MeiG Smart product technical information SLM758 Hardware Design Guide Released Date: 2018/11 File name: SLM758 Hardware Design Guide Version Number: V1.08 Company: MeiG Smart Technology Co.
MeiG Smart product technical information IMPORTANT NOTICE COPYRIGHT NOTICE Copyright © MeiG Smart Technology Co., Ltd. All rights reserved. All contents of this manual are exclusively owned by MeiG Smart Technology Co., Ltd(MeiG Smart for short), which is under the protection of Chineselawsandcopyrightlaws in international conventions. Anyone shall not copy, spread, distribute, modify or use in other ways with its contents without the written authorization of MeiG Smart.
MeiG Smart product technical information SLM758 Hardware Design Guide_V1.
MeiG Smart product technical information Foreword Thank you for using the SLM758 module from Meg Smart. This product can provide data communication services. Please read the user manual carefully before use, you will appreciate its perfect function and simple operation method. The company does not assume responsibility for property damage or personal injury caused by improper operation of the user.
MeiG Smart product technical information Contents 1. 2. Introduction.......................................................................................................................................................... 8 Module overview .................................................................................................................................................. 8 2.1 Summary of features................................................................................................
MeiG Smart product technical information 6. Electrical, Reliability ............................................................................................................................................. 67 6.1 Absolute Maximum...................................................................................................................................... 67 6.2 Working Temperature.....................................................................................................................
MeiG Smart product technical information Version History Date 2017-06-12 2017-08-15 2017-11-01 2017-11-01 2018-1-5 Version 1.00 1.01 1.02 1.03 1.04 2018-6-14 1.05 2018-8-3 1.06 2018-9-6 1.07 2018-11-21 1.
MeiG Smart product technical information 1. Introduction This document describes the hardware application interface of the module, including the connection of the circuit and the RF interface.It can help users quickly understand the interface definition, electrical performance, and structural dimensions of the module.Combining this document with other application documents, users can quickly use modules to design mobile communication applications. 2.
MeiG Smart product technical information The SLM758 provides voice, SMS, address book, WiFi, BT and GPS functions while providing high-speed broadband data access; Product supports dual 1300W 3D camera or depth of field camera, and it can be widely used in VR Camera, intelligent robot, Video surveillance, security, automotive equipment, intelligent platform handheld terminals and other products.
MeiG Smart product technical information 2.1 Summary of features Table 2.1：SLM758 features Product characteristics Plateform Description Qualcomm MSM8953 Octa-core A53 (64bit) 8*2.0GHz * Octa-core A53 (64bit) 8*1.8GHz * Octa-core A53 (64bit) 8*2.2GHz CPU GPU Adreno506;650MHz System memory 16GB eMMC + 2GB LPDDR3 933Mhz compatible with 32GB+3GB OS Android 7.1 Size 45.5x41.0x3.0mm，160pin LCC+112pin LGA Networkband SLM758 FDD-LTE: B2/4/5/7/12/13/17/28b WCDMA: B2/4/5 Wi-Fi WCN3660B:IEEE 802.
MeiG Smart product technical information 13MP Camera at the same time 4K 30fps, 1080p 60fps, H.264/H.265 MP4/ WMV9/ Video decode VC1/ DivX/ VP8/VP9 4K 30fps,1080p 60 fps: H.264/ H.265/ MP4/ VP8 Video encode 1080P 60fps De +1080p 30fps En Input Device Reset Key（Power on/off, Home, Volume+, Volume-） Capacitive TP Support HW reset Interface name VBAT Main function description 3pin，Power input，3.4V～4.2V，Nominal value3.8V SDIO *1 TF Card，Support 128GB max Support OTG USB2.0(3.
MeiG Smart product technical information 2.2 Block diagram The following figure lists the main functional parts of the module: MSM8953 baseband chip PM8953 power management chip PMI8952 power management chip WCN3660B(Compatible with WCN3680B)-WIFI/BT/FM three in one chip Antenna interface LCD/CAM-MIPI interface EMCP memory chip AUDIO interface UART、SD card interface，SIM card interface，I2Cinterface,etc.
MeiG Smart product technical information Figure 2.1: module function block diagram 3. Module Package 3.1.
MeiG Smart product technical information Figure 3.1：module pin diagram (top view) 3.2. Pin definitions table 3.
