MeiG Smart product technical information SLM500 Hardware Design Guide Released Date: 2020/07 File name: SLM500 Hardware Design Guide Version Number: V1.00 Company: MeiG Smart Technology Co.
MeiG Smart product technical information IMPORTANT NOTICE COPYRIGHT NOTICE Copyright © MeiG Smart Technology Co., Ltd. All rights reserved. All contents of this manual are exclusively owned by MeiG Smart Technology Co., Ltd(MeiG Smart for short), which is under the protection of Chineselawsandcopyrightlaws in international conventions. Anyone shall not copy, spread, distribute, modify or use in other ways with its contents without the written authorization of MeiG Smart.
MeiG Smart product technical information SLM500 Hardware Design Guide_V1.
MeiG Smart product technical information Foreword Thank you for using the SLM500 module from Meg Smart. This product can provide data communication services. Please read the user manual carefully before use, you will appreciate its perfect function and simple operation method. The company does not assume responsibility for property damage or personal injury caused by improper operation of the user.
MeiG Smart product technical information Contents Introduction.......................................................................................................................................................... 8 Module overview .................................................................................................................................................. 8 2.1 Summary of features........................................................................................................
MeiG Smart product technical information 6.3 Working Voltage .......................................................................................................................................... 61 6.4 Digital Interface Features............................................................................................................................ 61 6.5 SIM_VDD Characteristics ..........................................................................................................................
MeiG Smart product technical information Version History Date 2020-07-02 Version 1.
MeiG Smart product technical information 1. Introduction This document describes the hardware application interface of the module, including the connection of the circuit and the RF interface. It can help users quickly understand the interface definition, electrical performance, and structural dimensions of the module. Combining this document with other application documents, users can quickly use modules to design mobile communication applications. 2.
MeiG Smart product technical information 2.1 Summary of features Table 2.1：SLM500 features Product characteristics Description CPU Quad-core A53 (64bit) 1.3GHz GPU Adreno 308 @485MHz System memory 8GB eMMC + 1GB LPDDR3 compatible with 16GB+2GB OS Android 10 Size 40.5x40.5x2.8mm，LCC 146pin+LGA 128pin RF band-SLM500A FDD-LTE: B2/4/5/7/12/13/17/25/26/66 WCDMA: B2/4/5 GSM: B2/5 Wi-Fi IEEE 802.11b/g/n 2.4G 802.11a/n 5G Bluetooth BT 4.
MeiG Smart product technical information Input Device Reset Key（Power on/off, Reset , Home, Volume+, Volume-） Capacitive TP Support HW reset Interface Main function description name VBAT 4pin，Power input，3.4V～4.2V，Nominal value3.8V SDIO *1 TF Card，Support 32GB max Support OTG USB USB_BOOT（Force USB boot for emergency downloads） BLSP ports UART*3 I2C*5 Application interface SPI (master only) ADC*1 PWM*1 Support Support Support Support Max up to 1.
MeiG Smart product technical information 2.2 Block diagram The following figure lists the main functional parts of the module: baseband chip power management chip Transceiver chip WCN3660-WIFI/BT Two in one chip Antenna interface LCD/CAM-MIPI interface EMCP memory chip AUDIO interface UART、SD card interface，SIM card interface，I2Cinterface,etc. Figure 2.
MeiG Smart product technical information 3. Module Package 3.1.Pin distribution diagram Figure 3.
MeiG Smart product technical information 3.2. Pin definitions table 3.1：Pin description Pin number Pin number I/O Description The power supply VBAT 1、2、145、146 VBUS 141、142 I I/O Comment The module provides Four VBAT power pin pins. The SLM500 operates from a single supply with a voltage range from 3.4V to 4.2V for VBAT. 5V charging input power. When the VBAT of the system power is absent, the external backup battery provides power to the system real-time clock.
