LibreSync & GC4A High Performance Network Media Module 1x1 Dual Band 802.11 a/b/g/n/ac With Integrated Bluetooth 4.1 Low Energy (BLE) LS9 Data Sheet Module: LS9-AC11DBT Rev: 2.
LS9-AC11DBT Module 1. Introduction Libre Wireless, LS9-AC11DBT is a high performance media / audio streaming module. LS9-AC11DBT comes with Dual core Coretex-A7 CPU and Dual Neon/VFPU subsystems running at 1.3GHz, 256MB of DDR3 DRAM memory and 256MB of NAND Flash, an 802.11a/b/g/n/ac, Bluetooth v4.1 Low Energy (BLE), Multi- standard video encoding, 2D/3D Graphics Engine and a USB OTG. 2. Module Feature Summary Key Features • Dual core Cortex-A7 CPU and Dual core Neon/VFPU running ate 1.
LS9-AC11DBT Module • In LS9, SPDIF and I2S are mutually exclusive. I2S is available only when SPDIF output is disabled, and vise versa. • HDMI1.4 transmitter MAC and PHY with HDCP 1.4 • 1x USB 2.0 OTG (For Debug Shell, Ethernet, Firmware update, USB Media Playback) • 1x UART (For HOST-MCU communication) • 2x I2C, 1x SPI, GPIOs • Wi-Fi 1x1 Dual Band 802.11a/b/g/n/ac • 3x Antenna(5 GHz WLAN, 2.4GHz WLAN, and 2.4GHz BT) • Bluetooth 4.
LS9-AC11DBT Module 3. LibreSync Features LibreSync modules have extensive software features for connected media streaming and control applications. These include system level control and interface features as well as networking features. Please refer to the full “LibreSync Feature List” for details of supported features. Platform features can vary based on module configuration/derivatives and commercial engagement details. 4.
LS9-AC11DBT Module 5. Specifications 5.1. General Specification Parameter Description / Values Model LS9-AC11DBT MODULE Product Name Network Media Module • Standard Wi-Fi – IEEE802.11a, IEEE802.11b, IEEE802.11g, IEEE802.11n, IEEE802.11ac standards • BT – v2.1+EDR, v3.0+HS, v4.1 BT Low Energy (BLE) Data Transfer Rate 1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120,150, 300, and maximum of physical layer rate of 390 Mbps Frequency Band 2.4 / 5.0 GHz Input Voltage 3.
LS9-AC11DBT Module Parameter Modulation Description / Values • 802.11n : MCS 0 to 7 for HT20MHz MCS 0 to 7 for HT40MHz • 802.11ac : MCS 0 to 9 for HT40MHz MCS 0 to 9 for HT80MHz • 802.11b : CCK, DQPSK, DBPSK • 802.11g : 64QAM, 16QAM, QPSK, BPSK • 802.11n : 64QAM, 16QAM, QPSK, BPSK • 802.11ac : 256 QAM, 64QAM, 16QAM, QPSK, BPSK Network Architecture Operation Channel Frequency Range • Ad-hoc mode (Peer-to-Peer) • Infrastructure Mode 2.4GHz • 11: (Ch. 1-11) – United States • 13: (Ch.
LS9-AC11DBT Module Parameter Description / Values o 802.11a : 15 dBm (54Mbps) o 802.11n : 14 dBm (MCS 7) o 802.11ac: 13 dBm (MCS 0) o 802.11ac: 13 dBm (MCS7) Receiver Sensitivity • 802.11ac : 12 dBm (MCS 9) • 2.4 GHz o 802.11b : < -92 dBm (1Mbps) o 802.11g : < - 70 dBm (54Mbps) o 802.11n : < -69 dBm (MCS 7) • 5.0 GHz o 802.11a : < -65 dBm (54Mbps) o 802.11n : < -64dBm (MCS 7) • 802.
LS9-AC11DBT Module 5.3. Bluetooth Specification Parameter Description / Values Standard V2.1+EDR, V3.0+HS, V4.1 BT Low Energy (BLE) Audio CODEC Support SBC Profile Support A2DP 1.2, AVRCP 1.3, SPP, HFP, HSP, HOGP Sampling Rates Coexistence Support • 44.
LS9-AC11DBT Module 5.4. Antenna Specification Antenna Module Antenna Gain Manufacturer of Antenna LSANT-1C-180 ≤ 3.5dBi Golden Smart International Co., Ltd Antenna Images 5.5. LS9-AC11DBT Module Ordering Information Product Number Wi-Fi Tx/Rx Wi-Fi Bands Bluetooth Module Height* (±0.2mm) LS9-AC11DBT 802.11 b/g/n/ac 1x1 2.4 / 5.0 GHz 4.1 BLE 65 mm x 41mm x 6.8 mm (L x W x H) ± 0.2mm The LS9-AC11DBT module height does not include the measurement of bottomside media-connector. 6.
