User's Manual

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LORD Corporation 9/26/2017 Prepared by J. Dunklee

200 Series Radio Module Integration Guide

1. Overview

The 200 Series Radio Module is an OEM device used to acquire data from LORD Corporation wireless sensing

devices. It is designed to be embedded in other products to provide radio communication and data pass-

through capabilities in a modular format. It is designed to be used with LORD data acquisition software or

user software developed using the LORD MSCL code library.

The module includes an integrated microcontroller/radio transceiver that communicates to LORD devices in

the 2.4 GHz band. There are two radio transmission protocols that are available on the radio module – the

standard 802.15.4 protocol (LXRS) and a LORD proprietary protocol (LXRS+). The modes are selectable in the

LORD software. Both are capable of lossless transmission of continuous, burst, and other sampling modes,

depending on the node capabilities. The increased radio transmission rate of the LXRS+ protocol results in

faster network throughput, and the ability to handle larger data packets. However, because of the increased

packet size, the packet error rate will likely increase (reducing RF sensitivity) and effectively reducing the RF

range.

2. Integration

The radio module requires a PCB carrier board for proper integration. This board can be designed by LORD,

or by an OEM customer with the information provided in this document. The carrier board provides power

(+5 Vdc +/- 2%, 50mA) to the radio module, as well as the serial and input/output interface to connect the

microcontroller to the larger communication system. The microcontroller code required to control the radio

module is proprietary and is developed at LORD.

The following section describes physical layout and pin configuration of the module. The module is 0.98” x

0.53”. It has an internal antenna on one end of the board. The interface to the carrier board is through solder

pads around the three other sides of the board. For exact layout dimension of these pads, contact LORD

Technical Support for an engineering file.

The radio module is an OEM circuit board intended to be housed in an enclosure of the type suitable for the

final product. It has no environmental protection by itself. Operating temperature range is -40 to +85 °C.

Summary of content (4 pages)

PAGE 1
200 Series Radio Module Integration Guide 1. Overview The 200 Series Radio Module is an OEM device used to acquire data from LORD Corporation wireless sensing devices. It is designed to be embedded in other products to provide radio communication and data passthrough capabilities in a modular format. It is designed to be used with LORD data acquisition software or user software developed using the LORD MSCL code library.
PAGE 2
Physical Interface Internal antenna location Carrier board solder pads (around board edge) Dimensions in inches LORD Corporation 9/26/2017 Prepared by J.
PAGE 3
Pin Interface Radio Module Signal name pin number Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Digital ground Microcontroller reset Microcontroller general purpose I/O Microcontroller general purpose I/O Microcontroller general purpose I/O Microcontroller general purpose I/O Microcontroller general purpose I/O Serial Wire Debug trace data output Serial Wire Debug data in/out Serial Wire Debug clock Microcontroller general purpose I/O Micro
PAGE 4
3. Regulatory a. Radio modules must be labeled with the corresponding FCC/IC ID number. Product assemblies with radio modules in them must be labeled “Contains 200 Series Radio Module” followed by the FCC/IC ID. b. The following notice applies to the radio module and must also appear in its entirety in the final product user manual. In addition, based on the antennas and power parameters specified for this device, it must be operated at least 2.