MeiG Smart product technical information 250、251、255、 256、258、259、 261、266、268、 269、271~274 display interface (MIPI) MIPI_DSI0_CLK_M 52 I/O MIPI_DSI0_CLK_P 53 I/O MIPI_DSI0_LANE0_M 54 I/O MIPI_DSI0_LANE0_P 55 I/O MIPI_DSI0_LANE1_M 56 I/O MIPI_DSI0_LANE1_P 57 I/O MIPI_DSI0_LANE2_M 58 I/O MIPI_DSI0_LANE2_P 59 I/O MIPI_DSI0_LANE3_M 60 I/O MIPI_DSI0_LANE3_P 61 I/O GPIO61_LCD_RST_N 49 O GPIO24_LCD_TE0 50 I/O MIPI_LCD clock MIPI_LCD data LCD reset LCD frame sync signal UAR
MeiG Smart product technical information MIPI_CSI0_CLK_M 157 I/O MIPI_CSI0_CLK_P 196 I/O MIPI_CSI0_LANE0_M 158 I/O MIPI_CSI0_LANE0_P 197 I/O MIPI_CSI0_LANE1_M 159 I/O MIPI_CSI0_LANE1_P 198 I/O MIPI_CSI0_LANE2_M 160 I/O MIPI_CSI0_LANE2_P 199 I/O MIPI_CSI0_LANE3_M 161 I/O MIPI_CSI0_LANE3_P 200 I/O GPIO28_SCAM_MCLK2 75 I/O Front Camera main clock GPIO129_SCAM_RST_N 81 I/O Front Camera reset GPIO125_SCAM_PWDN 82 I/O Front Camera dormancy Front Camera MIPI clock Front
MeiG Smart product technical information CDC_HPH_R 136 O Right channel of earphone CDC_HPH_L CDC_HSDET_L 138 139 O I Left channel of earphone Headphone plug and unplug detection CDC_HPH_REF 137 I Earphone reference GND EAR_P 8 O Earpiece output negative EAR_M 9 O Earpiece output positive SPKR_OUT_P 10 O Power amplifier output negative Class D SPKR_OUT_M 11 O Power amplifier output positive Class D SD card Interface GPIO67_SD_CARD_DET_N 45 I/O SD card insertion detection SD
MeiG Smart product technical information Antenna interface RF_MAIN 87 I/O The main antenna RF_WIFI/BT 77 I/O WIFI/BT antenna RF_DIV 131 I Diversity antenna RF_GPS 121 I GPS antenna GPIOand default function GPIO20 119 I/O Generic GPIO, SPI MOSI GPIO21 118 I/O Generic GPIO, SPI MISO GPIO22 117 I/O Generic GPIO, SPI CS GPIO23 116 I/O Generic GPIO, SPI CLK GPIO89 115 I/O GPIO44_MAG_INT GPIO42_ACCL_INT_N GPIO43_ALSP_INT_N GPIO63_GYRO_INT GPIO34 109 110 107 108 170 I/O I/O I/
MeiG Smart product technical information Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default
MeiG Smart product technical information VBAT_SNS_P 133 I Battery voltage monitoring PM_VIB_DRV_N 28 O Motor negative control ADC 128 I Analog voltage input can be used as ADC input PWM 29 O NFC_CLK 181 O Analog voltage input can be used as PWM input NFC Clock NFC_CLK_REQ 182 I Default PM215 GPIO2 CBL_PWR_N 186 I BAT_ID 185 I Grounding support power on automatic startup Battery type detection RESERVED 150、151、152、 optional 173、174、175、 178、179、180、 183、184、192、 232、242、246、
MeiG Smart product technical information 16 USB_HS_ID 17 GPIO58_UIM2_DET GPIO58* B-PD:nppukp Configurable I/O,UIM2 removal detection 18 UIM2_RESET GPIO57 B-PD:nppukp Configurable I/O,UIM2 reset 19 UIM2_CLK GPIO56 B-PD:nppukp Configurable I/O,UIM2 clock 20 UIM2_DATA GPIO55 B-PD:nppukp Configurable I/O,UIM2 data 21 VREG_L15_UIM2 22 GPIO54_UIM1_DET GPIO54* B-PD:nppukp Configurable I/O,UIM1 removal detection 23 UIM1_RESET GPIO53 B-PD:nppukp Configurable I/O,UIM1 reset 24 UIM1
