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TiWi-uB2 / uBleu2 Module

DATASHEET

The information in this document is subject to change without notice.

TiWi-uB2 / uBleu2 Bluetooth Module

FEATURES

 Built in CC2564 single-chip Bluetooth

fully supports BT 2.1 + EDR, BLE 4.0.

 RF Output Power: +10 dBm (Class 1.5)

 RF Receive Sensitivity: -94 dBm

 Miniature Size: 7 mm x 7 mm x 1.5 mm

 Operating Voltage: 2.2V to 4.8V

 Operating temperature: -30 to +85

 Worldwide acceptance: FCC (USA), IC

(Canada), and CE (Europe)

 RoHS compliant

 Supports maximum Bluetooth data rates

over HCI UART interface.

 Supports multiple Bluetooth profiles with

enhanced QoS, both mono and stereo,

assisted A2DP

APPLICATIONS

 Medical (ex Heart Rate Monitor, Blood

Pressure Sensor, Blood Glucose Meter)

 Thermometer

 Flood Alarm

 Heating Control

 Automatic Key Control

 Industrial Sensors

 Toys

 Entertainment Devices

 Mobile Accessories

 All Bluetooth Wireless Applications

DESCRIPTION

LSR would like to announce a low-cost and low-

power consumption module which has all of the

Bluetooth functionalities. The highly integrated

TiWi-uB2 module makes the use of Bluetooth

headsets and other applications possible.

The TiWi-uB2 module fully supports the dual

mode Bluetooth and BLE operation, and the

output power can support class 1.5. The SIP

module provides UART interface / audio PCM

interface for Bluetooth.

The SIP module is specifically developed for

Smart phones and Portable devices.

Need to get to market quickly? Not an expert in

Bluetooth? Need a custom antenna? Do you

need help with your host board? LS Research

Design Services will be happy to develop

custom hardware or software, or help integrate

the design. Contact us at sales@lsr.com or call

us at 262-375-4400.

ORDERING INFORMATION

Order Number

Description

450-0104

TiWi-uB2 Module (Tray)

450-0104R

TiWi-uB2 Module (Tape & Reel)

450-0105

TiWi-uB2 EM Board

Table 1 Orderable Model Numbers

Summary of content (25 pages)

