 43 15 x 29 15 x 32 15 x 32 Yes Yes Yes Tx power (typical) 2 dBm 2 dBm 15 dBm Audio DAC output 2-channel 2-channel 2-channel DAC (single-ended) SNR at 2.8V (dB) -98 -98 -98 DAC (capless) SNR at 2.
BM62/64 Figure 1-4 illustrates the pin diagram of the BM62 module. FIGURE 1-4: DS60001403C-Page 8 BM62 MODULE PIN DIAGRAM Preliminary 2017 Microchip Technology Inc.
BM62/64 Table 1-2 provides the pin description of the BM62 module.
BM62/64 TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description 17 - NC 18 I/O P0_1 No connection 19 P VDD_IO I/O positive supply. Do not connect, for internal use only 20 P ADAP_IN 5V power adapter input, used to charge the battery in the Li-Ion battery power applications 21 P BAT_IN Power Supply input. Voltage range: 3.2V to 4.2V.
BM62/64 TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name 35 I/O P2_7 36 - NC 37 P GND 38 - NC No connection 39 - NC No connection 40 - NC No connection Legend: Note: I= Input pin O= Output pin Description Configurable control or indication pin (Internally pulled-up, if configured as an input) Volume-up key (default), active-low No connection Ground reference I/O= Input/Output pin P= Power pin All I/O pins can be configured using the UI tool, a Windo
BM62/64 Figure 1-5 illustrates the pin diagram of the BM64 module. FIGURE 1-5: DS60001403C-Page 12 BM64 MODULE PIN DIAGRAM Preliminary 2017 Microchip Technology Inc.
BM62/64 Table 1-3 provides the pin description of the BM64 Module.
BM62/64 TABLE 1-3: BM64 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name 29 I/O P3_7 30 I/O P3_5 31 I/O P0_0 Configurable control or indication pin (Internally pulled-up, if configured as an input) • Slide switch detector, active-high, Out_Ind_0 32 I EAN External address bus negative System configuration pin along with the P2_0 and P2_4 pins used to set the module in any one of these modes: • Application mode (for normal operation) • Test mode (to change EEPROM values) • Write F
BM62/64 2.0 AUDIO The input and output audios have different stages and each stage can be programmed to vary the gain response characteristics. For microphone, both single-ended inputs and differential inputs are supported. To maintain a high quality signal, a stable bias voltage source to the condenser microphone’s FET is provided. The DC blocking capacitors can be used at both positive and negative sides of a input. Internally, this analog signal is converted to 16-bit, 8/16 kHz linear PCM data. 2.
BM62/64 The DSP parameters can be configured using the DSP tool. For additional information on the DSP tool, refer to the “IS206X DSP Application Note”. Note: The DSP tool and “IS206X DSP Application Note” document, are available for download from the Microchip web site at: www.microchip.com/BM62 and www.microchip.com/BM64. 2.2 Codec The built-in codec has a high signal-to-noise ratio (SNR) performance and it consists of an ADC, a DAC and an additional analog circuitry.
BM62/64 FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE) FIGURE 2-6: CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE) Note: The DAC frequency response corresponds to single-ended mode with a 47 μF DC block capacitor. 2017 Microchip Technology Inc.
BM62/64 2.3 2.4 Auxiliary Port The BM62/64 module supports one analog (line-in) signal from the external audio source. The analog (line-in) signal can be processed by the DSP to generate different sound effects (Multi-band dynamic range compression and audio widening), which can be configured by using the DSP tool.
BM62/64 3.0 TRANSCEIVER The BM62/64 module is designed and optimized for Bluetooth 2.4 GHz system. It contains a complete radio frequency transmitter/receiver section. An internal synthesizer generates a stable clock for synchronizing with another device. 3.1 Transmitter The internal power amplifier (PA) has a maximum output power of +4 dBm. This is applied for Class 2 or Class 3 radios without an external RF PA. BDR, symbol 1 represents 1-bit.
BM62/64 NOTES: DS60001403C-Page 20 Preliminary 2017 Microchip Technology Inc.