MeiG Smart product technical information 52 MIPI_DSI0_CLK_M AO MIPI display serial interface 0 clock- 53 MIPI_DSI0_CLK_P AO MIPI display serial interface 0 clock+ 54 MIPI_DSI0_LANE0_M AI MIPI display serial interface 0 lane0- 55 MIPI_DSI0_LANE0_P AI MIPI display serial interface 0 lane0+ 56 MIPI_DSI0_LANE1_M AI MIPI display serial interface 0 lane1- 57 MIPI_DSI0_LANE1_P AI MIPI display serial interface 0 lane1+ 58 MIPI_DSI0_LANE2_M AI MIPI display serial interface 0 lane2- 59 M
MeiG Smart product technical information 88 GND GND GND 89 GND GND GND 90 GPIO25 GPIO25* B-PD:nppukp Configurable I/O 91 GPIO15_SENSOR_I2C4_SCL GPIO15 B-PD:nppukp Configurable I/O,SENSOR I2C SCL 92 GPIO14_SENSOR_I2C4_SDA GPIO14 B-PD:nppukp Configurable I/O,SENSOR I2C SDA 93 GPIO5_DBG_UART_RX GPIO5* B-PD:nppukp Configurable I/O,UART2 RX 94 GPIO4_DBG_UART_TX GPIO4 B-PD:nppukp Configurable I/O,UART2 TX 95 GPIO91_KEY_VOL_UP_N GPIO91* B-PD:nppukp Configurable I/O,KEY VOL+ 9
MeiG Smart product technical information 124 GPIO47 125 VREG_L6_1P8 PO 126 VCOIN AI,AO 127 CHARGE_SEL AI 128 ADC AO-Z,AI,DO 129 VREG_L17_2P85 PO 130 GND GND 131 RF_DIV AI 132 GND GND 133 VBAT_SNS_P AI battery voltage input to ADC 134 BATT_THERM AI Battery temperature input to ADC 135 GND GND 136 CDC_HPH_R AO Headphone output, right channel 137 CDC_HPH_REF AI Headphone ground reference 138 CDC_HPH_L AO Headphone output, left channel 139 CDC_HSDET_L AI MBHC
MeiG Smart product technical information 160 MIPI_CSI0_LANE2_M AI MIPI camera serial interface 0 lane2- 161 MIPI_CSI0_LANE3_M AI MIPI camera serial interface 0 lane3- 162 GND GND GND 163 GPIO41_DCAM_PWDN GPIO41* B-PD:nppukp Configurable I/O, depth CAM PWDN 164 GPIO38_DCAM_RST GPIO38* B-PD:nppukp Configurable I/O, depth CAM RESET 165 GPIO27_DCAM_MCLK GPIO27 B-PD:nppukp Configurable I/O, depth CAM MCLK 166 GPIO32_DCAM_I2C_SCL1 GPIO32 B-PD:nppukp Configurable I/O, Dedicated came
MeiG Smart product technical information 196 MIPI_CSI0_CLK_P AI MIPI camera serial interface 0 clock+ 197 MIPI_CSI0_LANE0_P AI MIPI camera serial interface 0 lane0+ 198 MIPI_CSI0_LANE1_P AI MIPI camera serial interface 0 lane1+ 199 MIPI_CSI0_LANE2_P AI MIPI camera serial interface 0 lane2+ 200 MIPI_CSI0_LANE3_P AI MIPI camera serial interface 0 lane3+ 201 GPIO39 202 GND GND GND 203 GND GND GND 204 GND GND GND 205 GPIO31_DCAM_I2C_SDA1 206 GND GND GND 207 GND GND GN
MeiG Smart product technical information 232 RESERVED 233 GND GND GND 234 GND GND GND 235 GND GND GND 236 GND GND GND 237 GND GND GND 238 GND GND GND 239 GPIO86 240 GND GND GND 241 GND GND GND 242 RESERVED 243 GND GND GND 244 GND GND GND 245 GND GND GND 246 RESERVED 247 GND GND GND 248 GND GND GND 249 RESERVED 250 GND GND GND 251 GND GND GND 252 RESERVED Reserved 253 RESERVED Reserved 254 RESERVED Reserved 255 GND GND GND 25
MeiG Smart product technical information 268 GND GND GND 269 GND GND GND 270 RESERVED 271 GND GND GND 272 GND GND GND 273 GND GND GND 274 GND GND GND Reserved *：Wake-up system interrupt pin B：Bidirectionaldigital with CMOS input H：High-voltage tolerant NP：pdpukp=defaultno-pull with programmable options following the colon (:) PD：nppukp=defaultpulldown with programmable options following the colon (:) PU：nppdkp=defaultpullup with programmable options following the colon (:) KP：npp
MeiG Smart product technical information Figure 3.2：Module 3D size（unit ：mm） Figure 3.
