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MeiGProductManualofSLM750Module

SLM750ModuleHardwareDesign Page 1, total 84 pages

MeiG Product

Manual of SLM750

VersionNumber:V1.1

Company:MeiGSmartTechnologyCo.,Ltd

ReleasedDate:2018/8/13

Summary of content (84 pages)

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MeiG Product Manual of SLM750 Module MeiG Product Manual of SLM750 Version Number: V1.1 Company: MeiG Smart Technology Co.
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MeiG Product Manual of SLM750 Module IMPORTANT NOTICE COPYRIGHT NOTICE Copyright © MeiG Smart Technology Co., Ltd. All rights reserved. All contents of this manual are exclusively owned by MeiG Smart Technology Co., Ltd(MeiG Smart for short), which is under the protection of Chinese laws and copyright laws in international conventions. Anyone shall not copy, spread, distribute, modify or use in other ways with its contents without the written authorization of MeiG Smart.
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MeiG Product Manual of SLM750 Module Revising History Table 1: Revising records REVISION DATE DESCRIPTION V1.0 2018‐04‐01 Initial V1.
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MeiG Product Manual of SLM750 Module Contents 1 Introduction ............................................................................................................................................................ 8 1.1 Safety Information ....................................................................................................................................... 9 1.1 Safety Information ...........................................................................................................
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MeiG Product Manual of SLM750 Module 3.13 Network Status Indication ....................................................................................................................... 48 3.14 Status ....................................................................................................................................................... 49 3.15 ADC Function.........................................................................................................................................
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MeiG Product Manual of SLM750 Module Table TABLE 1: REVISING RECORDS .................................................................................................................................... 3 TABLE 2: SUPPORTED BAND OF SLM750V .............................................................................................................. 11 TABLE 3: LIST OF MAIN FEATURES OF THE MODULE .................................................................................................
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MeiG Product Manual of SLM750 Module Figure FIGURE 1 FUNCTIONAL DIAGRAM ............................................................................................................................ 15 FIGURE 2 PIN ASSIGNMENT ...................................................................................................................................... 17 FIGURE 3 SLEEP MODE APPLICATION WITH USB REMOTE WAKING-UP FUNCTION ....................................................
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MeiG Product Manual of SLM750 Module 1 Introduction This document defines SLM750 modules and describes its air interface and hardware interface which are connected with your application. The document can help you quickly understand SLM750 interface specifications, electrical and mechanical details and other related product information. Associated with application notes and user guide, you can apply SLM750 in wireless applications easily.
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MeiG Product Manual of SLM750 Module 1.1 Safety Information Observing the following safety information can keep you safe and protect the product and its working environment from potential damage. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Stop the car before you make a call. Switch off the mobile terminal devices before boarding an aircraft.
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MeiG Product Manual of SLM750 Module 1.2 Purpose This document describes basic functions and main features of SLM750 wireless module, as well as hardware interface and its application, features of structure and electronics, and power index, in order to guide you to embed SLM750 in various application terminals. 1.
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MeiG Product Manual of SLM750 Module 2 Product Overview 2.1 Basic Description SLM750 is a wireless communication module of TD-LTE/FDD LTE/TD-SCDMA/WCDMA/ EVDO/CDMA/GSM with diversity receiving function. It supports TD-LTE and FDD LTE, and downwards compatible with DC-HSPA+ of WCDMA, TD-HSPA of TD-SCDMA, network data connection of EVDO RevB, which provides functions of voice, analog voice, SMS, and communication for your applications. The module has 3 sub-modes: SLM750VC, SLM750VE, SLM750VA.
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MeiG Product Manual of SLM750 Module Table 3: List of main features of the module Parameter Description Power supply                    Transmit power LTE features WCDMA features TD-SCDMA features CDMA features GSM features SLM750 Module Hardware Design VBAT supply voltage range: 3.3V～4.2V Typical supply voltage: 3.
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Network protocol features Short message service Multimedia message service USIM card interface Audio features PCM interface USB interface Serial port RX-diversity AT command Network indication SLM750 Module Hardware Design MeiG Product Manual of SLM750 Module  Support EDGE multi-slot class 12(default 12)  Support GMSK and 8-PSK  Downlink coding format: CS 1-4 and MCS 1-9  Uplink coding format: CS 1-4 and MCS 1-9  Support TCP/UDP/PPP/FTP/HTTP/SMTP/MMS/NTP/PING /QMI protocol  Support PAP(Password
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Antenna interface  Physical features Software upgrade RoHS        Ambient humidity ESD   Temperature range   Interface LCC function interface                  MeiG Product Manual of SLM750 Module Include main antenna(ANT_MAIN),RX-D diversity antenna(ANT_DIV) and GNSS antenna(ANT_GNSS) Size: 32.0×29.0×2.