MeiG Smart product technical information VBAT 151、152、153 I VBUS 157、158、159 I/O The module provides three VBAT power pin pins. The SLM758 operates from a single supply with a voltage range from 3.4V to 4.2V for VBAT. 5V charging input power. When the VBAT of the system power is absent, the external backup battery provides power to the system real-time clock.When VBAT is present, the backup battery is charged. 1.8V power output, always available for CPU, Memory, IO and other power supply. 1.
MeiG Smart product technical information Main display interface (MIPI) MIPI_DSI0_CLK_N 64 O MIPI_DSI0_CLK_P 65 O MIPI_DSI0_LANE0_N 189 I/O MIPI_DSI0_LANE0_P 190 I/O MIPI_DSI0_LANE1_N 66 I/O MIPI_DSI0_LANE1_P 67 I/O MIPI_DSI0_LANE3_N 73 I/O MIPI_DSI0_LANE3_P 74 I/O MIPI_DSI0_LANE2_N 71 I/O MIPI_DSI0_LANE2_P 72 I/O GPIO61_LCD_RST_N 75 O GPIO24_LCD_TE0 76 I/O MIPI_LCD clock MIPI_LCD data LCD reset LCD frame sync signal The main display backlight interface LCD_BL_LED_K1
MeiG Smart product technical information GPIO16_UART5_TX 256 I UART5 data transmit GPIO21_UART6_RX 177 I UART6 data receive GPIO20_UART6_TX 176 O UART6 data transmit UIM card Interface UIM1_DET 106 I UIM1 insert detect UIM1_RESET 107 O UIM1 reset UIM1_CLK 108 O UIM1 clock UIM1_DATA 109 I/O UIM1 data UIM2_DET 87 I UIM2 insert detect UIM2_RESET 88 O UIM2 reset UIM2_CLK 89 O UIM2 clock UIM2_DATA 90 I/O UIM2 data Front Camera MIPI_CSI2_CLK_P 40 I MIPI_CSI2_CLK_N
MeiG Smart product technical information MIPI_CSI0_LANE3_P 53 I GPIO26_MCAM_MCLK 84 I/O Rear Camera main clock GPIO40_MCAM_RST_N 85 I/O Rear Camera reset GPIO39_MCAM_PWD_N 86 I/O Rear Camera dormancy Depth Camera MIPI_CSI1_CLK_N 207 I MIPI_CSI1_CLK_P 208 I MIPI_CSI1_LANE0_N 63 I MIPI_CSI1_LANE0_P 62 I MIPI_CSI1_LANE1_N 59 I MIPI_CSI1_LANE1_P 58 I MIPI_CSI1_LANE2_N 172 I MIPI_CSI1_LANE2_P 171 I MIPI_CSI1_LANE3_N 61 I MIPI_CSI1_LANE3_P 60 I GPIO132_DCAM_PWD_N 262
MeiG Smart product technical information SPKR_DRV_P 134 O Power amplifier (0.
MeiG Smart product technical information GPIOand default function GPIO0_SPI_MOSI 261 O GPIO1_SPI_MISO 260 O GPIO2_SPI1_CS 259 I GPIO3_SPI1_CLK 258 O GPIO8 232 I/O GPIO9 231 I/O GPIO33 166 I/O GPIO35 167 I/O GPIO36 168 I/O GPIO38 251 I/O GPIO42_ACCL_INT1 19 I/O GPIO43_ALSP_INT_N 20 I/O GPIO44_MAG_INT 21 I/O GPIO45_GYRO_INT 22 I/O GPIO46_PRESSURE_INT 221 I/O GPIO47 235 I/O GPIO48_FP_INT_N 270 I/O GPIO59 100 I/O GPIO63 99 I/O GPIO66 212 I/O GPIO85_KE
MeiG Smart product technical information GPIO128 249 I/O GPIO138_FP_SPI_MISO 266 O GPIO137_FP_SPI_MOSI 267 O GPIO136_FP_SPI_CS 268 I GPIO135_FP_SPI_CLK 269 O General purpose GPIO, no default configuration The default configuration is SPI interface for fingerprint recognition. Other functional pin FORCE_USB_BOOT 206 I Pull up to 1.
