A Datasheet Sterling™ LWB5+ Version 0.
LWB5+ Datasheet REVISION HISTORY Version Date Notes Contributors Approver 0.1 TBD Initial preliminary version Andrew Chen Jay White https://www.lairdconnect.com/ 2 © Copyright 2020 Laird Connectivity, Inc.
LWB5+ Datasheet CONTENTS Scope .................................................................................................................................................................................. 5 Introduction .......................................................................................................................................................................... 5 2.1 General Description.........................................................................................
LWB5+ Datasheet 15.3 Surface Mount Conditions ........................................................................................................................................ 37 15.3.1 Soldering ............................................................................................................................................................ 37 15.3.2 Cautions When Removing the SIP from the Platform for RMA ...........................................................................
LWB5+ Datasheet SCOPE This document describes key hardware aspects of the Laird Connectivity Sterling™ LWB5+ series wireless modules providing either SDIO or USB2.0 interface for WLAN connection and UART/PCM, USB2.0/PCM for Bluetooth® connection. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices.
LWB5+ Datasheet LWB5+ SERIES FEATURES SUMMARY The Laird Connectivity LWB5+ series device features are described in Table 2.
LWB5+ Datasheet SPECIFICATIONS Table 3: Specifications Feature Description Physical Interface 68-pin LGA package (including 17 thermal ground pads under the package) Wi-Fi Interface 1-bit or 4-bit Secure Digital I/O; USB 2.0 Bluetooth/BLE Interface Host Controller Interface (HCI) using high speed UART, USB 2.0 Main Chip Cypress CYW4373EUBGT Input Voltage Requirements Operational: VBAT is 3.2V to 4.8V ** EVM/harmonics are improved with VBAT >= 3.6V I/O Signalling Voltage Typical DC 3.2V to 3.
LWB5+ Datasheet Feature Description 802.11ac HT VHT 802.11n MCS Index MCS Index 0 0 1 BPSK 1/2 1 1 1 QPSK 1/2 2 2 1 QPSK 3 3 1 4 4 1 5 5 6 7 Spatial Streams 20 MHz Modulation 40 MHz 80 MHz Coding No SGI SGI No SGI SGI No SGI SGI 6.5 7.2 13.5 15 29.3 32.5 13 14.4 27 30 58.5 65 3/4 19.5 21.7 40.5 45 87.8 97.5 16-QAM 1/2 26 28.9 54 60 117 130 16-QAM 3/4 39 43.3 81 90 175.5 195 1 64-QAM 2/3 52 57.
LWB5+ Datasheet Feature Description 5 GHz Frequency Bands ETSI 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140) 5.725 GHz to 5.85 GHz (Ch 149/153/157/161/165) FCC 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144 5.725 GHz to 5.85 GHz (Ch 149/153/157/161/165) IC 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.
LWB5+ Datasheet Feature Description VHT80; MCS8-9 Bluetooth 1 Mbps (1DH5) 2 Mbps 3 Mbps BLE (1 Mbps) Typical Receiver Sensitivity (PER <= 10%) Note: All values nominal, +/-3 dBm. 802.11a: 6 Mbps 54 Mbps 802.11b: 1 Mbps 11 Mbps 802.11g: 6 Mbps 54 Mbps 802.11n (2.4 GHz) 6.5 Mbps (MCS0; HT20) 65 Mbps (MCS7; HT20) 13.5 Mbps (MCS0; HT40) 135 Mbps (MCS7; HT40) 802.11n (5 GHz) 6.5 Mbps (MCS0; HT20) 65 Mbps (MCS7; HT20) 13.5Mbps (MCS0; HT40) 135Mbps (MCS7; HT40) 11 dBm (12.6 mW) 7 dBm (5 mW) 3 dBm (1.
LWB5+ Datasheet Feature Description Compliance ETSI Regulatory Domain EN 300 328 EN 301 489‐1 EN 301 489‐17 EN 301 893 EN 62368‐1:2014 EN 300 440 2011/65/EU (RoHS) FCC Regulatory Domain FCC 15.247 DTS – 802.11b/g (Wi‐Fi) – 2.4 GHz FCC 15.407 UNII – 802.11a (Wi‐Fi) – 5 GHz FCC 15.247 DSS – Bluetooth 2.1 Industry Canada RSS‐247 – 802.11a/b/g/n (Wi‐Fi) – 2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz RSS‐247 – Bluetooth 2.