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MeiG Product Manual of SLM750 Module  Radio frequency  Peripheral interface ANT_MAIN ANT_GNSS ANT_DIV Switch SAW Switch LNA SAW Duplex VBAT_RF APT PA PRx DRx NAND DDR2 SDRAM Tx Transceiver VBAT_BB Control IQ PMIC Control PWRKEY RESET_N 30 Baseband ADCs STATUS 19.2M XO VDD_EXT USB USIM PCM I2C UARTs WLAN BT GPIOs SD SGMII Figure 1 Functional Diagram 2.
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MeiG Product Manual of SLM750 Module 3 Application Interface 3.
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MeiG Product Manual of SLM750 Module Reserved 55 GND 56 I2C_SCL BT_CTS BT_RXD BT_TXD BT_RTS 144 I2C_SDA 48 Reserved GND 49 ADC1 ANT_MAIN 50 ADC0 GND 51 GND GND 52 ANT_GNSS GND 53 Reserved GND 54 Reserved GND 3.
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MeiG Product Manual of SLM750 Module Input output Digital input Digital output Power input Power output Analog input Analog output Open drain IO DI DO PI PO AI AO OD Table 5: Pin description Power Supply Pin name I/O Description DC features Note VBAT_BB Pin number 59,60 PI Power supply for module baseband VBAT_RF 57,58 PI Power supply for module RF VDD_EXT 7 PO 1.8V output Vmax=4.2V Vmin=3.3V Vnorm=3.8V Vmax=4.2V Vmin=3.3V Vnorm=3.8V Vnorm=1.
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STATUS 61 OD NET_MODE 5 OD NET_STATU S 6 OD USB interface Pin name MeiG Product Manual of SLM750 Module Indicate the Driving current Require external module operating should be less pull-up. If unused, status than 0.9mA keep it open Indicate the VOHmin=1.35V 1.8V power module network VOLmax=0.45V domain, require registration status external pull-up. If unused, keep it open Indicate the VOHmin=1.35V 1.8V power module network VOLmax=0.45V domain, require running status external pull-up.
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USIM_RST 17 DO MeiG Product Manual of SLM750 Module VOHmin=2.55V USIM card reset 1.8V USIM: line VOLmax=0.45V VOHmin=1.35V USIM_PRESE NCE 13 DI USIM card detection USIM_VDD 14 PO USIM card supply voltage USIM_GND 10 Main serial port Pin name RI Pin number 62 3.0V USIM: VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V USIM: Vmax=1.9V Vmin=1.7V 3.0V USIM: Vmax=3.05V Vmin=2.
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RTS 65 Debug serial port Pin name Pin number DBG_TXD 12 DBG_RXD ADC interface Pin name 11 ADC0 Pin number 45 ADC1 44 USB_BOOT interface Pin name Pin number USB_BOOT 115 DO I/O MeiG Product Manual of SLM750 Module VOHmin=1.35V domain. If unused, keep it open. DTE requires to VILmin=-0.3V 1.8V power transmit data VILmax=0.6V domain. VIHmin=1.2V If unused, keep VIHmax=2.0V it open. Description DC features DO Transmit data VOLmax=0.45V VOHmin=1.35V DI Receive data VILmin=-0.3V VILmax=0.
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PCM_OUT 25 DO PCM_CLK 27 IO PCM_SYNC 26 IO CDC_I2S_MC LK 116 DO MeiG Product Manual of SLM750 Module VIHmin=1.2V If unused, keep VIHmax=2.0V it open. PCM data output VOLmax=0.45V 1.8V power VOHmin=1.35V domain. If unused, keep it open. PCM clock VOLmax=0.45V 1.8V power VOHmin=1.35V domain. In master VILmin=-0.3V mode, it is an output signal. In VILmax=0.6V slave mode, it is an VIHmin=1.2V VIHmax=2.0V input signal. If unused, keep it open. PCM data VOLmax=0.45V 1.8V power synchronous VOHmin=1.
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MeiG Product Manual of SLM750 Module impedance ANT_GNSS 47 AI GNSS antenna I/O Description WAKEUP_IN Pin number 1 DI Sleep mode input control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V AP_READY 2 DI Application processor sleep state detection VOLmax=0.45V VOHmin=1.35V WAKEUP_O UT_N 3 DO Sleep mode output VOLmax=0.45V VOHmin=1.35V W_DISABLE # 4 DI Flight mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.
