S95 Series products Product Specification Product name: S95 BLE StandardModule Model：LSD4BT-S95ALSP001 File Version：Rev01 Page 1 of 21
File Rivision History Serial Modify log Modifier number 01 Initial version 杨彬 Page 2 of 21 File Modified version date Rev01 2020-5-28 Reviewer 孙香涛
Catalog CHAPTER 1 OVERVIEW ....................................................................................................................... 4 1.1 E91A MODULE FEATURES ........................................................................................................................ 4 1.2 APPLICATION ........................................................................................................................................ 5 CHAPTER 2 SPECIFICATIONS ...................................
Chapter 1 Overview The S95 standard hardware module is a high-performance IoT Bluetooth transceiver based on the NORDIC Bluetooth SOC nRF52 series (supporting Bluetooth 5.0). The module uses a stamp-type interface; the package is compatible with the E66 module (Pin-to-Pin) and supports both external antennas and on-board antennas. The product has the characteristics of low power consumption, small size and strong anti-interference ability.
1.2 Application ● 2.4GHz low power Bluetooth system; ● Low-power peripherals such as PC, tablet, mobile phone, and handset(HID, remote controler, etc.); ● Comsumer eletronics such as sport and health care; ● Wireless sensor networks such as smart metes and data acquisition; ● Intelligent cloud platform and ecologic access(WeChat, QQ IOT, Jingdong, Ali, Xiaomi, etc. ); ● Smart home, LAN, interactive devices, beacon lights.
Chapter 2 Specifications Table 2-1 Product limit parameters Performance The main parameters Minim Maximu um m Power supply voltage(V) -0.3 3.9 IO voltage(V) -0.3 VDD+0.3 Maximum RF input power(dBm) / 10 Storage voltage(℃) -40 +125 Working temperature(℃) -40 +85 / 2000V / 1000V Electrostatic VESD Human Body Model(HBM),CLASS 2 discharge(ESD) performance Charged Device Model(CDM) Remarks Not more than 3.
-20dBm to +4dBm Receive sensitivity(dBm) Communication distance1 / -96 / @BLE mode-1Mbps;Payload=37 See 4.
Chapter 3 Hardware layout and interface description 3.1 Dimensional drawing The physical picture of LSD4BT-S95 is as follows: Figure 3-1 S95 When designing this product, there are alternative material types for Secondary components and PCB. The appearance color may be different under the premise of Performance. The main material (main chip, crystal oscillator, etc.) has no replacement model, but changes will be notified in advance.
*The dimensional tolerances not shown in the figure are in accordance with the GB/T1804-m standard. 32MHz Filter Circuit nRF52x POWER IO Figure 3-3 Internal block diagram of the S95 series module. 3.2 Dimensional drawing Table 3-1 Module Pin Function Description Module Chip Pin Pin 1 P0.05 Digital I/O Pin 2 P0.12 Digital I/O Pin 3 P0.14 Digital I/O Pin 4 SWDIO Debug Data Pin 5 GND Power Ground 6 SWDCLK 7 P0.20 Digital I/O Pin 8 P0.
17 GND 18 ANT Power Ground External antenna interface; need to reserve π-type matching circuit when using For detailed Pin descriptions, please refer to the nRF52805 chip data sheet.
Chapter 4 Application note 4.1 Antenna design guide If you have high requirements for communication distance, an external antenna can be used. The IO port required to use the external antenna is PIN18 (ANT). The original antenna position under the module must be completely copper。 The figure below shows the circuit from the module ANT Pin to the external antenna. The red thick line should guarantee 50Ω impedance control. Keep the line as short as possible, do not hit the hole, do not take the acute line.
H=1.0mm，W=1.0mm，D=0.254mm(recommended) H=1.2mm，W=1.0mm，D=0.2mm(recommended) H=1.6mm，W=1.0mm，D=0.2mm (recommended) (More design support is available to Lierda Technology Consulting) 4.2 Backplane layout considerations A large clearance area is required around the antenna. Clearance refers to the open area in the projected area of the vertical plane of the antenna (both upper and lower ranges must be considered).
Figure 4-3 Module recommended reference placement Note: When designing, users should pay attention to that there is a window opening area (that is, exposed copper) in the test pad for testing the RF performance of the Bottom layer of the module product. . As shown in the picture, the position of the green box is the position of the test point, and the specific size refers to the actual object 4.
② Outdoor distance test: the distance is measured at the straight line of the east gate of Lierda Park, the module is 1 meter above the ground, the broadcast power equipment is 4dBm, and the mobile phone LightBlue is used to test whether the module can be connected. The test result is that it can be connected normally at a distance of 90 meters. The following picture shows the location of the test point on the map. Figure 4-5 Module pull test position 4.
4.5 Precautions 1. Power supply It is recommended to use the DC stabilized power supply to supply power to the module. The power supply ripple is as small as possible. Generally, the ripple is less than 30mV. Excessive ripple may cause low sensitivity and poor connection quality. And the Bluetooth transmit signal will be coupled into the interference signal, causing the RF indicator to exceed the Bluetooth specification. In severe cases, it will be unable to connect and communicate.
Chapter 5 Production guidance 5.1 Production guide It is recommended to use SMT machine patch, and the patch should completed within 24 hours after unpacking, otherwise it is necessary to re-vacuate the package to avoid the bad condition caused by moisture.。 If the package contains a humidity indicator card, it is recommended to judge whether the module needs to be baked according to the humidity card indication.
5.3 Steel stencil design The thickness of the steel stencil is selected according to the package type of the device in the board. It is necessary to focus on the following requirements: The module pad position can be locally thickened to 0.15~0.20mm to avoid rosin joint.
5.4 Reflow soldering instructions Note: This work instruction is only suitable for lead-free work and is for reference only.
Chapter 6 Product packaging 6.1 Packaging method Tape Foam Electrostaticbag 6.2 Strip size 6.
Chapter 7 RF Exposure Information and Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This device complies with part 15 of the FCC rules . Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Advise the user Welcome to use the products of Lierda Technology Group Co., Ltd. Please read this warning before using our products. If you have started using the instructions, you have read and accepted this notice. Lierda Technology Group Co., Ltd. reserves the right to interpret and modify all materials provided, and is subject to change without notice.