MeiG Smart product technical information 3. Interface application 4.1. Power Supply In the case of a battery device, the voltage input range of the module VBAT is 3.4V to 4.2V, and the recommended voltage is 3.8V. In the GSM band, when the module is transmitting at maximum power, the peak current can reach up to 3A, resulting in a large voltage drop on VBAT. It is recommended to use a large capacitor regulator close to VBAT. It is recommended to use two 47uF ceramic capacitors.
MeiG Smart product technical information If it is a DC power supply device, the DC input voltage is 5V-12V. The recommended circuit that can be powered by DC-DC is shown below: Figure 4.2：DC-DC power supply circuit Note：If the user does not use battery power, please note that a 47K resistor is connected to the 134 pin (BAT_THERM) of the module and pulled down to GND to prevent the software from judging the abnormal battery temperature after the module is turned on, resulting in shutdown.
MeiG Smart product technical information 4.1.1. Power Pin The VBAT pin (1、2、145、146) is used for power input. In the user's design, pay special attention to the design of the power supply section to ensure that the VBAT does not fall below 3.4V even when the module consumes 2A. If the voltage drops below 3.4V, the module may shut down. The PCB layout from the VBAT pin to the power supply should be wide enough to reduce the voltage drop in the transmit burst mode. Figure4.4：VBAT lowest voltage drop 4.2.
MeiG Smart product technical information Figure 4.6：Booting with the button circuit The following figure is the boot timing description: Figure 4.
MeiG Smart product technical information 4.2.2. Module Shutdown Users can use the PWRKEY pin to shutdown. 4.2.2.1 PWRKEY Shutdown The user can turn off the PWRKEY signal by pulling it down for at least 3 seconds. The shutdown circuit can refer to the design of the boot circuit. After the module detects the shutdown action, a prompt window pops up on the screen to confirm whether to perform the shutdown action.
MeiG Smart product technical information When the pin is high, the voltage is typically 1.8V. Therefore, for users with a level of 3V or 3.3V, it is not possible to directly use the GPIO of the MCU to drive the pin. An isolation circuit is required. The hardware parameters of the RESET(225) can refer to the following table: Table 4.1：RESET Hardware Parameters Pin RESET_N Description Input high level Input low level Pull down effective time Minimum 1 500 Typical - Maximum 0.65 - Unit V V ms 4.3.
MeiG Smart product technical information Rechargeable battery powered: Figure 4.12： Rechargeable Battery Powers RTC Notes：This VCOIN power supply is 2.0-3.25V, typical typically 3.0V 4.4. Power Output The SLM500 has multiple power outputs. For LCD, Camera, touch panel, etc. In application, it is recommended to add parallel 33PF and 10PF capacitors to each power supply to effectively remove high frequency interference. Table 4.2：Power Description Default Voltage(V) 1.8 1.8 2.8 2.95 2.95 1.8/2.95 1.8/2.
MeiG Smart product technical information GPIO1_UART1_RXD GPIO4_DBG_UART_TX 153 94 O I GPIO5_DBG_UART_RX GPIO16_UART5_TXD GPIO17_UART5_RXD 93 34 35 O GPIO18_UART5_CTS 36 I GPIO19_UART5_RTS 37 O I O UART1 Data Reception UART2 Data Transmission UART2 Data Reception UART5 Data Transmission UART5 Data Reception UART5 Clear To Send （CTS） UART5 Request To Send （RTS） Please refer to the following connection method: Figure 4.