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BT_CTS* 40 DI BT_EN* 139 DO WLAN_SLP_C LK 118 DO PM_ENABLE 127 DO SDC1_DATA3 129 IO SDC1_DATA2 130 IO SDC1_DATA1 131 IO SDC1_DATA0 132 IO SDC1_CLK 133 DO SDC1_CMD 134 DO SLM750 Module Hardware Design MeiG Product Manual of SLM750 Module VIHmin=1.2V If unused, keep it VIHmax=2.0V open. Bluetooth serial VOLmax =0.45V 1.8V power sending clearance VOHmin =1.35V domain. If unused, keep it open. Bluetooth enables VOLmax =0.45V 1.8V power VOHmin =1.35V domain.
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WAKE_ON_ WIRELESS 135 DI WLAN_EN 136 DO COEX_UART _RXD 137 DI COEX_UART _TXD 138 DO SD card Interface Pin name Pin number SD_INS_DET 23 I/O MeiG Product Manual of SLM750 Module instruction signal VOHmin=1.35V domain. If unused, keep it open. WLAN wakes the V ILmin=-0.3V 1.8V power module VILmax=0.6V domain. Active VIHmin=1.2V low level. VIHmax =2.0V If unused, keep it open. WLAN enables VOLmax=0.45 1.8V power VOHmin=1.35V domain. Active high level. If unused, keep it open.
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MeiG Product Manual of SLM750 Module VOHmin =1.4V unused, keep it open. 3.0V SD card: SD_DATA3 28 IO SD card SDIO signal data line 3 SD_DATA2 29 IO SD card SDIO signal data line 2 SD_DATA1 30 IO SD card SDIO signal data line 1 SLM750 Module Hardware Design VOLmax=0.38V VOHmin=2.01V 1.8V SD card: VOLmax=0.45 VOHmin=1.4V V ILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax =2.0V 3.0V SD card: VOLmax=0.38V VOHmin=2.01V V ILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V SD card: VOLmax=0.
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SD_DATA0 SGMII Pin Pin name EPHY_RST_ N* 31 Pin number 119 IO I/O MeiG Product Manual of SLM750 Module VIHmax=3.34V Refer to SD3.0 SD card SDIO 1.8V SD card: protocol. If signal data line 0 VOLmax=0.45 VOHmin=1.4V unused, keep it open. V ILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax =2.0V 3.0V SD card: VOLmax=0.38V VOHmin=2.01V V ILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.
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* SGMII_TX_ M* 123 AO SGMII_TX_P * 124 AO SGMII_RX_P * 125 AI SGMII_RX_ M* 126 AI Reserved Pins 18，43，55， RESERVED MeiG Product Manual of SLM750 Module power supply domain, require external pull-up level for SGMII SDIO Pin SGMII data If unused, keep it transmit negative open. signals SGMII data If unused, keep it transmit positive open. signals SGMII data If unused, keep it receive positive open. signals SGMII data If unused, keep it receive negative open.
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EDGE DATA CDMA Mode CDMA IDLE EVDO Mode CDMA DATA EVDO IDLE WCDMA Mode EVDO DATA WCDMA IDLE WCDMA TALK WCDMA DATA HSPA Mode HSPA IDLE HSPA DATA TD-SCDMA Mode TD-SCDMA IDLE TD-SCDMA TALK TD-SCDMA DATA TD-HSPA Mode TD-HSPA IDLE TD-HSPA SLM750 Module Hardware Design MeiG Product Manual of SLM750 Module consumption is decided by net setting and related settings of EDGE.
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MeiG Product Manual of SLM750 Module DATA consumption is decided by net settings(eg. Power control level), data uplink and downlink rate and related settings of TD-HSPA. TD-LTE Mode TD-LTE IDLE The module is ready for TD-LTE data transfer. No data sending or receiving at this time. The power consumption is decided by net setting. TD-LTE DATA TD-LTE data transfer is ongoing; the power consumption is decided by net setting(eg. Power control level), data uplink and downlink rate and related settings of TD-LTE.
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MeiG Product Manual of SLM750 Module preconditions can let the module enter into sleep mode.  Execute AT+SLEEPEN=1 command to enable sleep mode.  Keep WAKEUP_IN to high level.  Host USB interface connecting to the module enters into suspend state.  Sending data to SLM750 from USB will wake up the module.