BM62/64 4.0 POWER MANAGEMENT UNIT The on-chip Power Management Unit (PMU) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulator. A power switch is used to switch over the power source between the battery and an adapter. Also, the PMU provides current to drive two LEDs. 4.1 Charging a Battery The BM62/64 module has a built-in battery charger, which is optimized for lithium-ion and lithium-polymer batteries.
BM62/64 Figure 4-2 illustrates the LED drivers in the BM62/64 module. FIGURE 4-2: 4.4 LED DRIVER Under Voltage Protection When the voltage of the SYS_PWR pin drops below the voltage level of 2.9V, the system will shutdown automatically. 4.5 Ambient Detection The BM62/64 module has a built-in ADC for charger thermal protection. Figure 4-3 illustrates the suggested circuit and thermistor, Murata NCP15WF104F.
BM62/64 5.0 APPLICATION INFORMATION 5.1 Host MCU Interface The BM62/64 module supports UART commands. The UART commands enable an external MCU to control the BM62/64 module. Figure 5-1 illustrates the UART interface between the BM62/64 module and an external MCU. FIGURE 5-1: HOST MCU INTERFACE OVER UART An external MCU can control the BM62/64 module over the UART interface and wakeup the module with the MFB, P0_0 (BM62) and P3_7 (BM64) pins.
FIGURE 5-2: POWER-ON/OFF SEQUENCE BM62/64 DS60001403C-Page 24 Figure 5-2 through Figure 5-7 illustrate the timing sequences of various UART control signals. Preliminary 2017 Microchip Technology Inc.
BM62/64 FIGURE 5-3: TIMING SEQUENCE OF RX INDICATION AFTER POWER-ON STATE FIGURE 5-4: TIMING SEQUENCE OF POWER-OFF STATE Note 1: EEPROM clock = 100 kHz. 2: For a byte write: 0.01 ms x 32 clock x 2 = 640 μs. 3: It is recommended to have ramp-down time more than 640 μs during the power-off sequence to ensure safe operation of the device. 2017 Microchip Technology Inc.
BM62/64 FIGURE 5-5: TIMING SEQUENCE OF POWER-ON (NACK) FIGURE 5-6: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU Note: When the host MCU sends the UART command and the BM62/64 module does not respond, the MCU resends the UART command. If the BM62/64 module does not respond within 5 secs, the MCU will force the system to Reset. DS60001403C-Page 26 Preliminary 2017 Microchip Technology Inc.
BM62/64 FIGURE 5-7: TIMING SEQUENCE OF POWER DROP PROTECTION Note 1: It is recommended to use the battery to provide the power supply at BAT_IN in to the module. 2: If an external power source or a power adapter is utilized to provide power to the module (ADAP_IN), it is recommended to use a voltage supervisor IC. 3: The Reset IC output pin, RST_N, must be “Open drain” with delay time ≦ 10 ms and the recommended part is G691L293T73. 5.
BM62/64 FIGURE 5-9: 5.3 BM64 MODULE IN I2S SLAVE MODE Reset The BM62/64 module provides a watchdog timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known Power-on state. This action can be driven by an external Reset signal, which is used to control the device externally by forcing it into a POR state. The RST_N signal input is active-low and no connection is required in most applications.
BM62/64 5.4 External Configuration and Programming The BM62/64 module can be configured by using an external configuration tool (EEPROM tool) and the firmware is programmed by using a programming tool (Flash tool). Note: The EEPROM and Flash tools are available for download from the Microchip web site at: www.microchip.com/BM62 and www.microchip.com/BM64. Figure 5-10 illustrates the configuration and firmware programming interface on the BM62 module.
Reference Circuit Figure 5-11 through Figure 5-14 illustrate the BM62 module reference circuit for a stereo headset applications. FIGURE 5-11: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION BM62/64 DS60001403C-Page 30 5.5 Preliminary 2017 Microchip Technology Inc.
FIGURE 5-12: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION BM62/64 2017 Microchip Technology Inc.
BM62/64 FIGURE 5-13: Note: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION The section “NFC (Optional)” contains built-in rectifier circuit of NXP 203F NFC type. DS60001403C-Page 32 Preliminary 2017 Microchip Technology Inc.