MeiG Smart product technical information 2 FLASH_LED1+ AO 3 GND GND 4 PMI8952_MPP1 AO-Z,AI,DO 5 LCD_BL_LED_K1 AI LCD Backlight cathode1(20mA) 6 LCD_BL_LED_K2 AI LCD Backlight cathode2(20mA) 7 LCD_BL_LED_A PO LCD Backlight anode 8 PMI_HAP_OUT_N AO Haptics driver output negative 9 PMI_HAP_OUT_P AO Haptics driver output positive 10 GND GND 11 UART2_MSM_TX GPIO_4 B-PD:nppukp Configurable I/O,UART2 TX 12 UART2_MSM_RX GPIO_5* B-PD:nppukp Configurable I/O,UART2 RX 13 GPI
MeiG Smart product technical information BHNP:pdpukp BHNP:pdpukp BHNP:pdpukp 35 SDC2_SDCARD_D3 36 SDC2_SDCARD_CMD 37 SDC2_SDCARD_CLK 38 GND GND GND 39 GND GND GND 40 MIPI_CSI2_CLK_P AI MIPI camera serial interface 2 clock+ 41 MIPI_CSI2_CLK_N AI MIPI camera serial interface 2 clock- 42 MIPI_CSI2_LANE0_P AI MIPI camera serial interface 2 lane0+ 43 MIPI_CSI2_LANE0_N AI MIPI camera serial interface 2 lane0- 44 MIPI_CSI2_LANE3_P AI MIPI camera serial interface 2 lane3+ 45 MIP
MeiG Smart product technical information 70 GND GND 71 MIPI_DSI0_LANE2_N AO MIPI display serial interface 0 lane2- 72 MIPI_DSI0_LANE2_P AO MIPI display serial interface 0 lane2+ 73 MIPI_DSI0_LANE3_N AO MIPI display serial interface 0 lane3- 74 MIPI_DSI0_LANE3_P AO MIPI display serial interface 0 lane3+ 75 GPIO61_LCD_RST_N GPIO_61* B-PD:nppukp Configurable RESET 76 GPIO24_LCD_TE0 GPIO_24 B-PD:nppukp Configurable I/O, primary LCD TE 77 GPIO25_LCD_TE1 GPIO_25* B-PD:nppukp Conf
MeiG Smart product technical information Configurable I/O, Dedicated camera I2C0 SCL Configurable I/O, Dedicated camera I2C0 SDA Configurable I/O,UIM1 removal detection 104 CAM_I2C_SCL0 B-PD:nppukp 105 CAM_I2C_SDA0 B-PD:nppukp 106 GPIO54_UIM1_DET 107 UIM1_RESET B-PD:nppukp Configurable I/O,UIM1 reset 108 UIM1_CLK B-PD:nppukp Configurable I/O,UIM1 clock 109 UIM1_DATA B-PD:nppukp Configurable I/O,UIM1 data 110 VREG_L14_UIM1 PO 111 GND GND 112 PM8953_MPP2 AO-Z,DI,DO 113 VCOIN A
MeiG Smart product technical information 138 VREG_L10_2P8_SENSOR PO PMIC output 2.8V for sensor 139 VREG_L6_1P8 PO PMIC output 1.8V for LCD,CAM,TP, sensor 140 VREG_L5_1P8 PO PMIC output 1.
MeiG Smart product technical information 173 USB3_SS_RX_M AI USB super-speed receive – minus 174 USB3_SS_RX_P AI USB super-speed receive – plus 175 GND GND 176 GPIO20_UART6_TX GPIO_20 B-PD:nppukp Configurable I/O,UART6 TX 177 GPIO21_UART6_RX GPIO_21* B-PD:nppukp Configurable I/O,UART6 RX 178 Reserved Reserved 179 Reserved Reserved 180 GND GND GND 181 GND GND GND 182 CHG_LED AO 183 Reserved 184 GPIO22_I2C6_SDA GPIO_22 B-PD:nppukp Configurable I/O, I2C SDA 185 GP
MeiG Smart product technical information boot 207 MIPI_CSI1_CLK_N AI MIPI camera serial interface 1 clock- 208 MIPI_CSI1_CLK_P AI MIPI camera serial interface 1 clock- 209 PM8953_MPP4 AO-Z,DI,DO 210 GND GND GND 211 GND GND GND 212 GPIO66 213 GND GND GND 214 GND GND GND 215 GND GND GND 216 GND GND GND 217 VREG_L13_3P075 PO 218 GND GND 219 VREG_S4_2P05 PO 220 GND GND 221 GPIO46_PRESSURE_INT 222 GND GND GND 223 GND GND GND 224 GND GND GND 225 MIP
MeiG Smart product technical information 239 MIPI_DSI1_LANE1_P AO MIPI display serial interface 1 lane1+ 240 MIPI_DSI1_LANE1_N AO MIPI display serial interface 1 lane1- 241 MIPI_DSI1_CLK_P AO MIPI display serial interface 1 clock+ 242 MIPI_DSI1_CLK_N AO MIPI display serial interface 1 clock- 243 MIPI_DSI1_LANE2_P AO MIPI display serial interface 1 lane2+ 244 MIPI_DSI1_LANE2_N AO MIPI display serial interface 1 lane2- 245 MIPI_DSI1_LANE3_P AO MIPI display serial interface 1 lane3+
MeiG Smart product technical information *：Wake-up system interrupt pin B：Bidirectionaldigital with CMOS input H：High-voltage tolerant NP：pdpukp=defaultno-pull with programmable options following the colon (:) PD：nppukp=defaultpulldown with programmable options following the colon (:) PU：nppdkp=defaultpullup with programmable options following the colon (:) KP：nppdpu=defaultkeeper with programmable options following the colon (:) 3.3.