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MeiG Product Manual of SLM750 Module or at + sleepen=0 to enable or disable sleep function of the module. When the module sleep function is disabled, the module sleep related pin will be invalid, USB PHY will not enter the low power (LPM) when the USB bus is suspended.
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MeiG Product Manual of SLM750 Module  Two VBAT_RF pins are used to supply RF power.  Two VBAT_BB pins are used to supply Baseband power. Below table shows the assignment of power and ground pins: Table 7: Related power supply interfaces Pin name Pin No. VBAT_BB 59,60 VBAT_RF 57,58 GND 8,9,19, 22,36,46,48,50~54, 56,72, 85~112 Description Min value Power supply 3.3 for module baseband Power supply 3.3 for module RF Ground - Typical Max value value 3.8 4.2 V 3.8 4.2 V - V 0 Unit 3.6.
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MeiG Product Manual of SLM750 Module Figure 4 Power requirements for burst transmission In order to reduce voltage drop, a low ESR 100uF filter capacitor is needed. The multilayer ceramic capacitor (MLCC) has the best ESR, suggestion to add three ceramic capacitors (100nF, 33pF, 10pF) to VBAT_BB and VBAT_RF pins, and the capacitors should be placed close to the VBAT pin. When external power supply makes connection to module, VBAT_BB and VBAT_RF need to apply star line.
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MeiG Product Manual of SLM750 Module Figure 6 DC power supply circuit 3.6.4 VDD_EXT voltage output If SLM750 module turns on normally, there is a voltage output of 1.8V, current load 80mA in PIN7. You can use the output voltage as external power supply, for example level reference, and judge if the module is turned on by reading pin level status. 3.7 Turn On and Off 3.7.1 Turn on module using the PWRKEY Table 7.
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MeiG Product Manual of SLM750 Module Figure 7 Turn on the module using driving circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection.
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MeiG Product Manual of SLM750 Module Figure 9 Timing of turning on module Note: 1. Tnote > 30ms. 2. If the external pull up design of PWRKEY pin is added, it is recommended that the pull-up level range is 1.3V~2.1V 3.7.2 Turn off module using the PWRKEY pin Modules can be shut down in the following ways:  normal shutdown: shutdown through PWRKEY pin control module;  normal shutdown: shutdown through AT command 3.7.2.
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MeiG Product Manual of SLM750 Module then the module will perform the shutdown process. The shutdown sequence is shown in the following figure: Figure 10 Timing of turning off module 3.7.2.2 AT command shutdown The AT + Poweroff command can be used to control the shutdown of module. This shutdown process is equivalent to a pulled-down PWRKEY pin shutdown process. NOTES: 1. When the module works properly, do not immediately cut off the module power to avoid damage to the module internal Flash data.
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MeiG Product Manual of SLM750 Module 3.8.1 Hardware reset When the module is in operation, puling down 150~460ms of the RESET_N pin to reset module. The RESET_N signal is sensitive to interference. Table 8: RESET_N pin description Pin name RESET_N Pin number 20 Function Reset module DC features VIHmax=2.1V VIHmin=1.3V VILmax=0.5V Description Reference circuit is as follows: you can use open set driver circuit or button to control RESET_N pin.
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MeiG Product Manual of SLM750 Module Figure 13Reset timing of RESET_N 3.8.2 AT command reset Enter AT+RESET command in SLM750VUART or USB AT interface to reset and restart SLM750. 3.9 USIM/SIM Card Interface USIM card interface meets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and 3.
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MeiG Product Manual of SLM750 Module SLM750 supports USIM card hot plugging and hot plugging function is turned off by default. The following figure shows USIM_PRESENCE pin high level, no card, USIM_PRESENCE pin ground after inserting card on SIM card connector. SLM750 supports USIM hot plugging function through the USIM_PRESENCE pin, support high-level detection, and the default hot-plugging function is turned off by default.
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MeiG Product Manual of SLM750 Module In order to enhance the reliability and availability of the USIM card in your application, please follow the criteria below in the USIM circuit design:  USIM_DATA requires a pull-up resistor of 15kΩ to USIM_VCC; the pull-up resistor helps to increase SIM card's anti-interference ability. When USIM card trace is too long or it is close to the interference source, it is recommended that you add a pull-up resistor near the card.