PAGE 1
TiWi-uB2 / uBleu2 Module DATASHEET TiWi-uB2 / uBleu2 Bluetooth Module FEATURES           DESCRIPTION Built in CC2564 single-chip Bluetooth fully supports BT 2.1 + EDR, BLE 4.0. RF Output Power: +10 dBm (Class 1.5) RF Receive Sensitivity: -94 dBm Miniature Size: 7 mm x 7 mm x 1.5 mm Operating Voltage: 2.2V to 4.8V Operating temperature: -30 to +85o C Worldwide acceptance: FCC (USA), IC (Canada), and CE (Europe) RoHS compliant Supports maximum Bluetooth data rates over HCI UART interface.
PAGE 2
TiWi-uB2 / uBleu2 Module DATASHEET MODULE ACCESSORIES Order Number Description 001-0001 2.4 GHz Dipole Antenna with Reverse Polarity SMA Connector 080-0001 U.FL to Reverse Polarity SMA Bulkhead Cable 105mm Table 2 Module Accessories The information in this document is subject to change without notice.
PAGE 3
TiWi-uB2 / uBleu2 Module DATASHEET TABLE OF CONTENTS FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 ORDERING INFORMATION ........................................
PAGE 4
TiWi-uB2 / uBleu2 Module DATASHEET Repeating Reflow Soldering .................................................................................................................... 17 AGENCY CERTIFICATIONS ............................................................................................. 18 AGENCY STATEMENTS ................................................................................................... 18 Federal Communication Commission Interference Statement ................................
PAGE 5
TiWi-uB2 / uBleu2 Module DATASHEET FOOTPRINT AND PIN DEFINITIONS Figure 1 TiWi-uB2 Module Schematic View Figure 2 TiWi-uB2 Module Footprint View The information in this document is subject to change without notice.
PAGE 6
TiWi-uB2 / uBleu2 Module DATASHEET PIN DESCRIPTIONS Module Pin Name I/O Type 1 HCI_CTS I HCI UART CLEAR-TO-SEND 2 HCI_TX O HCI UART DATA TRANSMIT 3 HCI_RX I HCI UART DATA RECEIVE 4 HCI_RTS O HCI UART REQUEST-TO-SEND 5 GND GND GROUND 6 GND GND GROUND 7 GND GND GROUND 8 SLOW_CLK_IN I 9 GND GND 10 NC1 O NO CONNECT 1 (DO NOT CONNECT) 11 NC2 O NO CONNECT 2 (DO NOT CONNECT) 12 VBAT PI POWER TO MODULE (2.2V - 4.
PAGE 7
TiWi-uB2 / uBleu2 Module DATASHEET ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Symbol VBAT VDD_IO Description Input supply Voltage Min Max Unit -0.5 5.5 V 2.145 V Digital Bluetooth I/O Voltage -0.5 1 Table 4 Absolute Maximum Ratings Recommended Operating Conditions Test conditions: Ambient Temp = 25°C Symbol Min Typ Max Unit VBAT 2.2 3.3 4.8 V 1.62 1.8 1.
PAGE 8
TiWi-uB2 / uBleu2 Module DATASHEET General Characteristics Characteristic Description Model Name TiWi-uB2 Product Description Bluetooth Wireless Module Dimension 7.0 mm x 7.0 mm x 1.5 mm (W*L*T) BT Interface HCI UART, Audio PCM Operating temperature -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing Weight 0.18 g +/- 0.
PAGE 9
TiWi-uB2 / uBleu2 Module DATASHEET Current Consumption – for Different Bluetooth LE Scenarios Conditions: VBAT = 3.6 V, VDDIO = 1.8V, 25°C, 26-MHz fast clock, nominal unit, 10 dBm output power Mode Description Average Current Unit Advertising, nonconnectable Advertising in all 3 channels 1.28msec advertising interval 15Bytes advertise data 104 µA Advertising, discoverable Advertising in all 3 channels 1.
PAGE 10
TiWi-uB2 / uBleu2 Module DATASHEET Bluetooth RF Characteristics General Specifications Feature Description Bluetooth Standard Bluetooth 4.0 (with EDR) Host Interface HCI UART, PCM Antenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2.402 GHz ~ 2.480 GHz Number of Channels 79 channels Modulation FHSS, GFSK, DPSK, DQPSK Table 11 Bluetooth General Specifications RF Characteristics Test Conditions : VBAT = 3.3V, VDDIO = 1.
PAGE 11
TiWi-uB2 / uBleu2 Module DATASHEET BLUETOOTH POWER-UP/ DOWN SEQUENCE Figure 3 Bluetooth Power-Up/Down Sequence nSHUTD Requirements Parameter Symbol Min Max Unit Operation mode level (1) VIH 1.42 1.98 V Shutdown mode level (1) VIL 0 0.4 V 20 us Minimum time for nSHUT_DOWN low to reset the device Rise/fall times 5 Tr/Tf (1) Internal pull-down retains shutdown mode when no external signal is applied to this pin.
PAGE 12
TiWi-uB2 / uBleu2 Module DATASHEET SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS External Slow Clock signal characteristics Characteristic Condition Sym Min Input slow clock frequency Typ Max 32768 Input slow clock accuracy (Initial + temp + aging) Unit Hz -250 250 ppm Input transition time tr/tf - 10% to 90% tr/tf 100 ns Frequency input duty cycle 15 85 % At 1 kHz -125 dBc/Hz Integrated over 300 to 15000 Hz 1 Hz Phase noise Jitter Slow clock input voltage limits Square wave, DC coup
PAGE 13
TiWi-uB2 / uBleu2 Module DATASHEET BLUETOOTH HCI UART Figure 4 Bluetooth HCI UART Timing Symbol Characteristic Condition Min Typ Max Unit Baud rate 37.5 4000 kbps Baud rate accuracy -2.5 1.
PAGE 14
TiWi-uB2 / uBleu2 Module DATASHEET BLUETOOTH AUDIO CODEC/PCM Figure 5 Bluetooth PCM Timing PCM Master Symbol Parameter Condition Min Max Unit 15625 (64 kHz) ns Tclk Cycle time 166.
PAGE 15
TiWi-uB2 / uBleu2 Module DATASHEET SOLDERING RECOMMENDATIONS Recommended Reflow Profile for Lead Free Solder Figure 6 Recommended Soldering Profile Note: The quality of solder joints on the surface mount pads where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.1 “Bottom Only Terminations.” The information in this document is subject to change without notice.
PAGE 16
TiWi-uB2 / uBleu2 Module DATASHEET CLEANING SHIPPING, HANDLING, AND STORAGE In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. Shipping    Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads.
PAGE 17
TiWi-uB2 / uBleu2 Module DATASHEET Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. The information in this document is subject to change without notice.
PAGE 18
TiWi-uB2 / uBleu2 Module DATASHEET AGENCY CERTIFICATIONS FCC ID: TFB-BT1, 15.247 IC ID: 5969A-BT1, RSS 210 CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489 AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
PAGE 19
TiWi-uB2 / uBleu2 Module DATASHEET Industry Canada Statements This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
PAGE 20
TiWi-uB2 / uBleu2 Module DATASHEET OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The TiWi-uB2 Module has been certified for integration into products only by OEM integrators under the following conditions: The antennas for this transmitter must not be co-located with any other transmitters except in accordance with FCC and Industry Canda multi-transmitter procedures. Co-location means having a separation distance of less than 20 cm between transmitting antennas.
PAGE 21
TiWi-uB2 / uBleu2 Module DATASHEET OEM LABELING REQUIREMENTS FOR END-PRODUCT The TiWi-uB2 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module.
PAGE 22
TiWi-uB2 / uBleu2 Module DATASHEET OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. Other user manual statements may apply.
PAGE 23
TiWi-uB2 / uBleu2 Module DATASHEET MECHANICAL DATA Figure 7 Module Mechanical Dimensions The information in this document is subject to change without notice.
PAGE 24
TiWi-uB2 / uBleu2 Module DATASHEET Figure 8 Soldering Footprint for Host Board and Module Placement The information in this document is subject to change without notice.
PAGE 25
TiWi-uB2 / uBleu2 Module DATASHEET CONTACTING LS RESEARCH Headquarters LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: 1(262) 375-4400 Fax: 1(262) 375-4248 Website www.lsr.com Wiki wiki.lsr.com Technical Support forum.lsr.com Sales Contact sales@lsr.com The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products.