For model: MSK32WM10 and MSK32WM13, PMN: K32W Middle Power ZigBee Module with PCB antenna/with uFL connector For model: MSK32WM16, PMN: K32W High Power ZigBee Module with PCB antenna and uFL connector ©Meshreen DS-MS5168 / info@meshreen.
Features: Radio Overview ● The MSK32W series modules are ultra-low power, high performance Arm® Cortex®-M4 based wireless microcontrollers supporting Zigbee 3.0, Thread and Bluetooth Low Energy 5.0.
Content Overview Introduction Variants Regulatory Approvals Antenna Specification 5 5 5 6 6 Electrical Characteristics Limiting Values Recommended operating conditions DC current Radio Transceiver RF port characteristics IEEE 802.15.
1. Overview 1.1. Introduction The MSK32W-Myy module family provides designers with a ready-made component that provides a fully integrated solution for applications, using the NXP K32W061 series of chips they are ultra-low power, high performance Arm® Cortex®-M4 based wireless microcontrollers supporting ZigBee 3.0 ,Thread and Bluetooth Low Energy 5.0 networking stacks to facilitate home and building automation, smart lighting, smart locks and sensor network applications.
1.3. Regulatory Approvals The MSK32WT-M10/M13/M16 have been tested against the requirements of the following European standards Model Number MSK32WT-M10 MSK32WT-M13 FCC FCC 47 CFR Part 15.247, Subpart C FCC 47 CFR Part 2.1091, Subpart J ISEC RSS-247 Issue 2 (2017) RSS-102 Issue 5 (2015) CE EN 300328 v2.2.2 (Zigbee / BLE) EN 300330 v2.1.1 (NFC) EN 62479:2010 (BLE) EN 62311:2008 (Zigbee) MSK32WT-M16 The module with u-FL connector can connect with an antenna with up to (T.B.
VADC ADC pins voltage -0.3 3.96 V V LX LA and LB pin voltage -0.3 4.6 V T stg Storage Temperature -40 125 ⁰C HBM[2] -- 3000 V CDM[3] -- 500 V V Electrostatic discharge voltage ESD peak [1] Primary input of RF transformer connected to the ground. No DC voltage. [2] Testing for HBM discharge is performed as specified in JEDEC Standard JS-001. [3] Testing for CDM discharge is performed as specified in JEDEC Standard JESD22-C101. 2.2.
2.4. Radio Transceiver 2.4.1. RF port characteristics Single-ended; Impedance = 50 Ω; VDD = 1.9 V to 3.6 V; Tj = -40°C to +125°C; unless otherwise specified. Symbol Parameter Min Frange Frequency range 2.4 2.4.2. Typ Max Unit 2.485 GHz IEEE 802.15.4 radio transceiver characteristics: +25⁰C VDD = 1.9 V to 3.6 V; unless otherwise specified. Symbol Parameter Conditions MSK32W-M10 /M13 MSK32W-M 16 Unit SRX Receiver sensitivity 1 % PER, as per IEEE 802.15.
Receiver Bluetooth Low Energy 1Mb/s S Receiver sensitivity 0.1 % BER -96 -100 dBm NF Noise Figure Max gain [1] 7 6 dB PinMaxRX_BLE_1M Maximum receiver input power 0.1 % BER 10 15 dBm Coch_BLE_1M Co-channel Interference rejection 0.1 % BER, with wanted channel at -67 dBm [2] -7 -7 dB 10 20 dBm RX_BLE_1M Transmitter Bluetooth Low Energy 1Mb/s PoutMax_BL E_1M Maximum output power [1] Considering an integrated BW of 1 MHz, and a minimum SNR of 9 dB for the demodulator.