MeiG Smart product technical information module Figure 4.15：RX Connection Diagram Note ：When using Levels Isolation in Figures 14 and 15, Attention should be paid to LDO6_1P8 output timing, the serial port can communicate normally after the normal output. Table 4.4：Serial Port Hardware Parameters Description Minimum Maximum Unit Input low level Input high level Input low level Input high level - 0.63 V - V - 0.45 V 1.35 - V 1.17 Note：1.
MeiG Smart product technical information 4.6.1. LCD Interface The SLM500 module supports the MIPI interface of one LCD displays, supports dualscreen display, and has a compatible screen identification signal. The resolution of the screen can be up to 1440*720. The signal interface is shown in the following table. In the Layout, the MIPI signal line should strictly control the differential 100 ohm impedance and the equal length between the signal line group and the group. The module's MIPI interface is a 1.
MeiG Smart product technical information Figure 4.16： LCD interface circuit PMIC does not support backlight drive. LCD backlight driver circuit needs to be added by customers. Please refer to the following figure for specific circuit Figure 4.
MeiG Smart product technical information 4.6.2.MIPI Camera Interface The SLM500 module supports the MIPI interface Camera and provides a dedicated camera power supply. The main camera is a CSI1 interface that supports four sets of data lines and can support up to 13M pixels. The front camera is a CSI0 interface that supports four sets of data lines and can support 5M pixels. The module provides the power required by the Camera, including AVDD-2.8V, IOVDD-1.8V\AFVDD-2.
MeiG Smart product technical information MIPI_CSI0_CLK_P 196 I MIPI_CSI0_LANE0_M 158 I/O MIPI_CSI0_LANE0_P 197 I/O MIPI_CSI0_LANE1_M 159 I/O MIPI_CSI0_LANE1_P 198 I/O MIPI_CSI0_LANE2_M 160 I/O MIPI_CSI0_LANE2_P 199 I/O MIPI_CSI0_LANE3_M 161 I/O MIPI_CSI0_LANE3_P 200 I/O GPIO29_CAM_I2C_SDA0 84 I/O I2C data GPIO30_CAM_I2C_SCL0 83 I/O I2C clock VREG_L6_1P8 125 O 1.8V IOVDD VREG_L16_AVDD 193 O 2.8VAVDD VREG_L17_2P85 129 O 2.
MeiG Smart product technical information Figure 4.
MeiG Smart product technical information Important note: When designing the camera function, you need to pay attention to the position of the connector. There will be a small person in the specification of the camera to indicate the imaging direction. You need to ensure that the villain is standing on the long side of the LCD, otherwise the camera will be flipped. The software cannot be adjusted at 90°. As shown in the two figures below. SIM 卡座 SIM 卡座 Figure 4.20：Camera imaging diagram 4.7.
MeiG Smart product technical information 4.8.Audio Interface The module provides three analog audio inputs, MIC_IN1_P for the main microphone, MIC_IN2_P for the microphone, and MIC_IN3_P for the noise reduction microphone. The module also provides three analog audio outputs (HPH_L/R, REC_P/N, SPK_P/N). The audio pin is defined as follows: Table 4.
MeiG Smart product technical information 4.8.2 Microphone receiving Circuit The figure below shows the interface circuit of MEMS microphone. Figure 4.22： Microphone Differential Interface Circuit 4.8.3.Headphone Interface Circuit The module integrates a stereo headphone jack. Users are advised to reserve ESD devices during the design phase to prevent ESD damage. The HS_DET pin of the module can be set as an interrupt. In software, this pin is the earphone interrupt by default.
MeiG Smart product technical information inside the chip, which can ensure that HS_DET is low when connected with HPH_L, if the user will HS_DET and HPH_R To connect, please reserve a 1K pull-down resistor on HPH_R. 3 The standard of the headphone interface is the European standard OMPT. If you need to design the American standard CTIA interface, you need to swap the GND and MIC signals for the network.