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MeiG Product Manual of SLM750 Module 3.10.1 USB pin description SLM750 module provides a USB2.0 High-Speed interface. Table 10: USB interface description Name USB_DM Pin name 70 I/O IO Description USB differential signal- Note data Require differential impedance data Require differential impedance USB_DP 69 IO USB differential signal+ GND USB_VBUS 72 71 PI Ground USB power supply, used for USB detection 90Ω 90Ω Typical value 5.0V 3.10.
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MeiG Product Manual of SLM750 Module  The module USB_VBUS is not used to power the module, but is used to detect the insertion and pull-out of the USB.  In order to reduce the signal interference of USB high speed data transmission, connect R1 and R2 between USB_DM and USB_DP interface circuit to improve the data transmission rate. It is recommended that you use R1 and R2 of 0Ω.
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MeiG Product Manual of SLM750 Module  Debug UART interface supports 115200bps baud rate. It can be used for Linux console, log print. Table 11: Main UART pin description Pin name RXD Pin number 68 I/O DI TXD 67 DO CTS 64 DI RTS 65 DO RI 62 DO DCD 63 DO DTR 66 DI Description Receive data Note 1.8V power domain Transmit data 1.8V power domain Clear to send 1.8V power domain. If unused, keep it open DTE requires to 1.8V power transmit data domain.
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MeiG Product Manual of SLM750 Module Parameter VIL VIH VOL VOH Min -0.3 1.2 0 1.35 Max 0.6 2.0 0.45 1.8 Unit V V V V SLM750 provides 1.8V serial port. If your application serial port is 3.3V, you need to add level converter. It is recommended that you use TXB0104PWR from TI Company. Reference design is shown as follows: Figure 17 Reference circuit of level conversion chip 3.
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MeiG Product Manual of SLM750 Module on the rising edge; the PCM_SYNC rising edge represents the more significant bit. The mode only supports 128 kHz PCM_CLK and 8kHz, 50% duty cycle PCM_SYNC. SLM750 supports 8-bit A-law, u-law and 16-bit linear encoding formats. The following figures show the timing relationship in short frame mode with PCM_SYNC=8 kHz and PCM_CLK=2048kHz, as well as the timing relationship in long frame mode with PCM_SYNC=8 kHz and PCM_CLK=128kHz.
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MeiG Product Manual of SLM750 Module Table 14: Pin description for PCM interface Pin name I/O Description PCM_CLK Pin number 27 IO PCM clock PCM_OUT 25 DO PCM_IN 24 DI PCM_SYNC 26 IO I2C_SCL 41 OD I2C_SDA 42 OD Note 1.8V power supply domain PCM data output 1.8V power supply domain PCM data input 1.8V power supply domain PCM data 1.8V power supply synchronous signal domain Require 1.8V external I2C clock pulling-up Require 1.
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NET_STATUS 6 DO NET_MODE 5 DO MeiG Product Manual of SLM750 Module 1.8V power Indicate the module network supply domain activity status. Indicate the module network registration mode. 1.8V power supply domain Table 16: Working State of the Network Indicator Mode NET_MODE NET_ STATUS Status Description Register LTE network status High level Low level Others Flicker (200ms OFF/1400ms Data transfer status ON) High level Registration success Low level Others 3.
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MeiG Product Manual of SLM750 Module Figure 21 Reference circuit of STATUS 3.15 ADC Function SLM750 provides two analogy- to-digital converters. Using AT+ADCREAD=1 to read the voltage value of ADC0. Using AT+ADCREAD=6 read the voltage value of ADC1. Table 18: ADC pin description Voltage range Pin name Pin no. Description ADC0 45 Analogy to digital 0.05 – 1.8V converter interface 0 ADC1 44 Analogy to digital 0.05 – 1.8V converter interface 1 Resolution 15bits 15bits NOTES: 1.
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MeiG Product Manual of SLM750 Module EPHY_INT_N 120 DI SGMII_MDATA 121 IO SGMII_MCLK 122 DO USIM2_VDD 128 PO SGMII_TX_M 123 AO SGMII_TX_P 124 SGMII_RX_P 125 SGMII_RX_M 126 Ethernet PHY interruption SGMII MDIO data SGMII MDIO clock SGMII MDIO power supply SGMII data transmit negative signals AO SGMII data transmit positive signals AI SGMII data receive positive signals AI SGMII data receive negative signals 1.8V /2.85V power domain. 1.8V/2.85V power domain. 1.8V/2.
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MeiG Product Manual of SLM750 Module Figure 23 Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in your application, please follow the criteria below in the Ethernet PHY circuit design:  Keep SGMII data and control signals away from RF and VBAT trace.  Keep the maximum trace length less than 25.4cm and keep skew on the differential pairs less than 0.7mm.  The differential impedance of SGMII data trace is 100 ohm±10%.