MeiG Smart product technical information Figure 3.2：Module 3D size（unit ：mm） 4. Interface application 4.1.
MeiG Smart product technical information In the case of a battery device, the voltage input range of the module VBAT is 3.4V to 4.2V, and the recommended voltage is 3.8V. In the GSM band, when the module is transmitting at maximum power, the peak current can reach up to 3A, resulting in a large voltage drop on VBAT. It is recommended to use a large capacitor regulator close to VBAT. It is recommended to use two 47uF ceramic capacitors.
MeiG Smart product technical information Figure 4.2：DC-DC power supply circuit Note：If the user does not use battery power, please note that a 10K resistor is connected to the 149 pin (BAT_THERM) of the module and pulled down to GND to prevent the software from judging the abnormal battery temperature after the module is turned on, resulting in shutdown. The connection diagram is as follows: Figure 4.3：Connection diagram when not powered by battery 4.1.1.
MeiG Smart product technical information attention to the design of the power supply section to ensure that the VBAT does not fall below 3.4V even when the module consumes 2A. If the voltage drops below 3.4V, the module may shut down. The PCB layout from the VBAT pin to the power supply should be wide enough to reduce the voltage drop in the transmit burst mode. Figure4.4：VBAT lowest voltage drop 4.2.
MeiG Smart product technical information Figure 4.6：Booting with the button circuit The following figure is the boot timing description: Figure 4.7：Using PWRKEY boot timing diagram 4.2.2. Module Shutdown Users can use the PWRKEY pin to shutdown. 4.2.2.
MeiG Smart product technical information The user can turn off the PWRKEY signal by pulling it down for at least 3 seconds. The shutdown circuit can refer to the design of the boot circuit. After the module detects the shutdown action, a prompt window pops up on the screen to confirm whether to perform the shutdown action. The user can achieve a forced shutdown by pulling PWRKEY down for a long time, pulling down for at least 15 seconds. 4.2.3.
MeiG Smart product technical information 3.3V, it is not possible to directly use the GPIO of the MCU to drive the pin. An isolation circuit is required. The hardware parameters of the RESET can refer to the following table: Table 4.1：RESET Hardware Parameters Pin Description RESET Input high level Input low level Pull down effective time Minimu m 1 - Typical Maximum Unit - 0.65 V V - ms 500 4.3. VCOIN Power When VBAT is disconnected, the user needs to save the real-time clock.
MeiG Smart product technical information Figure 4.12： Rechargeable Battery Powers RTC This VCOIN power supply is typically 3.0V and consumes approximately 3uA when VBAT is disconnected. 4.4. Power Output The SLM758 has multiple power outputs. For LCD, Camera, touch panel, etc. In application, it is recommended to add parallel 33PF and 10PF capacitors to each power supply to effectively remove high frequency interference. Table 4.
MeiG Smart product technical information Name Pin Direction Function UART2 Data Transmission UART2 Data Reception UART2 Clear To Send （CTS） UART2 Request To Send （RTS） UART4 Data Transmission UART4 Data Reception UART4 Clear To Send （CTS） UART4 Request To Send （RTS） UART5 Data Transmission UART5 Data Reception UART5 Clear To Send （CTS） UART5 Request To Send （RTS） UART6 Data Transmission UART6 Data Reception UART6 Clear To Send （CTS） UART6 Request To Send （RTS） UART2_MSM_TX UART2_MSM_RX 11 12 I O GPI
MeiG Smart product technical information level shifting IC, the following figure can also be used to achieve level matching. Only the matching circuits on TX and RX are listed here. Other low speed signals can refer to this two circuits. Figure 4.14：TX Connection Diagram Figure 4.15：RX Connection Diagram Note ： When using Levels Isolation in Figures 14 and 15, it is necessary to use VREG_L5_1P8 as the pull-up power supply. VREG_L6_1P8 will enter the low power mode during sleep. It is not recommended.