MeiG Smart product technical information The USB plug-in detection of the module is realized by the VBUS and DP/DM data lines. When the USB cable is inserted, the VBUS voltage is detected first, and then the DM/DP pullup state is detected to determine whether the USB data line or the charger is inserted. Therefore, if you need to use the USB function, please be sure to connect VBUS to the 5V power supply on the data line. USB is a high-speed mode.
MeiG Smart product technical information The recommended circuit diagram of USB OTG is as follows: Figure 4.27: USB-OTG Connection Diagram 4.10. Charging Interface The SLM500 module integrates a 1.44A charging solution. The charging related content of this manual is only described by the internal charging scheme. The QCM2150 platform uses the Qualcomm PM215 internal integrated charging chip by default. The chip is in liner mode.
MeiG Smart product technical information 4.10.1. Charging Detection When the VBUS pin voltage is higher than 4.0V, a hardware interrupt will be generated inside the module. The software determines whether the charger is inserted or the USB data cable is inserted by judging the status of USB_DP/USB_DM. 4.10.2. Charge Control The SLM500 module can charge the over-discharged battery. The charging process includes trickle charge, pre-charge, constant current, and constant-voltage charge.
MeiG Smart product technical information below is the SIM recommended interface circuit. In order to protect the SIM card, it is recommended to use TVS devices for electrostatic protection. The device of the peripheral circuit of the SIM card should be close to the SIM card holder. The reference circuit is as follows: SIM card moduler Figure 4.30: UIM card interface circuit 4.12. SD Card Interface SLM500 supports SD card interface. The reference circuit is as follows: Figure 4.
MeiG Smart product technical information 4.13 I2C Bus Interface The SLM500 module supports five hardware I2C bus interfaces include two camera-specific CCI interface. The pin definitions and default functions are as follows: Table 4.11: I2C Interface Pin Description Name Pin Default function GPIO14_SENSOR_I2C4_SDA 92 GPIO15_SENSOR_I2C4_SCL 91 Dedicated I2C for sensors only|( G-sensor, compass, gyroscope, etc.
MeiG Smart product technical information 4.16. Motor The SLM500 supports motor functions and can be implemented by the user via PM_VIB_DRV_N （28PIN）. The reference schematic diagram is as follows. Note that the uF-level capacitor cannot be placed on the signal line. Figure 4.32: Motor interface circuit 4.17 Antenna Interface The module provides four antenna interfaces: MAIN antenna, DRX antenna, GPS antenna and WiFi/BT antenna.
MeiG Smart product technical information In the figure, R101, C101, and C102 are antenna matching devices, and the specific component values can be determined after the antenna factory debugs the antenna. Among them, R101 defaults to 0R, C101 and C102 do not paste by default. If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below: Figure 4.
MeiG Smart product technical information If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below: Figure 4.37: DRX Antenna Interface Simplified Connection Circuit In the above figure, R102 defaults to 0R, C103 and C104 are not attached by default. 4.18.3 GPS Antenna The module provides the GNSS antenna pin RF_GPS.
MeiG Smart product technical information 4.18.4 WiFi/BT antenna The module provides the WiFi/BT antenna pin RF_WIFI/BT. The antenna on the user's motherboard should be connected to the antenna pin of the module using a 50 ohm microstrip line or strip line. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows: Figure 4.
MeiG Smart product technical information 5.PCB Layout The performance of a product depends largely on the PCB trace. As mentioned above, if the PCB layout is unreasonable, it may cause interference problems such as card loss. The way to solve these interferences is often to redesign the PCB. If you can plan a good PCB layout in the early stage, the PCB traces smoothly, saving a lot of time. Of course, it can also save a lot of costs.
MeiG Smart product technical information must be controlled by 50 ohm impedance; The device and wiring between the antenna pin and the antenna connector of the module must be away from high-speed signal lines and strong interference sources to avoid crossing or parallel with any signal lines in adjacent layers. The length of the RF cable between the antenna pin of the module and the antenna connector should be as short as possible. The situation of crossing the entire PCB should be absolutely avoided.