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MeiG Product Manual of SLM750 Module WLAN part Pin name SDC1_DATA3 Pin number 129 SDC1_DATA2 130 SDC1_DATA1 131 SDC1_DATA0 132 SDC1_CLK 133 SDC1_CMD 134 WLAN_EN 136 Coexistence and control part Pin name Pin number PM_ENABLE 127 WLAN_SLP_CLK WAKE_ON_WIREL ESS* COEX_UART_RX 118 135 137 COEX_UART_TX 138 I/O Description IO WLAN SDIO signal data line 3 IO WLAN SDIO signal data line 2 IO WLAN SDIO signal data line 1 IO WLAN SDIO signal data line 0 DO WLAN SDIO signal clock IO WLAN SDIO instruction
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MeiG Product Manual of SLM750 Module signal. The following figure shows a reference design of Wireless Connectivity interfaces with SLM158 module.
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MeiG Product Manual of SLM750 Module signal trace is 50 ohm (±10%).  Protect other sensitive signals/circuits (RF, analog signals, etc.) from SDIO corruption and protect SDIO signals from noisy signals (clocks, DCDCs, etc.).  It is recommended to keep matching length between CLK and DATA/CMD less than 1mm and total routing length less than 50mm.
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MeiG Product Manual of SLM750 Module SD_DATA1 30 SD_DATA0 130 VDD_SDIO 34 SD_INS_DET 23 IO SD card SDIO SDIO signal level can be selected signal data line according to the signal level 1 supported by SD card. Please refer to SD3.0 protocol for details. suspend it when no used IO SD card SDIO SDIO signal level can be selected signal data line according to the signal level 0 supported by SD card. Please refer to SD3.0 protocol for details. suspend it when no used PO SD card SDIO The output 2.85V/1.
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MeiG Product Manual of SLM750 Module between the module and the SD card. The bypass capacitors C1~C6 are reserved with no mounting by default. All resistors and bypass capacitors should be placed close to the module.  In order to offer good ESD protection, it is recommended to add TVS on SD card pins.  It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50 ohm (±10%).
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MeiG Product Manual of SLM750 Module The following figure shows reference Circuit of USB_ROOT Interface: Figure 26 Circuit of USB_ROOT Interface 4 GNSS 4.1 General Description SLM750 includes an integrated embedded GNSS solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou). SLM750 supports standard NMEA-01830183 protocol, and outputs NMEA sentences with 1Hz via USB interface by default. 4.2 GNSS Performance The following table shows SLM750 GNSS performance.
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MeiG Product Manual of SLM750 Module (open) Altitude <4m (50%); <8m (90%) Speed accuracy Speed <0.2m/s First positioning time Cold start 32s TTFF Warm start 29s Hot start 2s Sensitivity Capturing -154dBm Tracking -156dBm Serial output baud rate 300bit/s~230400bit/s GPS receiving 12 channel,GPS L1(1575.42MHz),C/A code Data update rate 1Hz Data format NMEA 0183 4.
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MeiG Product Manual of SLM750 Module diversity antenna to improve WCDMA/TDD-LTE/FDD-LTE receiving performance of the product. It is recommended that you use a 50Ω impedance antenna that matches the RF connector of the module. Special note: In order to ensure the communication ability of all frequency bands, connect both the main and the auxiliary antennas. It is suggested that you chose RF adapter carefully on application end.
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MeiG Product Manual of SLM750 Module Figure 27 RF reference circuit GNSS antenna reference design is shown as below: Figure 28 GNSS antenna reference circuit SLM750 Module Hardware Design Page 61, total 84 pages
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MeiG Product Manual of SLM750 Module Note: 1. You can choose external LDO power supply according to active antenna. 2. You can choose passive antenna design so you do not need to design VDD circuit. 5.3 Antenna Installation 5.3.1 Antenna requirements The main antenna, diversity antenna and GNSS antenna requirements are as follows: Table 25: Antenna requirements Type GNSS Requirement Frequency range: 1561-1615MHz Polarization: RHCP or linear VSWR: < 2(Typ.