LWB5+ Datasheet WLAN FUNCTIONAL DESCRIPTION 5.1 Overview The LWB5+ series wireless module is designed based on the Cypress CYW4373EUBGT 802.11ac/a/b/g/n chipset. It is optimized for high speed, reliable, and low-power embedded applications. It’s integrated with dual-band WLAN (2.4/5GHz) and Bluetooth 5.0. Its functionality includes: Improved throughput on the link due to frame aggregation, RIFS (reduced inter-frame spacing), and half guard intervals.
LWB5+ Datasheet Feature Description WLAN Channel Channel frequency supported. 20 MHz Channel https://www.lairdconnect.com/ Freq. (MHz) Channel 40 MHz Freq. (MHz) Channel Freq. (MHz) 80 MHz Channel Freq.
LWB5+ Datasheet BLUETOOTH FUNCTIONAL DESCRIPTION The LWB5+ series wireless module includes a fully integrated Bluetooth baseband/radio. Several features and functions are listed in Table 5. Table 5: Bluetooth functions Feature Description Bluetooth Interface Bluetooth 5.
LWB5+ Datasheet BLOCK DIAGRAM Figure 1: Block diagram ELECTRICAL CHARACTERISTICS 8.1 Absolute Maximum Ratings Table 6 summarizes the absolute maximum ratings and Table 7 lists the recommended operating conditions for the LWB5+ series wireless module. Absolute maximum ratings are those values beyond which damage to the device can occur. Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended.
LWB5+ Datasheet 8.2 Recommended Operating Conditions Table 7: Recommended operating conditions Symbol (Domain) Min Typ Max Unit 1.62/2.97 1.8/3.3 1.98/3.63 V I/O supply for the RF switch control pads 3.2 3.3 3.63 V External DC power supply 3.2 3.30 3.63 V EVM/harmonics are improved 3.6 — 4.8 V Ambient temperature -40 25 85 °C WLAN and Bluetooth host interface I/O supply VDDIO VDDIO_RF VBAT T-ambient 8.
LWB5+ Datasheet Symbol Parameter Conditions HT40, MCS7 Min Typ Max — -71 — 16 38 — -1 20.4 — 16 33.3 — -2 13.7 — Unit Adjacent channel rejection OFDM, 6 Mbps Radj OFDM, 54 Mbps See Note1 HT20, MCS0 HT20, MCS7 dB Table 11: WLAN Receiver Characteristics for 5 GHz Single Chain Operation Symbol Frx Parameter Conditions Min Typ Max Unit — 5.15 — 5.
LWB5+ Datasheet Table 12: WLAN transmitter characteristics for 2.4 GHz operation (SDIO=VDIO=3.3V) Symbol Parameter Ftx Transmit output frequency range Pout ATx Conditions — Min Typ 2.412 — Max Unit 2.484 GHz Output power See Note2 — — — 11b mask compliant 1-11Mbps — 18 — 11g mask compliant 6-36Mbps — 18 — 11g EVM compliant 48-54Mbps — 18 — 11n HT20 mask compliant MCS0-6 — 18 — 11n HT20 EVM compliant MCS7 — 17.
LWB5+ Datasheet Symbol ATx Parameter Conditions Min Typ Max 11ac VHT20 EVM compliant MCS6-8 — 15 — 11ac VHT40 mask compliant MCS0-5 — 17.5 — 11ac VHT40 EVM compliant MCS6-7 — 16 — 11ac VHT40 EVM compliant MCS8-9 — 13.5 — 11ac VHT80 mask compliant MCS0-5 — 17.5 — 11ac VHT80 EVM compliant MCS6-7 — 16 — 11ac VHT80 EVM compliant MCS8-9 — 13.5 — -2.0 — Transmit power accuracy at 25 ℃ Unit — +2.0 dB Table 15: WLAN current consumption on 5 GHz (SDIO=VDDIO=3.