MeiG Smart product technical information Note：1. The serial port of the module is a CMOS interface, and the RS232 signal cannot be directly connected. If necessary, please use the RS232 conversion chip. 2. If the 1.8V output of the module cannot meet the high level range of the user terminal, please add a level shifting circuit. 4.6. MIPI Interface The SLM758 supports the Moble Industry Processor Interface (MIPI) interface for Camera and LCD. The module supports FULL HD (1920*1200) display.
MeiG Smart product technical information Main screen interface MIPI_DSI0_CLK_N 64 O MIPI_DSI0_CLK_P 65 O MIPI_DSI0_LANE0_N 189 I/O MIPI_DSI0_LANE0_P 190 I/O MIPI_DSI0_LANE1_N 66 I/O MIPI_DSI0_LANE1_P 67 I/O MIPI_DSI0_LANE3_N 73 I/O MIPI_DSI0_LANE3_P 74 I/O MIPI_DSI0_LANE2_N 71 I/O MIPI_DSI0_LANE2_P 72 I/O GPIO61_LCD_RST_N 75 O GPIO24_LCD_TE0 76 I/O LCD_BL_LED_K1 5 AI LCD_BL_LED_K2 6 AI LCD_BL_LED_A 7 PO VREG_L6_1P8 139 O LCD frame sync signal LCD series backl
MeiG Smart product technical information the internal circuit of LCD. If the internal divider of the LCD uses resistor divider, please pay attention to the voltage to meet the high or low range of GPIO. MIPI is a high-speed signal line. To avoid EMI interference, it is recommended to place a common-mode inductor near the LCD side.
MeiG Smart product technical information Figure 4.16：Main LCD and sub LCD interface circuit Both the primary and secondary LCDs require a backlight circuit. The backlight of the main LCD is driven inside the module. It can directly use LCD_BL_LED_A, LCD_BL_LED_K1, LCD_BL_LED_K2 to support up to 2 strings of 8 LEDs in total. The backlight driving circuit of the secondary LCD can refer to Figure 4.17. Adjusting the brightness of the backlight can be realized by PM8953_MPP2 of the module.
MeiG Smart product technical information Note: 1. The backlight circuit should select the chip according to the backlight circuit of the LCD. Users should carefully read the LCD document and select the correct driver chip. The reference circuit provided in this document is a series-type PWM dimming backlight driver circuit; if it is a series-type one-line dimming backlight driver circuit, it needs to be controlled by GPIO. 4.6.2.
MeiG Smart product technical information Name MIPI_CSI2_CLK_P MIPI_CSI2_CLK_N MIPI_CSI2_LANE0_P MIPI_CSI2_LANE0_N MIPI_CSI2_LANE1_P MIPI_CSI2_LANE1_N MIPI_CSI2_LANE2_P MIPI_CSI2_LANE2_N MIPI_CSI2_LANE3_P MIPI_CSI2_LANE3_N GPIO27_SCAM_MCLK GPIO129_SCAM_RST_N GPIO130_SCAM_PWDN CAM_I2C_SDA1 CAM_I2C_SCL1 VREG_L6_1P8 VREG_L17_2P85 VREG_L22_2P8 VREG_L23_1P175 Name MIPI_CSI1_CLK_N MIPI_CSI1_CLK_P MIPI_CSI1_LANE0_N MIPI_CSI1_LANE0_P MIPI_CSI1_LANE1_N MIPI_CSI1_LANE1_P MIPI_CSI1_LANE2_N MIPI_CSI1_LANE2_P MIPI_CSI1
MeiG Smart product technical information If the user designs to use the CAMERA module with autofocus function, please note that the I2C of the module cannot be directly connected to the AF device. The I2C of the AF device should be connected to the driver chip of CAMERA, and the correct connection is as follows: Figure 18： Correct CAMERA connection diagram The MIPI interface has a high rate. The user should control the impedance by 100 ohms during the routing.
MeiG Smart product technical information Figure 4.19：MIPI Camera Reference Circuit Important note: When designing the camera function, you need to pay attention to the position of the connector. There will be a small person in the specification of the camera to indicate the imaging direction. You need to ensure that the villain is standing on the long side of the LCD, otherwise the camera will be flipped. The software cannot be adjusted at 90°. As shown in the two figures below. SIM 卡座 SIM 卡座 Figure 4.