BM62/64 FIGURE 5-14: Note: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION All ESD diodes in the schematics are reserved for testing. 2017 Microchip Technology Inc.
FIGURE 5-15: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION BM62/64 DS60001403C-Page 34 Figure 5-15 through Figure 5-18 illustrate the BM64 reference circuit for a stereo headset applications. Preliminary 2017 Microchip Technology Inc.
FIGURE 5-16: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION BM62/64 2017 Microchip Technology Inc.
BM62/64 FIGURE 5-17: DS60001403C-Page 36 BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION Preliminary 2017 Microchip Technology Inc.
BM62/64 FIGURE 5-18: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION 2017 Microchip Technology Inc.
BM62/64 NOTES: DS60001403C-Page 38 Preliminary 2017 Microchip Technology Inc.
BM62/64 6.0 PRINTED ANTENNA INFORMATION 6.1 Antenna Radiation Pattern The BM62/64 module is integrated with one PCB printed antenna, see Figure 6-1. FIGURE 6-1: RECOMMENDED KEEPOUT AREA FOR PCB ANTENNA 2017 Microchip Technology Inc.
BM62/64 Figure 6-2 illustrates the 3D radiation pattern of the PCB printed antenna at 2441 MHZ. FIGURE 6-2: PCB ANTENNA 3D RADIATION PATTERN AT 2441 MHZ Table 6-1 provides the PCB Antenna characteristics of the BM62/64 module. TABLE 6-1: BM62/64 PCB ANTENNA CHARACTERISTICS Parameter Values Frequency Peak Gain 2400 MHz to 2480 MHz 1.927 dBi Efficiency 73.41% 6.2 tion. For the best range performance, keep all external metal at least 15 mm away from the on-board PCB trace antenna.
BM62/64 Figure 6-3 and Figure 6-4 illustrate the examples of good and poor placement of the BM62/64 module on a host board with GND plane. FIGURE 6-3: MODULE PLACEMENT GUIDELINES FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD 2017 Microchip Technology Inc.
BM62/64 NOTES: DS60001403C-Page 42 Preliminary 2017 Microchip Technology Inc.
BM62/64 7.0 PHYSICAL DIMENSIONS Figure 7-1 illustrates the PCB dimension of the BM62 module. FIGURE 7-1: Note: BM62 MODULE PCB DIMENSION PCB dimensions: X: 15.0 mm, Y: 29.0 mm and tolerances: 0.25 mm. 2017 Microchip Technology Inc.
BM62/64 Figure 7-2 illustrates the PCB dimension of the BM64 module. FIGURE 7-2: Note: BM64 MODULE PCB DIMENSION PCB dimensions: X: 15.0 mm, Y: 32.0 mm and tolerances: 0.25 mm. DS60001403C-Page 44 Preliminary 2017 Microchip Technology Inc.
BM62/64 Figure 7-3 illustrates the recommended PCB footprint of the BM62 module. FIGURE 7-3: RECOMMENDED BM62 MODULE PCB FOOTPRINT Note 1: The keep-out area is reserved to keep the RF test point away from GND plane. 2: All metal keep-out is used to isolate the PCB antenna. 2017 Microchip Technology Inc.
BM62/64 Figure 7-4 illustrates the recommended PCB footprint of the BM64 module. FIGURE 7-4: RECOMMENDED BM64 MODULE PCB FOOTPRINT Note 1: The keep-out area is reserved to keep the RF test point away from GND plane. 2: All metal keep-out is used to isolate the PCB antenna. DS60001403C-Page 46 Preliminary 2017 Microchip Technology Inc.
BM62/64 8.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the BM62/64 Stereo Audio module electrical characteristics. Additional information will be provided in future revisions of this document, as it becomes available. Absolute maximum ratings for the BM62/64 module are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability.
