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MESHTEK-H52E

FEATURES

 Simple & fast integration with development

kits and sample iOS & Android API

 Built-in reliable Connection based mesh to

support large data packets, Mesh Network

(Node and Bridge) for Android

 Long-range, module connectivity up to 100

meters

 Compact form factor 15.24mm X 17.60mm X

3mm

 Castellated SMT pads for easy and reliable

PCB mounting

 Over the Air firmware update from one

device to an entire network

 32-bit ARM® Cortex™ M4F nRF52832 CPU

 Proximity support for beacon and location

based services

 No. of GPIOs available for user - 11

 Configurable I/O mapping for analog and

digital

 Simultaneous master and slave operation

 *Certifications: FCC, IC (In progress)

 RoHS compliant

OPERATIONAL

• Operating voltage range: 1.7V to 3.6VDC

• Temperature range: -40°C to 85°C

• Low-power consumption

• Interface: SPI, UART, I2C

• 512KB flash and 64KB RAM

APPLICATIONS

 Lighting fixtures

 Automotive

 Home Automation

 Power plugs, routers

 Internet of Things (IoT)

 Industrial Control

DESCRIPTION

With the smartest and most robust Bluetooth

Mesh Network technology on the market, ilumi’s

MeshTek provides an elegant and affordable

solution for manufacturers looking to quickly and

reliably bring BLE enabled IoT products to market.

The MESHTEK-H52E Smart Mesh Module with IPX

antenna allows users to connect External Antenna

which is required for various applications. This

complete platform solution includes software

drivers, sample applications, API guide, user

documentation and a world-class support.

The MESHTEK-H52E internal controller can be used

for applications up to 64KB flash; without the need

for external host MCU or software development

tools.

MESHTEK-H52E Bluetooth Module

with External Antenna

Summary of content (13 pages)

PAGE 1
. ……………. MESHTEK-H52E FEATURES  Simple & fast integration with development kits and sample iOS & Android API  Built-in reliable Connection based mesh to support large data packets, Mesh Network (Node and Bridge) for Android  Long-range, module connectivity up to 100 meters  Compact form factor 15.24mm X 17.
PAGE 2
MESHTEK-H52E TABLE OF CONTENTS 1. 2. 3. 4. 5. 5.1. 5.1.1. 5.1.2. 5.1.3. 5.1.4. 5.1.5. 6. 6.1. 7. 7.1. 7.2. 8. 9. DEVICE OVERVIEW ........................................................................................................................ 4 GENERAL SPECIFICATIONS ............................................................................................................ 6 PHYSICAL DIMENSIONS .........................................................................................................
PAGE 3
MESHTEK-H52E TO OUR VALUED CUSTOMERS It is our intention to provide you, our valued customer, with the best possible documentation to ensure successful use of your MeshTek products. To this end, we will continue to update our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. Please note: images used in the manual are for reference purposes and may be different than the actual product.
PAGE 4
MESHTEK-H52E 1. DEVICE OVERVIEW The MESHTEK-H52E Bluetooth Low Energy RF module integrates Bluetooth radio baseband, 32-bit MCU, digital analog I/O, onboard MeshTek stack. Figure 1 shows the module’s Block diagram. Figure 2 shows the module’s pinout and the description is shown in Table 1. Figure 1: MESHTEK-H52E BLOCK DIAGRAM VDD (DC 1.7V to 3.6V) Figure 1: MESHTEK-H52 PINOUTFigure 2:MESHTEK-H52 BLOCK u.
PAGE 5
MESHTEK-H52E Table 1: PINOUT DESCRIPTION Sr. No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Pin out Pin Function Description GND VDD P0.26 P0.27 P0.28 (AIN4) P0.29 (AIN5) P0.30 (AIN6) P0.21 (RESET) P0.18 (TRACEDATA[0] / SWO) P0.17 (MI2C_DATA) SWDCLK SWDIO P0.13 P0.12 P0.11 Power Power Digital I/O Digital I/O Digital I/O Analog input Digital I/O Analog input Digital I/O Analog input Digital I/O Ground (0 V) Power Supply General purpose I/O pin. General purpose I/O pin.
PAGE 6
MESHTEK-H52E 2. GENERAL SPECIFICATIONS Table 2 provides the general specifications for the module and current consumption. Table 2: ELECTRICAL SPECIFICATIONS ELECTRICAL SPECIFICATIONS Description VDD - Supply Voltage Operating Temperature Range ESD - Human Body Model Class 2 Built-in Crystal Frequency Crystal Frequency Tolerance Reset pin time for successful reset Radio Operating Frequencies Radio On-Air Data Rate Min Nom Max 1.7V -40 °C 3.0V 3.6V 85 °C 4 kV 32 MHz +/- 10ppm 60 msec 2.
PAGE 7
MESHTEK-H52E 3. PHYSICAL DIMENSIONS Figure 4 shows the size and footprint for MeshTek-H52E module Figure 4: MESHTEK-H52E FOOTPRINT 4. LAYOUT AND MOUTING GUIDELINES     We recommend 2 or more layers for the Carrier Board (Host PCB). The top side shall be mostly ground. Signal routing shall be done in the bottom or middle layers.
PAGE 8
MESHTEK-H52E ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.
PAGE 9
MESHTEK-H52E 5. REGULATORY APPROVAL 5.1. FCC and IC Compliance The MESHTEK-H52E module conforms to the product specifications listed in below Table 4. Table 3: MESHTEK-H52E FCC and IC Conformity Standard FCC part 15 Subpart C Section 15.249 MESHTEK-H52E FCC ID: 2AEHU-MESHTEK-H52E Industry Canada RSS-210 Industry Canada RSS-Gen MESHTEK-H52E IC: 20059-MESHTEKH52E FCC IC 5.1.1. FCC Statement This device has been tested and found to comply with part 15 of the FCC rules.
PAGE 10
MESHTEK-H52E 5.1.3. Conformité aux norms d´IC Cet appareil est conforme à la(aux) norme(s) RSS sans licence d’Industry Canada. Son utilisation est soumise aux deux conditions suivantes: 1. Cet appareil ne doit pas causer d’interférences et 2. il doit accepter toutes interférences reçues, y compris celles susceptibles d’avoir des effets indésirables sur son fonctionnement.
PAGE 11
MESHTEK-H52E In accordance with 47 CFR § 15.19, the end product shall bear the following statement in a conspicuous location on the device: "This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions; 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation.
PAGE 12
MESHTEK-H52E 6. PRODUCT HANDLING 6.1. SOLDER REFLOW PROFILE Soldering Temperature-Time Profile for Reflow Soldering is described below in FIGURE 5. Maximum number of cycles for reflow is 2. No opposite side reflow is allowed due to module weight. Figure 5: REFLOW PROFILE 6.2. MOISTURE SENSITIVITY LEVELS The Moisture Sensitivity Level (MSL) relates to the required packaging and handling precautions. MeshTekH52E module is rated for MSL 3, 168-hour floor life after opening.
PAGE 13
MESHTEK-H52E 7. PACKAGING AND LABELLING 7.1. PACKAGING    MeshTek-H52E modules are deliverable in MPQ of 49pcs/tray. Package Type: antistatic bag/tray Unit weight of the MeshTek-H52E module is 1gm/pc 7.2. PACKAGING LABEL TBD 8. ORDERING INFORMATION Table 4 provides ordering information for the MESHTEK-H52E module. Table 4: ORDERING INFORMATION Part Number Description MESHTEK-H52E Bluetooth High Power Module, Tray Packaging, 49 pcs Note: For custom applications, contact sales@ilumisolutions.