MeiG Smart product technical information 4.7.Resistive Touch Interface The module does not provide a resistive touch screen interface. If the user needs to use a resistive touch, an external dedicated chip is required. The module can provide an I2C interface. 4.8.CapacitiveTouch Interface The module provides a set of I2C interfaces that can be used to connect capacitive touches while providing the required power and interrupt pins.
MeiG Smart product technical information CDC_HPH_L 126 O Headphone left channel CDC_HS_DET 125 I Headphone plug detection CDC_HPH_REF 127 I Headphone reference ground CDC_EAR_M 129 O Earpiece output negative CDC_EAR_P 130 O Earpiece output positive SPKR_DRV_M 133 O Amplifier (0.85W) output negative SPKR_DRV_P 134 O Amplifier (0.85W) output positive Users are advised to use the following circuit according to the actual application to get better sound effects. 4.9.
MeiG Smart product technical information Figure 4.22： Microphone Differential Interface Circuit 4.9.3.Headphone Interface Circuit The module integrates a stereo headphone jack. Users are advised to reserve ESD devices during the design phase to prevent ESD damage. The HS_DET pin of the module can be set as an interrupt. In software, this pin is the earphone interrupt by default. The user can use this pin to detect the plugging and unplugging of the earphone. Figure 4.
MeiG Smart product technical information 2. We recommend that the headphone detection pin HS_DET and HPH_L form a detection circuit (the connection method in the above figure), because HPH_L has a pull-down resistor inside the chip, which can ensure that HS_DET is low when connected with HPH_L, if the user will HS_DET and HPH_R To connect, please reserve a 1K pull-down resistor on HPH_R. 3 The standard of the headphone interface is the European standard OMPT.
MeiG Smart product technical information 4.9.5.I2S Interface There are two sets of GPIO-compatible I2S interfaces inside the module.
MeiG Smart product technical information Figure 4.26: USB Connection Diagram 4.10.1. USB OTG The SLM758 module can provide USB OTG function. The pins used in this function are as follows: Table 4.10: USB OTG Pin Description Pin name Pin Description VBUS 157、158、159 5V charging input / OTG output power. USB_HS_D_M 145 USB Date- USB_HS_D_P 146 USB Date+ USB_ID 143 USB ID The recommended circuit diagram of USB OTG is as follows: Figure 4.
MeiG Smart product technical information 4.11. Charging Interface The SLM758 module integrates a 2A charging solution. The charging related content of this manual is only described by the internal charging scheme. The MSM8953 platform uses the Qualcomm PMI8952 internal integrated charging chip by default. The chip is in switching mode and has high efficiency. It integrates a 15-bit battery voltage detection ADC and a 15-bit current detection ADC. The charging current can be up to 2A. Figure 4.
MeiG Smart product technical information Figure 4.29: Charging circuit connection diagram 4.12 UIM Card Interface The SLM758 can support two SIM cards at the same time to achieve dual card dual standby. Support SIM card hot swap, can automatically recognize 1.8V and 3.0V cards. The figure below is the SIM recommended interface circuit. In order to protect the SIM card, it is recommended to use TVS devices for electrostatic protection.
MeiG Smart product technical information 4.13. SD Card Interface SLM758 supports SD card interface and supports up to 64GB. The reference circuit is as follows: Figure 4.31: SD Card Interface Circuit 4.14 I2C Bus Interface The SLM758 module supports four hardware I2C bus interfaces and one camera-specific CCI interface. The pin definitions and default functions are as follows: Table 4.
MeiG Smart product technical information 4.15 Analog to Digital Converter (ADC) The SLM758 module provides three MPP function signals from the power management chip: PMI8953_MPP1 (4PIN) and PM8953_MPP2 (112PIN), PM8953_MPP4 (209PIN) MPP can be configured as an ADC or PWM signal. Note: PM8953_MPP2 and PM8953_MPP4 cannot be configured as PWM functions at the same time. The ADC signal is 16 bit resolution, and its performance parameters are as follows: Table 4.
MeiG Smart product technical information 4.18 Antenna Interface The module provides four antenna interfaces: MAIN antenna, DRX antenna, GPS antenna and WiFi/BT antenna. In order to ensure that the user's products have good wireless performance, the antenna selected by the user should meet the requirement that the input impedance is 50 ohms in the working frequency band and the VSWR is less than 2. 4.18.1 Main Antenna The module provides the MAIN antenna interface pin Pin1 RF_MAIN.
MeiG Smart product technical information 4.18.2 DRX Antenna The module provides the DRX antenna interface pin RF_DIV, and the antenna on the user's motherboard should be connected to the module's antenna pins using a 50-ohm characteristic microstrip or stripline. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows: Figure 4.