3. Pin Information 3.1. Pin configuration 3.2.
SPI1_SCK — Serial Peripheral Interface-bus 1 clock input/output PDM0_DATA — Pulse Density Modulation Data input from digital microphone (channel 0) 6 PIO1 IO GPIO1 GPIO1 — General Purpose digital Input/Output 1 USART1_RXD — Universal Synchronous/Asynchronous Receiver/Transmitter 1 - receive data input PWM1 — Pulse Width Modulator output 1 SPI1_MISO — Serial Peripheral Interface-bus 1 master data input PDM0_CLK — Pulse Density Modulation Clock output to digital microphone (channel 0) 7 PIO2 IO GPIO2
ISP_SEL — In-System Programming Mode Selection 10 PIO5 IO GPIO5/I SP_Entr y GPIO5/ISP_ENTRY — General Purpose digital Input/Output 5; In-System Programming Entry SPI0_SSELN — Serial Peripheral Interface-bus 0 slave select not SPI1_MISO — Serial Peripheral Interface-bus 1 master data input SPI1_SSELN2 — Serial Peripheral Interface-bus 1 slave select not 2 USART0_RTS — Universal Synchronous/Asynchronous Receiver/Transmitter 0 - Request To Send output RFRX — Radio Receiver Control Output 11 PIO6 IO GPI
PDM1_DATA — Pulse Density Modulation Data input from digital microphone (channel 1) SPI0_MOSI — Serial Peripheral Interface-bus 0 master output slave input RFTX — Radio Transmit Control Output 14 PIO9 IO GPIO9/R XD0 GPIO9 — General Purpose digital Input/Output 9 USART0_RXD — Universal Synchronous/Asynchronous Receiver/Transmitter 0 - receive data input CT32B1_CAP1 — 32-bit CT32B1 capture input 1 PWM9 — Pulse Width Modulator output 9 USART1_SCK — Universal Synchronous/Asynchronous Receiver/Transmitter 1
SWCLK — Serial Wire Debug Clock PWM0 — Pulse Width Modulator output 0 I2C1_SCL — I2C-bus 1 master/slave SCL input/output (open drain) SPI0_MOSI — Serial Peripheral Interface-bus 0 master output slave input ANA_COMP_OUT — Analog Comparator digital output IR_BLASTER — Infra-Red Modulator output 18 PIO13 IO GPIO13 GPIO13 — General Purpose digital Input/Output 13 SPI1_SSELN2 — Serial Peripheral Interface-bus 1, slave select not 2 SWDIO — Serial Wire Debug Input/Output PWM2 — Pulse Width Modulator output 2 I
22 VDD P 23 PIO16 IO Supply voltage DC input GPIO16 ADC2 — ADC input 2 GPIO16 — General Purpose digital Input/Output 16 SPI1_SSELN0 — Serial Peripheral Interface-bus 1, slave select not 0 PWM5 — Pulse Width Modulator output 5 PDM1_CLK — Pulse Density Modulation Clock output to digital microphone (channel 1) SPIFI_CSN — Quad-SPI Chip Select Not, output ISO7816_RST — RST signal, output, for ISO7816 interface I2C0_SDA — I2C-bus 0 master/slave SDA input/output (open drain) 24 PIO17 IO GPIO17 ADC3 —
USART1_RXD — Universal Synchronous/Asynchronous Receiver/Transmitter 1 - receive data input CLK_IN — External clock USART0_RXD — Universal Synchronous/Asynchronous Receiver/Transmitter 0 - receive data input 27 PIO20 IO GPIO20 ACP — Analog Comparator Positive input GPIO20 — General Purpose digital Input/Output 20 IR_BLASTER — Infra-Red Modulator output PWM8 — Pulse Width Modulator output 8 RFTX — Radio Transmit Control Output SPIFI_IO2 — Quad-SPI Input/Output 2 USART1_TXD — Universal Synchronous/Asynchr
Appendix A Additional Information A1. Outline Drawing Thickness: 3.4mm MSK32W-M10/M13 Outline Drawing © Meshreen DS-MS5168 / info@meshreen.
Thickness: 3.4mm Figure 5 MSK32W-M16 Outline Drawing ©Meshreen DS-MS5168 / info@meshreen.
A2. Module PCB Footprint Note 1: All modules have the same footprint Note 2: All Dimensions are mm A3. Optimal PCB placement of the module with PCB antenna The MSK32W-M10/M16 module features an optimized, low cost, integrated, inverted F, printed PCB antenna. The antenna has a vertically polarized near omnidirectional radiation pattern and up to 1.6 dBi of peak gain. The PCB design has been elongated in order to increase the ground plane area which increases the antenna efficiency.
Figure 7 Optimal PCB placement A4. PCB antenna Radiation Pattern The 2D XY plots for each channel are shown in below, ©Meshreen DS-MS5168 / info@meshreen.
These are actual measurements in an anechoic chamber with the JN5168-001-M00 mounted on a DR1174 carrier board from the JN516x-EK001 Evaluation kit. The device under test and the antenna height was 1m and the values are in dBuV/m at a distance of 3m. 3D radiation pilot PCB antenna XY Orientation (Simulation) © Meshreen DS-MS5168 / info@meshreen.
3D radiation pilot PCB antenna XZ Orientation (Simulation) 3D radiation pilot PCB antenna YZ Orientation (Simulation) ©Meshreen DS-MS5168 / info@meshreen.
A5. Manufacturing 5.1. Reflow Profile For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste manufacturer’s guidelines on peak flow temperature, soak times, time above liquid and ramp rates. Figure 8 Module Reflow profile reference A6. Tray Information All models are packing in one size Tray, the Tray dimension is below. © Meshreen DS-MS5168 / info@meshreen.
The standard packing is based on 500 pcs, using 11 trays which include cover. All modules will be packed in a vacuum packing bag which include trays, humidity indicator card, desiccant. 9.1. Net weight and Gross weight Weight MSK32W-M10 MSK32W-M13 MSK32W-M16 Net Weight T.B.D. T.B.D. T.B.D. Gross Weight with Carton T.B.D. T.B.D. T.B.D. Carton Size T.B.D. T.B.D. T.B.D. A7. Related Documents NXP Chip Datasheet K32W061/41 : https://www.nxp.com/docs/en/data-sheet/K32W061.
A9. FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
The host integrator must follow the integration instructions provided in this document and ensure that the composite-system end product complies with the requirements by a technical assessment or evaluation to the rules and to KDB Publication 996369.
Status Information Disclaimers The contents of this document are subject to change without notice. Meshreen reserves the right to make changes, without notice, in the products, including circuits and/or software, described or contained therein. Information contained in this document regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications.