MeiG Smart product technical information frequency interference. path of VBAT as much as possible. 5.2.4. MIPI MIPI is a high-speed signal line. Users must pay attention to protection during the layout stage, so that they are away from the signal lines that are easily interfered. The GND processing must be performed on the upper and lower sides, and the traces are differential pairs. 100 ohm differential impedance matching is performed.
MeiG Smart product technical information band, and the 10pF capacitor mainly filters out the interference of the DCS1800 band. The coupling interference of TDD has a great relationship with the PCB design of the user. In some cases, the TDD of the GSM850/EGSM900 frequency band is more serious, and in some cases, the TDD interference of the DCS1800 frequency band is more serious.
MeiG Smart product technical information SLM500 Hardware Design Guide Page 60
MeiG Smart product technical information 6. Electrical, Reliability 6.1 Absolute Maximum The table below shows the absolute maximum values that the module can withstand. Exceeding these limits can cause permanent damage to the module. Table 6.2: Absolute Maximum Parameter Minimum Typical Maximum Unit VBAT - - 6 V VBUS - - 10.5 V Peak current - - 3 A 6.2 Working Temperature The table below shows the operating temperature range of the module: Table 6.
MeiG Smart product technical information 6.5 SIM_VDD Characteristics Table 6.5: SIM_VDD Characteristics Parameter VO Minimum Typical Maximum - 3 - - 1.8 - - - 55 mA Description Minimum Typical Maximum Unit High level 1.4 - - V Low level - - 0.6 V Effective time 2000 Description Unit V Output voltage IO Output current 6.6 PWRKEY Feature Table 6.6: PWRKEY Characteristics Parameter PWRKEY ms 6.7 VCOIN Feature Table 6.
MeiG Smart product technical information current Call Current consumpt ion Digital transmissi on Imax Peak current GSM Standby power consumption - - 4.0 mA WCDMA Standby power consumption - - 3.9 mA TD-S Standby power consumption - - 4.0 mA CDMA Standby power consumption - - 3.8 mA FDD Standby power consumption 4.45 mA TDD Standby power consumption 3.5 mA GSM900 CH62 32dBm - - 250 mA WCDMA2100 CH10700 22.
MeiG Smart product technical information LTE B1 2110～2170 MHz 1920～1980 MHz LTE B3 1805～1880 MHz 1710～1785 MHz LTE B5 869～894MHz 824～849MHz TX: 18000～18599 RX: 0~599 TX: 19200~19949 RX: 1200~1949 TX: 20400～20649 RX: 2400~2649 LTE B8 925～960MHz 880～915MHz TX: 21450～21799 RX: 3450~3799 LTE B34 2010～2025 MHz 2010～2025 MHz 36200～36349 LTE B38 2570～2620 MHz 2570～2620 MHz 37750～38249 LTE B39 1880～1920 MHz 1880～1920 MHz 38250～38649 LTE B40 2300～2400 MHz 2300～2400 MHz 38650～39649 LTE
MeiG Smart product technical information WCDMAB5 <-109 dBm 3GPPrequirements CDMABC0 <-110 dBm 3GPPrequirements TDSCDMA1.9G <-110 dBm 3GPPrequirements TDSCDMA2G <-110 dBm 3GPPrequirements LTEFDD/TDD See Table 6.12 3GPPrequirements Table 6.12: LTE Reference Sensitivity 3GPP Dual Antenna Requirements (QPSK) E-UTRA Frequenc 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz y band number 1 -100 -97 -95.2 -94 2 -102.7 -99.7 -98 -95 -93.2 -92 3 -101.7 -98.7 -97 -94 -92.2 -91 4 -104.7 -101.7 -100 -97 -95.