MeiG Smart product technical information 4.18.3 GPS Antenna The module provides the GNSS antenna pin RF_GPS. The antenna on the user's main board should be connected to the antenna pin of the module using a 50-ohm characteristic microstrip line or strip line. The LNA is integrated inside the module. To improve GNSS reception performance, customers can use external active antennas. The recommended circuit connections are as follows: Figure 4.38: Connecting Active Antennas 4.18.
MeiG Smart product technical information If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below: Figure 4.41: WIFI_BT antenna interface simplified connection circuit In the above figure, R301 defaults to 0R, and C301 and C302 do not paste by default.
MeiG Smart product technical information 5.PCB Layout The performance of a product depends largely on the PCB trace. As mentioned above, if the PCB layout is unreasonable, it may cause interference problems such as card loss. The way to solve these interferences is often to redesign the PCB. If you can plan a good PCB layout in the early stage, the PCB traces smoothly, saving a lot of time. Of course, it can also save a lot of costs.
MeiG Smart product technical information The device and wiring between the antenna pin and the antenna connector of the module must be away from high-speed signal lines and strong interference sources to avoid crossing or parallel with any signal lines in adjacent layers. The length of the RF cable between the antenna pin of the module and the antenna connector should be as short as possible. The situation of crossing the entire PCB should be absolutely avoided.
MeiG Smart product technical information 5.2.4. MIPI MIPI is a high-speed signal line. Users must pay attention to protection during the layout stage, so that they are away from the signal lines that are easily interfered. The GND processing must be performed on the upper and lower sides, and the traces are differential pairs. 100 ohm differential impedance matching is performed. Ensure impedance consistency and do not bridge different GND planes as much as possible.
MeiG Smart product technical information the TDD interference of the DCS1800 frequency band is more serious. Therefore, the user can select the required filter capacitor according to the actual test result, and sometimes even do not need to paste the filter capacitor. The GSM antenna is the main source of coupling interference for TDD, so users should pay attention to keeping the audio trace away from the GSM antenna and VBAT during PCB layout and routing.
MeiG Smart product technical information 6. Electrical, Reliability 6.1 Absolute Maximum The table below shows the absolute maximum values that the module can withstand. Exceeding these limits can cause permanent damage to the module. Table 6.2: Absolute Maximum Parameter Minimum Typical Maximum Unit VBAT - - 6 V VBUS - - 10.5 V Peak current - - 3 A 6.2 Working Temperature The table below shows the operating temperature range of the module: Table 6.
MeiG Smart product technical information 6.5 SIM_VDD Characteristics Table 6.5: SIM_VDD Characteristics Parameter VO Minimum Typical Maximum - 3 - - 1.8 - - - 55 mA Description Minimum Typical Maximum Unit High level 1.4 - - V Low level - - 0.6 V Effective time 2000 Description Unit V Output voltage Output current IO 6.6 PWRKEY Feature Table 6.6: PWRKEY Characteristics Parameter PWRKEY ms 6.7 VCOIN Feature Table 6.
MeiG Smart product technical information current Call Current consumpt ion Digital transmissi on Imax Peak current GSM Standby power consumption - - 4.0 mA WCDMA Standby power consumption - - 3.9 mA TD-S Standby power consumption - - 4.0 mA CDMA Standby power consumption - - 3.8 mA FDD Standby power consumption 4.45 mA TDD Standby power consumption 3.5 mA GSM900 CH62 32dBm - - 250 mA WCDMA2100 CH10700 22.
MeiG Smart product technical information RX: 2937~3088 TX: 8762~8912 WCDMA B9 1850～1890MHz 1750～1785MHz WCDMA B19 875～890MHz 830～845MHz CDMA BC0 869～894MHz 824～849MHz 1～799 ；991～1023 TDSCDMA 1.
MeiG Smart product technical information channel is 40240 ~ 41240. 6.11 RF Characteristics The following table lists the conducted RF output power of the module, in accordance with 3GPP TS 05.05 technical specification, 3GPP TS 134121-1 standard. Table 6.10: Conducted Output Power Frequency band Standard output power (dBm) Output power tolerance (dBm) GSM850、EGSM900 33dBm ±2 DCS1800 30dBm ±2 WCDMA 24 dBm +1/-3 CDMABC0 25 dBm ±2 TDSCDMA 24 dBm +1/-3 LTE 23 dBm ±2.7 6.
