Datasheet of Bluetooth BM57SPPSyC2 Module iSSC Technologies Corp. Revision History Date 2012/03/08 Revision Content Preliminary Draft Version Version 0.
Content 1. Introduction ...................................................................................................................... 3 1.1. Major Components ....................................................................................................................................... 3 1.2. Features........................................................................................................................................................ 3 1.3. Application ................
1. Introduction Part Name: iSSC BM57SPPSyC2 Bluetooth module Part Number: BM57SPPSyC2-xxxxxx The iSSC BM57SPPSyC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for iPad logos) electronic accessory via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR. iSSC IS1657NM single chip solution combines transceiver and baseband function to decrease the external components.
1.3. Application - GPS - Printers - Electric Scale - Blood Pressure Monitors - Bar code Scanner - Industrial Applications (CNC, PLC, RFID) - Embedded systems 1.4. Certifications - Bluetooth SIG: QDID B017511 http://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17511 - FCC ID: A8TBM57SPPSYC2A CONFIDENTIAL © 2000~2011 iSSC Technologies Corp.
2. Product Specification 2.1. Chipset 7x7 mm2 48 pin QFN IS1657NM 2.2. Interfaces - Multi function GPIO interface - Bluetooth RF interface - HCI over URAT up to 921600 bps - I2C for external EEPROM and authentication chip - 2/4 wires SPI interface (master/slave) for external peripherals control. (Optional) 2.3. Hardware Design Considerations - Power The module requires either a 3.3V or 5V supply voltage. (3.3V was suggested) - Power ramp-up timing restriction 1) BAT_IN : ramp-up (0 to 1.
- Current Consumption Operation Mode Peak AVG current current Unit Peak current at TX mode 50.357 mA Peak current at RX mode 49.413 mA Standby mode (Discoverable & Note 2.382 mA Deep power down mode 0.276 mA Connected + Sniff, Master (No data) 2.723 mA Connected + Sniff, Master (No data) 0.673 mA Connected + Sniff, Slave (No data) 0.745 mA Data, Master 17.641 mA Data transmitted at 115200bps Data, Slave 18.
- Baud Rate Desired baud rate Clock P Div Actual Baud rate Error Rate % 921600 48000000 13 3.50641026 923077 0.16 460800 48000000 13 7.51282051 461538 0.16 230400 48000000 13 15.525641 230769 0.16 115200 16000000 13 10.1837607 111888 -2.87 57600 16000000 13 20.8675214 58608 1.75 38400 16000000 13 31.5512821 38462 0.16 28800 16000000 13 42.2350427 28623 -0.62 19200 16000000 13 63.6025641 19231 0.16 14400 16000000 13 84.9700855 14480 0.
- Timing Sequence Timing Sequence for Mode selection Pin (P20, P24) under APP mode Pin No. I/O Name Description 4 I BAT_IN 3.3V power input 7 P VDD_IO Main power supply 17 I P20 System configuration, refer to P2_4, MCU do NOT drive under APP Mode Boot mode selection (MCU NOT drive under APP Mode) 18 I P2_0/ P2_4: HH Æ Application P24 LL Æ Boot mode LH Æ HCI UART mode for testing and system configuration. 7.28ms 41.
Timing Sequence for Rest Pin (RST_N) under different mode 22 I RST_N External reset input (Low Active), clock period 62.5n at least. 60 ms External Rest 400 ms 1 ms 1 Write Flash Mode Ready for MCU Test Mode Ready for MCU APP Mode Ready for MCU 2 3 5 ms RST_N Timing Diagram CONFIDENTIAL © 2000~2011 iSSC Technologies Corp.
3. Hardware Architecture Block Diagram 32 mm IS1657NM I2C Antenna RTX (Class 2) UART/ HCI Interface GPIO Control EEPROM 16M XTAL 12.6 mm Power Tree BM57 Module IS1657NM 2V8 ~ 3V3 LDO33_O VDD_FIO USB_VDD LDO18_I BAT_IN_5V BAT_IN 5V 3V~4V2 Either One BAT_IN is recommended BAT_IN_5V VDD_IO 2V8 ~ 3V3 VDD_IO LDO18_O BAT_IN 1V8 VDD_XO VCC_RF AVDD_SAR 1V8_U_P 1V8 EEPROM 4.