LWB5+ Datasheet BLUETOOTH RADIO CHARACTERISTICS Table 16 through Table 18 describe the basic rate transmitter performance, basic rate receiver performance, enhanced rate receiver performance, and current consumption conditions at 25°C. Table 16: Basic rate transmitter performance temperature at 25°C (3.3V) Test Parameter Maximum RF Output Power Min Typ Max GFSK — — 7 π/4‐DQPSK — 3 — 8‐DPSK — 3 — BT Spec. Unit 0 ~ +20 dBm Frequency Range 2.4 — 2.4835 2.4 ≤ f ≤ 2.
LWB5+ Datasheet Min Typ Max Bluetooth Spec. Unit π/4‐DQPSK — 10.5 13 ≤ ±13 dB Test Parameter C/I Co‐Channel (BER ≤ 0.1%) C/I 1 MHz adjacent Channel C/I 2 MHz adjacent Channel C/I ≥ 3 MHz adjacent Channel C/I image channel C/I 1 MHz adjacent to image channel Out‐of‐Band Blocking Performance (CW) BER ≤ 0.1% 8‐DPSK — 17.5 21 ≤ ±21 dB π/4‐DQPSK — ‐6 0 ≤0 dB 8‐DPSK — ‐3 5 ≤5 dB π/4‐DQPSK — ‐38.5 ‐30 ≤ ‐30 dB 8‐DPSK — ‐37.
LWB5+ Datasheet HOST INTERFACE SPECIFICATIONS 10.1 SDIO Specifications The LWB5+ series wireless module SDIO host interface pins are powered from the VIO_SD voltage supply. The SDIO electrical specifications are identical for the 1-bit SDIO and 4-bit SDIO modes. 10.1.1 Default Speed, High‐speed Modes Figure 2: SDIO protocol timing diagram--- default mode (3.3V) Figure 3: SDIO protocol timing diagram--- High-Speed mode (3.
LWB5+ Datasheet Symbol Parameter Min. Typ. Max. Default Speed 10 - - High-Speed 7 - - Default Speed 5 - - High-Speed 6 - - Default Speed 5 - - High-Speed 2 - - Output delay time Default Speed - - 14 CL≦40pF (1 card) High-Speed - - 14 Output hold time High-Speed 0 - - TWH Clock high time TISU Input Setup time TIH Input Hold time TODLY TOH 10.1.2 Condition Unit ns ns ns ns ns SDR12, SDR25, SDR50 Mode (up to 100MHz) (1.
LWB5+ Datasheet 10.1.3 SDR104 Mode (208 MHz) (1.8V) Figure 5: SDIO protocol timing Diagram--- SDR104 modes (up to 208 MHz) (1.8V) Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 22: SDIO timing requirements -- SDR104 modes (up to 208MHz) (1.8V) Symbol Parameter Condition Min. Typ. Max. Unit fPP Clock Frequency SDR104 0 - 208 MHz TISU Input setup time SDR104 1.4 -- - ns TIH Input Hold time SDR104 0.
LWB5+ Datasheet 10.1.4 SDR50 Mode (50MHz) (1.8V) Figure 6: SDIO CMD timing diagram--- SDR50 modes (50 MHz) (1.8V) Figure 7: SDIO DAT[3:0] timing Diagram--- SDR50 modes (50 MHz) (1.8V) Note: In SDR50 mode, DAT[3:0] lines are samples on both edges pf the clock (not applicable for CMD line) Table 23: SDIO timing requirements – SDR50 modes (50 MHz) Symbol Parameter Condition Min. Typ. Max.
LWB5+ Datasheet Symbol Parameter Condition Min. Typ. Max. Unit SDR50 -- -- 13.7 ns SDR50 1.5 -- -- ns SDR50 3 -- -- ns SDR50 0.8 -- -- ns SDR50 -- -- 7.0 ns SDR50 1.
LWB5+ Datasheet Symbol TLRFM Parameter Rise and fall time matching Min. Typ. Max. Unit 80.0 - 125.0 % -95 - 95 ns -150 - 150 ns Source jitter total: to next transition *Including frequency tolerance. Timing difference between the differential data signals. TUDJ1 *Defined at crossover point of differential signals Source jitter total: for paired transitions *Including frequency tolerance. Timing difference between the differential data signals.