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MeiG Product Manual of SLM750 Module Table 26: RF output power Network mode GSM CDMA EVDO WCDMA TD-SCDMA TD-LTE FDD LTE Band 900(GMSK) 1800(GMSK) 900(8-PSK) 1800(8-PSK) BC0 BC0 Band1 Band8 Band34 Band39 Band38 Band39 Band40 Band41 Band1 Band3 Band5 Band8 Band28 Max 33dBm ± 2dB 30dBm ± 2dB 27dBm ± 3dB 26dBm +3/-4dB 23-30dBm 23-30dBm 24dBm +1/-3dB 24dBm +1/-3dB 24dBm +1/-3dB 24dBm +1/-3dB 23dBm ± 2.7 dB 23dBm ± 2.7 dB 23dBm ± 2.7 dB 23dBm ± 2.7 dB 23dBm ± 2.7 dB 23dBm ± 2.7 dB 23dBm ± 2.7 dB 23dBm ± 2.
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MeiG Product Manual of SLM750 Module 5.3.
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MeiG Product Manual of SLM750 Module FDD LTE Band39 Band40 Band41 Band1 Band3 Band5 Band8 Band28 19 19 19 19 19 19 19 19 <-94 <-94 <-94 <-92 <-93 <-92 <-92 <-92 Table 30: Diversity antenna requirements Mode WCDMA TD-LTE FDD LTE Band Band1 Band8 Band38 Band39 Band40 Band41 Band1 Band3 Band5 Band8 Band28 VSWR <2.5: 1 Gain /Avg. >-7dBi Efficiency >20% ρ <0.5 Isolation <-8dB 6 Electrical characteristics 6.
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MeiG Product Manual of SLM750 Module USB_VBUS GPIO VBAT_RF maximum current Instantaneous voltage drop (GSM 900 Maximum transmission power level) USB detection Level power supply voltage of digital IO Power supply voltage of shutdown mode 0 3.0 -0.3 5.0 1.8 -0.25 1.8 400 A mV 5.25 2.0 V V 0.25 V 6.2 Temperature range It is recommended that you use SLM750 at -30℃~+75℃ and take temperature control measures when applications are in the harsh environment conditions.
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MeiG Product Manual of SLM750 Module Table 34: Electrical characteristics in power supply status Parameter VBAT USIM_VDD I/O I O Min 3.3 1.7/2.75 Type 3.8 1.8/2.85 Max 4.2 1.9/2.95 Unit V V 6.4 Module Power Consumption Range The following table shows the consumption of SLM750 in various modes. Contact us if you need more information about the band.
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MeiG Product Manual of SLM750 Module Idle mode SLM750 Module Hardware Design LTE-TDD Band PF=128(USB disconnected) LTE-TDD Band PF=128(USB disconnected) LTE-TDD Band PF=128(USB disconnected) LTE-TDD Band PF=128(USB disconnected) LTE-TDD Band PF=256(USB disconnected) LTE-TDD Band PF=256(USB disconnected) LTE-TDD Band PF=256(USB disconnected) LTE-TDD Band PF=256(USB disconnected) LTE-FDD Band PF=128(USB disconnected) LTE-FDD Band PF=128(USB disconnected) LTE-FDD Band PF=128(USB disconnected) LTE-FDD Band P
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MeiG Product Manual of SLM750 Module GSM 850 DRX=5 (USB 19.8 disconnected) 38.6 GSM 850 DRX=5 (USB connected) WCDMA Band 1 19.2 PF=64(USB disconnected) 39.2 WCDMA Band 1 PF=64(USB connected) WCDMA Band 5 PF= 20.2 64(USB disconnected) 39.6 WCDMA Band 5 PF= 64(USB connected) WCDMA Band 8 PF= 18.6 64(USB disconnected) 38.7 WCDMA Band 8 PF= 64(USB connected) TD-SCDMA Band 34 21 PF=64(USB disconnected) 33.6 TD-SCDMA Band 34 PF=64(USB connected) TD-SCDMA Band 39 25 PF=64(USB disconnected) 36.
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MeiG Product Manual of SLM750 Module LTE-FDD Band 3 PF=64(USB disconnected) LTE-FDD Band 3 PF=64(USB connected) LTE-FDD Band 5 PF=64(USB disconnected) LTE-FDD Band 5 PF=64(USB connected) LTE-FDD Band 8 PF=64(USB disconnected) LTE-FDD Band 8 PF=64(USB connected) LTE-FDD Band 20 PF=64(USB disconnected) LTE-FDD Band 20 PF=64(USB connected) GPRS data GSM900 4DL/1UL@30.4dBm transfer(GNSS GSM900 3DL/2UL@30.4dBm shut down) GSM900 2DL/3UL@30.3dBm mA 27.6 49.2 mA 24.9 48.6 mA 22.7 49.8 mA 154.4 228.