MeiG Smart product technical information 37 38 39 40 41 - - -100 -100 -100 -100 -98 -97 -97 -97 -97 -95 -95.2 -95.2 -95.2 -95.2 -93.2 -94 -94 -94 -94 -92 TDD TDD TDD TDD TDD 6.13 WIFI Main RF Performance The table below lists the main RF performance under WIFI conduction. Table 6.13: Main RF performance parameters under WIFI conduction Transmission performance (2.4G) Transmit power (minimum rate) Transmit power (maximum rate) EVM (maximum rate) 802.11B 802.11G 802.11N 18 18 18 dBm 18 14.
MeiG Smart product technical information 6.14 BT Main RF Prformance The table below lists the main RF performance under BT conduction. Table 6.14: Main RF performance parameters under BT conduction Transmission performance DH5 2DH5 3DH5 14 14 14 Transmit power dBm Receiving performance DH5 2DH5 3DH5 -94.5 -94.5 -86 Receiving sensitivity dBm 6.15 GNSS Main RF Performance The table below lists the main RF performance under GNSS conduction. Table 6.
MeiG Smart product technical information 7. Production 7.1.
MeiG Smart product technical information 7.2. Recommended Soldering Furnace Temperature Curve Figure 49: Module recommended soldering furnace temperature curve 7.3. Humidity Sensitivity (MSL) The SLM500 module meets moisture sensitivity level 3. The dry package is subjected to the J-STD-020C specification in accordance with the IPC/JEDEC standard under ambient conditions of temperature <30 degrees and relative humidity <60%.
MeiG Smart product technical information time limit specified on the label. After unpacking, the SMT patch should be taken within 168 hours under ambient conditions of <30 degrees and relative humidity <60%. If the above conditions are not met, baking is required. Note: Oxidation risk: Baking SMD packages can cause metal oxidation and, if excessive, can cause solderability problems during board assembly. The temperature and time of the SMD package are baked, thus limiting solderability considerations.
MeiG Smart product technical information 8. Support Peripheral Device List Table 8.1: List of supported display models Vendor Drive IC Specification ILI9881P 1280x720 Drive IC Specification Sunny optical S5K3M2XX 13M Sunny optical S5K4H7 8M Sunny optical S5K5E8 5M Table 8.
MeiG Smart product technical information 9. Appendix 9.1. Related Documents Table 9.1: Related documents Serial numb File name Comment er Digital cellular telecommunications (Phase 2+); AT command set for GSM [1] GSM 07.07： Mobile Equipment (ME) [2] GSM 07.10： Support GSM 07.10 multiplexing protocol [3] GSM 07.05： [4] GSM 11.14： [5] GSM 11.11： Digital cellular telecommunications system (Phase 2+);Specification of the Subscriber Identity Module – Mobile Equipment (SIM–ME) interface [6] GSM 03.
MeiG Smart product technical information IMEI Li-ion MO MS MT PAP PBCCH PCB PCL PCS PDU PPP RF RMS RX SIM SMS TDD TE TX UART URC USSD Phone book abbreviation FD LD MC ON RC SM NC International Mobile Equipment Identity Lithium-Ion Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated Password Authentication Protocol Packet Broadcast Control Channel Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Poin
MeiG Smart product technical information Please take attention that changes or modification not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
MeiG Smart product technical information (ii) le gain d'antenne maximal autorisé pour les appareils dans les bandes 5250-5350 MHz et 5470-5725 MHz doivent respecter le pire limiter; et (iii) le gain d'antenne maximal autorisépour les appareils dans la bande 5725-5825 MHz doivent respecter le pire limites spécifiées pour le point-à-point et l'exploitation non point àpoint, le cas échéant. Users should also be advised that high-power radars are allocated as primary users (i.e.
MeiG Smart product technical information (4)Labelling Instruction for Host Product Integrator Please notice that if the FCC and IC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module.
MeiG Smart product technical information 9.3. Multiplexing function Table 9.
MeiG Smart product technical information Table 9.4: Security Warnings Identification Claim When you are at a hospital or medical facility, observe the restrictions on using your phone. If necessary, please turn off the terminal or mobile phone, otherwise the medical device may malfunction due to radio frequency interference. Turn off the wireless terminal or mobile phone before boarding. To prevent interference with the communication system, wireless communication equipment is prohibited on the aircraft.