BM62/64 Table 8-1 through Table 8-9 provide the recommended operating conditions and the electrical specifications of the BM62/64 module. TABLE 8-1: RECOMMENDED OPERATING CONDITION Symbol Parameter Min. Typical Max. Unit BAT_IN ADAP_IN Input voltage for battery Input voltage for adapter 3.2 4.5 3.8 5 4.2 5.5 V V TOPERATION Operation temperature -20 +25 +70 ºC Note: The absolute and recommended operating condition tables reflect a typical voltage usage for the device.
BM62/64 TABLE 8-4: LED DRIVER Parameter Min. Typical Max. Unit Open-drain Voltage Programmable Current Range — 0 — — 3.6 5.25 V mA Intensity Control — 16 — step Current Step — 0.35 — mA Power Down Open-drain Current — — 1 μA Shutdown Current — — 1 μA Min. Typical Max. Unit Resolution Output Sample Rate — 8 — — 16 48 Bit kHz Signal to Noise Ratio (Note 1) (SNR at MIC or Line-in mode) — 92 — dB Digital Gain -54 — 4.
BM62/64 TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER o T = 25 C, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz Parameter (Condition) Over-sampling rate Resolution Min. Typical Max. Unit — 16 128 — — 20 fs Bit Output Sample Rate 8 — 48 kHz Signal to Noise Ratio (Note 1) (SNR at capless mode) for 48 kHz — 98 — dB Signal to Noise Ratio (Note 1) (SNR at single-ended mode) for 48 kHz — 98 — dB Digital Gain -54 — 4.
BM62/64 TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR Sensitivity at 0.1% BER Sensitivity at 0.01% BER Modulation Min. Typical Max. Bluetooth specification Unit GFSK π/4 DQPSK — — -89 -90 — — ≤-70 ≤-70 dBm dBm 8 DPSK — -83 — ≤-70 dBm Note 1: Test condition: VCC_RF = 1.28V with temperature +25ºC. 2: These parameters are characterized, but not tested in manufacturing. TABLE 8-9: BM62 SYSTEM CURRENT CONSUMPTION Typical(1) Max. Unit — 10 μA Standby mode 0.57 — mA Link mode 0.
BM62/64 8.2 Timing specifications Figure 8-1 and Figure 8-2 illustrate the timing diagram of the BM62/64 module in I2S and PCM modes. . FIGURE 8-1: TIMING DIAGRAM FOR I2S MODES (MASTER/SLAVE) FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) Note 1: fs: 8,16, 32, 44.1, 48, 88.2 and 96 kHz. 2: SCLK0: 64*fs/256*fs. 3: Word Length: 16-bit and 24-bit. DS60001403C-Page 52 Preliminary 2017 Microchip Technology Inc.
BM62/64 Figure 8-3 illustrates the timing diagram of the audio interface. FIGURE 8-3: AUDIO INTERFACE TIMING DIAGRAM Table 8-10 provides the timing specifications of the audio interface.
BM62/64 NOTES: DS60001403C-Page 54 Preliminary 2017 Microchip Technology Inc.
BM62/64 9.0 SOLDERING RECOMMENDATIONS The BM62/64 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM62/64 module can be soldered to the main PCB using a standard leaded and lead-free solder reflow profiles.
BM62/64 NOTES: DS60001403C-Page 56 Preliminary 2017 Microchip Technology Inc.
BM62/64 10.0 ORDERING INFORMATION Table 10-1 provides the ordering information of the BM62/64 module. TABLE 10-1: BM62/64 MODULE ORDERING INFORMATION Module Microchip IC Description Regulatory Certification Shield BM62 IS2062GM Bluetooth 4.2 Stereo Audio module, Class 2 with RF shield Yes BM62 IS2062GM Bluetooth 4.2 Stereo Audio module, Class 2 without RF shield No BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, Class 2 with RF shield BM64 IS2064GM BM64 Part No.
BM62/64 NOTES: DS60001403C-Page 58 Preliminary 2017 Microchip Technology Inc.