MeiG Smart product technical information 6 7 8 9 10 11 12 13 14 ... 17 18 19 20 21 22 23 24 25 26 27 28 31 ... 33 34 35 36 37 38 39 40 41 -102.2 -101.7 -99.2 -98.7 - - - -100 -98 -97 -99 -100 -100 -97 -97 -97 -97 -95 -94 -96 -97 -97 -94 -94 -94 -94 -977 -97 -94 -97 -94 -97 -97 -93.5 -94.56 -95 -95.5 -97 -97 -97 -97 -97 -97 -97 -97 -95 -104.7 -101.7 -101.2 -102.7 -103.2 -99.0 -98.2 -99.7 -100.2 -100.2 -95.7 -97 -1007 -100 -97 -100 -97 -100 -100 -96.5 -97.56 -98 -98.5 -93.5 -106.2 -106.
MeiG Smart product technical information Receiving sensitivity 802.11B 802.11G 802.11N Minimum rate -96 -91 -90 dBm Maximum rate -89 -74 -72 dBm Transmission performance(5G) Transmit power (minimum rate) Transmit power (maximum rate) EVM (maximum rate) 802.11A 802.11N 802.11AC 16 15 14 dBm 13 12 10 dBm -25 -27 -32 dB Receiving performance(5G) Receiving sensitivity 802.11A 802.11N 802.11AC (20M) Minimum rate -89 -88.5 -88.5 dBm Maximum rate -74.5 -73 -67.
MeiG Smart product technical information 7. Production 7.1. Top And Bottom Views Of The Module Figure 48: Module top and bottom views 7.2. Recommended Soldering Furnace Temperature Curve Figure 49: Module recommended soldering furnace temperature curve 7.3. Humidity Sensitivity (MSL) The SLM758 module meets moisture sensitivity level 3.
MeiG Smart product technical information conditions of temperature <40 degrees and relative humidity <90%, the shelf life is at least 6 months without unpacking. After unpacking, Table 22 lists the shelf life of the modules for different moisture sensitivity levels. Table 7.
MeiG Smart product technical information 8. Support Peripheral Device List Peripheral devices can support the devices included in the platform QVL. The following are the software default adapters. Table 8.1: List of supported display models Vendor Drive IC Specification Zoneway HX8394F 1280x720 Zoneway OMT1287 1280x720 Drive IC Specification JinshengXin Vision GC8024 8M JinshengXin Vision OV5670 5M Sunny optical S5K3L8 8M Sunny optical S5K5E8 5M Table 8.
MeiG Smart product technical information GMEMS GMC303 3-Axis,14-bit Table 8.6: Support PS/ALS Sensor Model List Vendor Model Specification LITEON LTR-553ALS-01 ALS+PS Table 8.7: Support for Gyro Sensor Model List Vendor Model Specification Bosch BMI120 9-axis,16bit/16bit Table 8.
MeiG Smart product technical information 9. Appendix 9.1. Related Documents Table 9.1: Related documents Serial numb File name Comment er Digital cellular telecommunications (Phase 2+); AT command set for GSM [1] GSM 07.07： Mobile Equipment (ME) [2] GSM 07.10： Support GSM 07.10 multiplexing protocol [3] GSM 07.05： [4] GSM 11.14： [5] GSM 11.11： Digital cellular telecommunications system (Phase 2+);Specification of the Subscriber Identity Module – Mobile Equipment (SIM–ME) interface [6] GSM 03.
MeiG Smart product technical information Li-ion MO MS MT PAP PBCCH PCB PCL PCS PDU PPP RF RMS RX SIM SMS TDD TE TX UART URC USSD Phone book abbreviation FD LD MC ON RC SM NC Lithium-Ion Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated Password Authentication Protocol Packet Broadcast Control Channel Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Point-to-point protocol Radio Frequency Root Mean
MeiG Smart product technical information 9.3. Multiplexing function Table 9.
MeiG Smart product technical information 9.4. Safety Warning Pay attention to the following safety precautions when using or repairing any terminal or mobile phone that contains modules. The user should be informed of the following safety information on the terminal device. Otherwise, Meig will not be responsible for any consequences caused by the user not following these warning actions. Table 9.
MeiG Smart product technical information 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. 10.2.End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved.
MeiG Smart product technical information 10.4.Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
MeiG Smart product technical information Le dispositif utilisé dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal; Le gain d'antenne maximal autorisé pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit être conforme à la norme e.r.p. limite; et Le gain d'antenne maximal autorisé pour les appareils de la bande 5725-5825 MHz doit être conforme à la norme e.i.r.