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MeiG Product Manual of SLM750 Module 3DL/2UL@28.8dBm WCDMA transfer LTE transfer DCS1800 2DL/3UL@24.63dBm DCS 1DL/4UL@23.6dBm GSM 4DL/1UL@25.7dBm GSM 3DL/2UL@25.3dBm GSM 2DL/3UL@25.3dBm GSM 1DL/4UL@25.3dBm data WCDMA Band HSDPA@23.274dBm WCDMA Band HSUPA@23.273dBm WCDMA Band HSDPA@23.197dBm WCDMA Band HSUPA@23.197dBm WCDMA Band HSDPA@23.374dBm WCDMA Band HSUPA@23.374dBm data FDDLTE Band 10M@22.20dBm FDDLTE Band 10M@22.30dBm FDDLTE Band 10M@23.00dBm FDDLTE Band 10M@23.10dBm FDDLTE Band 10M@22.
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MeiG Product Manual of SLM750 Module GSM voice call GSM900 PCL=5 @32.21dBm 237.1 mA DCS1800 PCL=0 @28.14dBm 200.7 mA GSM850 PCL=5 @32.12dBm voice BC0 @20.31dBm 243.9 556 mA mA 461.8 574.3 mA mA 559 mA CDMA call WCDMA voice WCDMA Band 1@23.1dBm call WCDMA Band 5@22.0dBm WCDMA Band 8@22.8dBm 6.
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MeiG Product Manual of SLM750 Module 1) Contact discharge shall pass ±4KV test grade 2) Air discharge shall pass ±8KV test grade 3、the module tests other interfaces, ESD meets: 1) Air discharge shall pass ±0.5KV test grade 2) Air discharge shall pass ±1KV test grade 6.6 ESD Characteristics SLM750 is a consumer terminal product.
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MeiG Product Manual of SLM750 Module 7 Mechanical Dimensions 7.
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MeiG Product Manual of SLM750 Module Figure 30 Module bottom dimensions (unit: mm) SLM750 Module Hardware Design Page 75, total 84 pages
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MeiG Product Manual of SLM750 Module 7.
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MeiG Product Manual of SLM750 Module 7.3 Top View of the Module Figure 32 Top view of the module 7.
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MeiG Product Manual of SLM750 Module 8 Storage and Manufacturing 8.1 Storage SLM750 is stored in sealed vacuum bag. The restrictions of storage condition are shown as below: 1. Shelf life in sealed bag is 12 months at <40℃/90%RH. 2. After this bag is open, devices that will be subjected to reflow soldering or other high temperature processes must be:  Stored at <10%RH.  Mounted within 72 hours at factory conditions of ≤ 30℃/60%RH. 3.
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MeiG Product Manual of SLM750 Module 8.2 Manufacturing and Welding Figure 34 Reflow soldering temperature profile 8.3 Packing SLM750 uses pallet packaging.
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MeiG Product Manual of SLM750 Module Figure 35 Pallet packaging(Unit: mm) SLM750 Module Hardware Design Page 80, total 84 pages
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MeiG Product Manual of SLM750 Module 9 Appendix A References 9.1 Related Documents  SLM750 specifications;  SLM750 AT command set;  SLM750 EVB user manual;  SLM750 reference design circuit;  SLM750 application service process manual. 9.
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MeiG Product Manual of SLM750 Module IEC IMEI MEID I/O ISO ITU bps LED M2M MO MT NTC PC PCB PCS PCM PCS PDU PPP PS QPSK SIM TCP/IP UART USIM UMTS USB WCDMA TD-SCDMA TD-LTE FDD LTE Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VOHmax VOHmin VOLmax VOLmin International Electro-technical Commission International Mobile Equipment Identity Mobile Equipment Identifier Input/Output International Standards Organization International Telecommunications Union bits per second Light Emitting Diode Machine to machine Mob
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MeiG Product Manual of SLM750 Module 10 Appendix B GPRS Coding Scheme Table 39: Description of coding schemes Mode Coding speed USF Pre-coded USF Radio Block excl.USF and BCS BCS Tail Coded Bits Punctured Bits Data rate Kb/s CS-1 1/2 3 3 181 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16 456 21.4 FCC Statement FCC Label: The FCC ID is on the front of the device. It is easily visible. The device FCC ID is 2APJ4-SLM750V.
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MeiG Product Manual of SLM750 Module band emissions) with the Radio essential requirements. The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in the Part 15 Subpart B or emissions are complaint with the Radio aspects. FCC RF Exposure Requirements This device complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.