LS9-AC11DBT Module Physical module dimension is 63 mm x 41mm x 6.8 mm (L x W x H) ± 0.2mm. Height of the module varies depending on the LS9 Module variant used; for information on height of the module see Section 5.2.2. LS9-AC11DBT Module Ordering Information. Figure 6-1 and Figure 6-2 represent module’s top and bottom. Figure 6.1-1: LS9-AC11DBT Module Top Libre Wireless Technologies Data Sheet: Network Media Module, Ver. 2.
LS9-AC11DBT Module Figure 6.1-2: LS9-AC11DBT Module Bottom Figure 6.1-3: LS9-AC11DBT MODULE Top view Mechanical Dimension (1) Libre Wireless Technologies Data Sheet: Network Media Module, Ver. 2.
LS9-AC11DBT Module Figure 6.1-4: LS9-AC11DBT MODULE Top View Mechanical Dimension (2) Figure 6.1-5: LS9-AC11DBT MODULE Top View Mechanical Dimension (3) The module dimensions are measured in millimetres (mm). 6.2. Media Connector Specification Libre Wireless Technologies Data Sheet: Network Media Module, Ver. 2.
LS9-AC11DBT Module Figure 6.2-1: Media Connector 6.3. Pin Descriptions 6.3.1. Connector-1 LS9-Media Connector J1 pin outs Functionality Signal Name Signal Name Functionality 3V3 Power Supply Input 3V3 1 2 3V3 3V3 Power Supply Input 3V3 Power Supply Input 3V3 3 4 NC No Connect Ground GND 5 6 GND Ground I2C Serial Clock output. I2C0_SCL 7 8 MCLK I2S Mater Clock Output I2C Serial Data. I2C0_SDA 9 10 BCLK I2S Bit Clock Output Power On Reset input. Active Low.
LS9-AC11DBT Module No Connect NC 13 14 I2S_TXD1/I2S _RXD2 /SPDIF Output I2S_TXD1/I2S_RXD2 /SPDIF Output *1 (LS9 supports one I2S input output in I2S Master mode or LS9 supports two I2S input in I2S Slave/Master mode or this pin can be used for SPDIF Output) No Connect NC 15 16 NC No Connect USB VBUS power input required only for USB device mode operation USB VBUS 17 18 NC No Connect Ground GND 19 20 I2S_RXD1 I2S Receive Data 1 USB DP USB DP 21 22 NC No Connect USB DM USB DM
LS9-AC11DBT Module No Connect NC 41 42 GND Ground Debug UART TXD. Add 10k Pullup UART1_TXD 43 44 NC No Connect Debug UART RXD. Add 10k Pullup. UART1_RXD 45 46 GND Ground Ground GND 47 48 NC No Connect Host MCU UART UART0_TXD interface. Use 10k Pullup. 49 50 NC No Connect Host MCU UART UART0_RXD interface. Use 10k Pullup.
LS9-AC11DBT Module 6.3.2.
LS9-AC11DBT Module Ground GND 41 42 GND Ground No Connect NC 43 44 NC No Connect No Connect NC 45 46 NC No Connect Ground GND 47 48 NC No Connect No Connect NC 49 50 NC No Connect No Connect NC 51 52 GND Ground Ground GND 53 54 NC No Connect No Connect NC 55 56 NC No Connect No Connect NC 57 58 GND Ground Ground GND 59 60 NC No Connect SPI Data Out SPI_SDO 61 62 NC No Connect SPI CS SPI_CS 63 64 GND Ground SPI Clock output SPI_SCLK 6
LS9-AC11DBT Module 8. Environmental 8.1. Storage Conditions The calculated shelf life in a sealed bag is 12 months if stored between -5°C and 70˚C at less than 90% relative humidity (RH). After the bag is opened, devices that are subjected to solder reflow or other high temperature processes must be handled in the following manner: • Mounted within 168 hours in factory conditions, i.e. <30°C at 60% RH. • Storage humidity needs to maintained at <10%RH.
LS9-AC11DBT Module 9. Reference Schematics For detailed schematics of LS9 refer to the latest LS9-EVK Schematic, file in the portal 9.1. EVK Block Diagram Figure 8-1: LS9 EVK Block Diagram 9.2. MFI 2.0C Authentication Circuit Figure 8-2: LS9 EVK Block Diagram Libre Wireless Technologies Data Sheet: Network Media Module, Ver. 2.
LS9-AC11DBT Module 10. Disclaimer THE MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A Pas RTICULAR PURPOSE OR NON-INFRINGEMENT. We use reasonable efforts to include accurate and up-to-date information in this document. It does not however, make any representations as its accuracy or completeness of information. Use of this document is at your own risk.
LS9-AC11DBT Module 1 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: i. This device may not cause harmful interference. ii. This device must accept any interference received, including interference that may cause undesired operation. 2 Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