LWB5+ Datasheet Symbol Parameter Min. Typ. Max. Unit -4.0 - 4.0 ns -2.0 - 5.0 ns Source jitter total: for paired transitions *Including frequency tolerance. Timing difference between the differential data signals. TDJ2 *Defined at crossover point of differential signals Source jitter for differential transition to SE0 transition. Defined at crossover point of differential signals TFDEOP Receiver Specifications VIH Input signal ended high 2.
LWB5+ Datasheet 10.3 PCM Interface Specifications Figure 8: PCM Timing Specification – Master Mode Table 27: PCM timing specification – master mode Symbol Parameter Min. Typ. Max. Unit FBCLK - - 2/2.048 - MHz Duty CycleBCLK - 0.4 0.5 0.6 - TBCLK rise/fall - - 3 - ns TDO - - - 15 ns TDISU - 20 - - ns TDIHO - 15 - - ns TBF - - - 15 ns Figure 9: PCM Timing Specification – Slave Mode Table 28: PCM timing specification – slave mode Symbol Parameter Min.
LWB5+ Datasheet Symbol Parameter Min. Typ. Max. Unit TDO - - - 30 ns TDISU - 15 - - ns TDIHO - 10 - - ns TBFSU - 15 - - ns TBFHO - 10 - - ns PIN DEFINITIONS Table 29: Pin definitions of LWB5+ series wireless module Pin # Name Type Pins map to Chip Voltage Ref.
LWB5+ Datasheet Pin # 16 Name Type GND - Pins map to Chip - Voltage Ref. - If Not Used Function Ground GND DC supply voltage for module. 17 VBAT PWR I/P - VBAT Operational: VBAT is 3.2V to 4.8V (See VDDIO_RF configuration) -- ** EVM/harmonics are improved with VBAT >= 3.6V DC supply voltage for module. 18 VBAT PWR I/P - VBAT Operational: VBAT is 3.2V to 4.8V (See VDDIO_RF configuration) -- ** VBAT at 3.6V to 4.8V has the same TX power but a better EVM/harmonic emissions margin.
LWB5+ Datasheet Pin # Name Type Pins map to Chip Voltage Ref. If Not Used Function 32 BT_REG_ON I C3 VDDIO Enables Bluetooth regulators. Internal 10K pull-up to enable Bluetooth by default. Ground to disable Bluetooth. NC 33 WL_REG_ON I D4 VDDIO Enables WLAN regulators. Internal 10K pull-up to enable WLAN by default. Ground to disable WLAN. NC G2 GND - - - 34 SUSCLK I J2 VDDIO 35 GND - 36 GPIO_0 I/O - Ground GND External Sleep Clock input (32.
LWB5+ Datasheet HOST CONFIGURATION OPTIONS LWB5+ series wireless module support various host configurations for WLAN and Bluetooth. Its detail configurations are shown in following table (Error! Reference source not found.). Table 30: Wi-Fi host interface configuration table Strap Value CONFIG_HOST [2-0] 000 101 100 WLAN Bluetooth/BLE Notes USB SDIO SDIO USB UART UART USB2.0 SDIO 1.8V (Supports DS/HS and SDR speed modes) SDIO 3.
LWB5+ Datasheet Figure 11: Module dimension of LWB5+ series wireless module – Top View Note: The Wi-Fi MAC address is located on the product label. The last digit of Wi-Fi MAC address is assigned to either 0, 2, 4, 6, 8, A, C, E. The Bluetooth MAC address is the Wi-Fi MAC address plus 1. https://www.lairdconnect.com/ 34 © Copyright 2020 Laird Connectivity, Inc.
LWB5+ Datasheet RF LAYOUT DESIGN GUIDELINES The following is a list of RF layout design guidelines and recommendation when installing a Laird Connectivity radio into your device. Do not run antenna cables directly above or directly below the radio. Do not place any parts or run any high-speed digital lines below the radio. If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices as far apart from each other as possible.
LWB5+ Datasheet 15.1.3 Temporary Storage Requirements after Opening The following are temporary storage requirements after opening: Only re-store the devices once prior to soldering. Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heat-sealing.
LWB5+ Datasheet 15.3 Surface Mount Conditions The following soldering conditions are recommended to ensure device quality. 15.3.1 Soldering Note: When soldering, the stencil thickness should be ≥ 0.1 mm. Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment) Measuring point – IC package surface Temperature profile: Figure 12: Temperature profile https://www.lairdconnect.com/ 37 © Copyright 2020 Laird Connectivity, Inc.