5. Environmental Requirements 5.1. Temperature Conditions Operating Temperature Non-Operating Temperature Minimum -10 ℃ -40℃ Maximum +70 ℃ +80 ℃ Conditions Operating Humidity Non-Operating Humidity Minimum 10% 5% Maximum 90% 95% 5.2. Humidity CONFIDENTIAL © 2000~2011 iSSC Technologies Corp.
Appendix A: Dimension and Foot Print 1. Dimension • 32mm* 12.6mm* 1.86mm (Length* Width* Height) • board thickness: 0.8mm (4 layers PCB) 2. Module Foot Print 3. The mandatory layout under the module. 4. The solder stop mask CONFIDENTIAL © 2000~2011 iSSC Technologies Corp.
Appendix B: Product Image CONFIDENTIAL © 2000~2011 iSSC Technologies Corp.
Appendix C: PIN Assignment Chip Antenna 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 GND SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DP USB_DM 32 BT_RF 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 BM57_V2 Pin # I/O Name Description 1 P GND Ground 2 I SAR_BAT Reserved 3 I BAT_IN_5V 5V power input 4 I BAT_IN 3.
I/O USB_DP Reserved 16 I/O USB_DM Reserved 17 I P20 System configuration, refer to P2_4, No drive under APP Mode Boot mode selection (No drive under APP Mode) 18 I P24 P2_0/ P2_4: HH Æ Application LL Æ Boot mode LH Æ HCI UART mode for testing and system configuration. 19 O P21 CP_RST: Reset Authentication Coprocessor 2.0B STATUS_IND: Bluetooth link status indication, 20 O P22 P22/P04: HH Æ Power default value and Shutdown State. P22/P04: HL Æ Access State.
Appendix D: Reflow Profile 1.) Follow: IPC/JEDEC J-STD-020 C 2.) Condition: Average ramp-up rate (217℃ to peak): 1~2℃/sec max. Preheat：150~200C、60~180 seconds Temperature maintained above 217℃ : 60~150 seconds Time within 5℃ of actual peak temperature: 20 ~ 40 sec. Peak temperature：250+0/-5℃ or 260+0/-5℃ Ramp-down rate : 3℃/sec. max. Time 25℃ to peak temperature : 8 minutes max. Cycle interval：5 minus Slope: 1~2℃/ sec max. (217℃ to peak) Peak: 250+0/-5℃ Or 260+0/-5℃ Ramp down rate: Max. 3℃/sec.
Appendix E: Schematic 5V_IN C3 10u/6.3V L1 C4 1.8p/50V LDO33_O 4.7nH 2 BT_RF1 C6 1.2p/50V LDO18_O LDO18_O C5 10u/6.3V 2.7nH 1 2 C7 CAN4311851042453K NP-0402 2 VBAT_IN ANT1 L2 2 1 SAR_BAT 1 C8 10u/6.
VDD_IO 1 2 3 4 A0 A1 A2 GND VCC WP SCL SDA 8 7 6 5 P16 P12/SCL P13/SDA 1 U4 IS24C08A VDD_IO 2 R6 10K Appendix F: Reference Schematic 1 GND BT_RF 32 3V3 LED1 2 3 4V2~3V2 4 5 6 7 8 WAKEUP (option) 9 10 UART_TX_IND (option) 11 CP_SCL (option) 12 CP_SDA (option) 13 14 15 16 SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DP USB_DM GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 31 30 29 28 27 26 25 24 23 22 21 20 19
Appendix G: Test Board Layout Information 1. The CN1 is reserved for SMA Connector, It’s will be used only if user would like to check module RF performance. 2. The C4 components must be removed under general condition. The RF trace will output from the chip antenna on the module. Appendix H: Test Board Layout Information Top Bottom Appendix H: Label Information TBA CONFIDENTIAL © 2000~2011 iSSC Technologies Corp.
Appendix I: Packaging Information TBA CONFIDENTIAL © 2000~2011 iSSC Technologies Corp.
Appendix I: Reversion History Version 0.1 Date History 2011/12/11 Preliminary Draft Version CONFIDENTIAL © 2000~2011 iSSC Technologies Corp.