BM62/64 APPENDIX A: CERTIFICATION NOTICES The BM62 module (BM62SPKS1MC2) has received the regulatory approval for following countries: • BT SIG/QDID: 83345 • United States/FCC ID: A8TBM62S2 • Canada - IC ID: 12246A-BM62S2 - HVIN: BM62SPKS1MC2 • Europe/CE • Japan/MIC: 005-101204 • Korea/KCC: MSIP-CRM-mcp-BM62SPKS1MC2 • Taiwan/NCC No: CCAN16LP0270T5 • China/SRRC: CMIIT ID: 2016DJ2656 • Brazil/ANATEL: 00633-17-03464 • • • • • Korea Taiwan China Brazil Other Regulatory Jurisdictions A.1.
BM62/64 For the BM62: Contains Transmitter Module FCC ID: A8TBM62S2 or Contains FCC ID: A8TBM62S2 This device complies with Part 15 of the FCC Rules.
BM62/64 A.1.4 HELPFUL WEB SITES Federal Communications http://www.fcc.gov Commission (FCC): FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): https://apps.fcc.gov/oetcf/kdb/index.cfm A.2 Canada The BM62/BM64C1/BM64C2 Stereo Audio module has been certified for use in Canada under Industry Canada (IC) Radio Standards Procedure (RSP) RSP100, Radio Standards Specification (RSS) RSS-Gen and RSS-247.
BM62/64 A.2.2 RF EXPOSURE A.3.1 All transmitters regulated by the IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands).
BM62/64 The European Compliance Testing listed in Table A-1, Table A-2 and Table A-3 was performed using the PCB Trace antenna. TABLE A-1: EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2) Certification Safety Health Standards Article EN 60950-1:2006+A11:2009+A1: [3.1(a)] 2010+A12:2011+A2:2013 ETSI EN 300 328 V1.9.1 EN 62479:2010 Laboratory Report Number Date TUV, Rheinland, Taiwan 10055923 001 2016-04-20 10055775 001 (BDR/EDR) 2016-05-05 10055772 001 (BLE) EMC ETSI EN 301 489-1 V1.9.
BM62/64 TABLE A-3: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC2/BM64SPKA1MC2) Certification Safety Standards Article EN 60950-1:2006+A11:2009+A1: [3.1(a)] 2010+A12:2011+A2:2013 ETSI EN 300 328 V1.9.1 EN 62479:2010 Health Laboratory Report Number Date TUV, Rheinland, Taiwan 10055925 001 2016-04-20 10055788 001 (BDR/EDR) 2016-04-29 10055787 001 (BLE) EMC ETSI EN 301 489-1 V1.9.2 ETSI EN 301 489-17 V2.2.1 [3.
BM62/64 For the BM62 Stereo Audio module, due to a limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside: A.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM62/BM64C1/BM64C2 Stereo Audio module must follow KC marking requirements.
BM62/64 A.6.1 依據 低功率電波輻射性電機管理辦法 LABELING AND USER INFORMATION REQUIREMENTS 第十二條 經型式認證合格之低功率射頻電機，非經許 可， For the BM62 Stereo Audio module, due to limited module size, the NCC mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the module label.
BM62/64 A.6.2 HELPFUL WEB SITES National Communications Commission (NCC): http://www.ncc.gov.tw A.7 China The BM62/BM64C1/BM64C2 Stereo Audio module has received certification of conformity in accordance with the China MIIT Notice 201401 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. A.7.
BM62/64 Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.8.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 module does not carry the Homologation ID, due to the limited space. “Este produto esta homologado pela ANATEL, de acordo com os procedimentos regulamentados pela Resolucao 242/2000, e atende aos requisitos tecnicos aplicados”.
BM62/64 NOTES: 2017 Microchip Technology Inc.
BM62/64 APPENDIX B: REVISION HISTORY Revision A (May 2016) This is the initial released version of this document. Revision B (December 2016) This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. TABLE B-1: MAJOR SECTION UPDATES Section “Audio Codec” Update Description Updated the I2S digital audio applicability and SNR details of 20-bit DAC and 16-bit ADC. Updated the certification information. “Compliance” 1.
BM62/64 NOTES: 2017 Microchip Technology Inc.
BM62/64 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
BM62/64 NOTES: 2017 Microchip Technology Inc.
BM62/64 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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