LWB5+ Datasheet 15.3.2 Cautions When Removing the SIP from the Platform for RMA Bake the platform before removing the SIP from the platform. Reference baking conditions. Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician. Suggestion conditions: One-side component platform: – Set the hot plate at 280°C. – Put the platform on the hot plate for 8~10 seconds. – Remove the SIP from platform.
LWB5+ Datasheet The LWB5+ modules are MSL level 4 REGULATORY 16.1 Regulatory IDs Summary Model US/FCC Canada/IC MIC Sterling LWB5+ SQG-LWB5PLUS 3147A-LWB5PLUS 201-200402 16.2 Certified Antennas The SQG-LWB5PLUS was tested with antennas listed in the following table. The OEM can choose a different manufacturer’s antenna but must make sure it is of same type and that the gain is lesser than or equal to the antenna that is approved for use.
LWB5+ Datasheet Important Note: Radiation Exposure Statement The product complies with the US portable RF exposure limit set forth for an uncontrolled environment and is safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. Country Code selection feature to be disabled for products marketed to the US/CANADA.
LWB5+ Datasheet This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.
LWB5+ Datasheet Radiation Exposure Statement: This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Déclaration d'exposition aux radiations: Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé.
LWB5+ Datasheet JAPAN (MIC) REGULATORY The Sterling LWB5+ is approved for use in the Japanese market. The part numbers listed below hold WW type certification. Refer to ARIB-STD-T66 for further guidance on OEM’s responsibilities. Model 453-00045 453-00046 453-00047 453-00048 453-00049 Certificate Number 201-200402 201-200402 201-200402 201-200402 201-200402 Antenna Chip Antenna MHF4L Connector Trace Pin MHF4L Connector MHF4L Connector 17.
LWB5+ Datasheet EUROPEAN UNION The 453-00059/453-00060 have been tested for compliance with relevant standards for the EU market. The 453-00060 module was tested with a 2 dBi antenna. The OEM can operate the 453-00041 module with any other type of antenna but must ensure that the gain does not exceed 2 dBi to maintain the Laird approval.
LWB5+ Datasheet 18.2 Antenna Information The antennas listed below were tested for use with the SQG-LWB5PLUS. For CE mark countries, the OEM is free to use any manufacturer’s antenna and type of antenna if the gain is less than or equal to the highest gain approved for use. Contact a Laird Connectivity representative for more information regarding adding antennas. Manufacturer Model Peak Gain Laird Connectivity Part Number Type Connector 2.4GHz 5GHz Laird 2.4/5.
LWB5+ Datasheet ORDERING INFORMATION Part Number 19.1 Description 453-00045R 1x1 802.11 a/b/g/n/ac + Bluetooth 5.0 - Integrated Antenna (Tape and Reel) 453-00046R 1x1 802.11 a/b/g/n/ac + Bluetooth 5.0 – MHF4 (Tape and Reel) 453-00047R 1x1 802.11 a/b/g/n/ac + Bluetooth 5.0 – Trace Pin (Tape and Reel) 453-00045C 1x1 802.11 a/b/g/n/ac + Bluetooth 5.0 – Integrated Antenna (Cut Tape) 453-00046C 1x1 802.11 a/b/g/n/ac + Bluetooth 5.0 – MHF4 (Cut Tape) 453-00047C 1x1 802.11 a/b/g/n/ac + Bluetooth 5.
LWB5+ Datasheet BLUETOOTH SIG QUALIFICATION 20.1 Overview The LWB5+ Series module is listed on the Bluetooth SIG website as a qualified Controller Subsystem. Design Name Owner Declaration ID Link to listing on the SIG website Laird Connectivity Laird Connectivity It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID.
LWB5+ Datasheet ADDITIONAL ASSISTANCE Please contact your local sales representative or our support team for further assistance: Laird Connectivity Support Centre: https://www.lairdconnect.com/resources/support Email: wireless.support@lairdconnectivity.com Phone: Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: https://www.lairdconnect.com/products Note: Information contained in this document is subject to change. © Copyright 2020 Laird Connectivity. All Rights Reserved.
