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MBTL1_V1.3

MBTL1

Bluetooth Low Energy Module

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Summary of content (17 pages)

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MBTL1_V1.3 www.sziton.com MBTL1 Bluetooth Low Energy Module DISCLAIMER AND COPYRIGHT NOTICE Information in this document, including URL references, is subject to change without notice. This document is provided “As if” with no whatsoever, including any warranty of merchantability, noninfringement, fitness for any purpose, or any warranty otherwise arising out of any proposal, specification or samples.
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MBTL1_V1.3 www.sziton.com Contents Revision History ............................................................................................................................................................. 3 1 .Overview .................................................................................................................................................................... 3 1.1 Key features ......................................................................................................
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MBTL1_V1.3 www.sziton.com Revision History Date Version No. 2019.10.31 V1.0 Initial version WangLei 2019.11.18 V1.1 Mainly updated the sections below 1) change Operating Temperature 2) update the RX Sensitivity 3) update the power dissipation in Section 3.3 4) update the mechanical size WangLei 2019.12.20 V1.2 1)update the module Number: MBTEL1 2)change support Bluetooth support 4.2 and keep BLE wireless technology standards 3)add FCC & IC streatment WangLei 2020.01.06 V1.
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www.sziton.com MBTL1_V1.3 • Stereo Audio output. • SPI. • I2C. • UART with hardware flow control and 7816 protocol support. • USB. • Swire debug Interface. 5) Up to 6 channels of differential PWM: • PWM1~PWM5: 5-channel normal PWM output. • PWM0: 1 channel with IR/IR FIFO/IR DMA FIFO mode for IR generation. 6) Sensor: • 14bit 10-channel (only GPIO input) SAR ADC, with 4-channel differential input PGA • Temperature sensor 7) Power supply: 1.8V~3.6V. 8) Compatible with USB2.0 Full speed mode.
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MBTL1_V1.3 www.sziton.com 1.3 Block diagram Figure 1-1 Block diagram of TLSR8258 *Note: Modules marked with different colors belong to different power domains. 2.4G PCB ANT PWM DC supply TLSR8258 QFN48 5.4*5.4mm UART SPI 24MHz Crystal Figure 1-2 ITON Technology Corp. 32.
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MBTL1_V1.3 www.sziton.com 2 Pin Configuration and Functions 2.1 Pin Layout Figure 2-1 Functions of 40 pins for the MBTEL1 Table 2-1 Pin functions for MBTEL1 Pin assignment for MBTEL1 No.
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MBTL1_V1.3 www.sziton.
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MBTL1_V1.3 www.sziton.
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MBTL1_V1.3 www.sziton.com • UART 7816: PD<7>: 7816_TRX (UART_TX), PA<1>: 7816_CLK, PC<2>: 7816_TRX (UART_TX), PD<0>:7816_TRX (UART_TX), PD<3>: 7816_TRX (UART_TX) 9) USB: PA<5>: DM, PA<6>: DP 10) Single Wire debug interface: • PA<7>: SWS. • SWS can also be multiplexed with DP.
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MBTL1_V1.3 www.sziton.com 3.2 Recommended operating condition Table 3-2 Recommended operating condition Item Sym. Min Typ. Max Unit 3.6 V 3.3 Condition Power-supply voltage VDD 1.8 Includes ripples Storage temperature Range TStr -30 85 o C Operating Temperature Range TOpr -30 85 o C 3.3 DC characteristics Table 3-3 DC characteristics (VDD=3.3V, T=25℃) Item Sym. Min Typ. IRx ITx RX current Tx current Max Unit Condition 6.3 mA @BLE RX 5.4 mA @0dBM with DCDC 3.
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MBTL1_V1.3 www.sziton.com Item Sym. Min +1/-1 MHz In-band blocking rejection (Equal Modulation Interference) offset +2/-2 MHz offset >=3MHz offset Image rejection Typ. Max Unit 1/3 dB 37/39 dB 42 dB 37 dB Condition Wanted signal at -67dBm Wanted signal at -67dBm BLE 1Mbps RF_Tx performance Output power, maximum setting Output power, minimum setting Programmable output power range Modulation 20dB bandwidth Modulation 20dB 10 dBm -45 dBm 55 dB 2.5 MHz 2.
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MBTL1_V1.3 www.sziton.com Item Sym. Min Typ.
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MBTL1_V1.3 www.sziton.com Figure 4-1 Application diagram for TL8258-Q40P 5 Mechanical and Package 5.1 Recommended PCB Footprint L: 15.33 mm±0.15mm；W: 25.15 mm±0.15 mm ; H: 3.00 mm±0.15 mm Figure 5-1 Recommended PCB Footprint Note： It is recommended to place this module at the edge of the main board. The module PCB antenna isoriented towards the outside of the board. The antenna is away from some sources of interference such as DCDC. The antenna area should be hollowed all layers.
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MBTL1_V1.3 www.sziton.com 5.2 Packaging Information Figure 5-2 Package way 6 Thermal Reflow Referred to IPC/JEDEC standard Peak temperature :< 250℃ Number of times :< 2 ITON Technology Corp.
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MBTL1_V1.3 www.sziton.com Figure 6-1. Recommended Reflow for Lead Free Solder 7 FCC & IC Statement For FCC statement This device complies with Part 15.247 of the FCC Rules. Host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. Host manufacturer in any case shall ensure host product which is installed and operating with the module is in compliant with Part 15B requirements.
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www.sziton.com MBTL1_V1.3 energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. Warning: changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
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www.sziton.com MBTL1_V1.3 requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, additional transmitter(s) in the host, etc.). Test software access to different test modes: (1) Fixed frequency test: 8258_Test_EMI_v0003.bin (2) Bluetooth transmission：8258_module.bin For IC statement This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s).