Non-Contact Integral Wafer™ User Manual 5451 Patrick Henry Dr. Santa Clara, CA 95054 408-986-5600 Fax 408-986-5601 info@sensarray.com www.sensarray.
Copyright © 2006 by °SensArray® Corporation. All rights reserved. UM-INT- 2007.04 SensArray reserves the right to modify, change, or improve any or all specifications published in this document without notice.
Important Notices Warranty Integral Wafer System Hardware SensArray Corporation warrants that the contact style or non-contact style Integral Wafer Systems (“Products”) sold will be free from defects in material and workmanship, and perform to SensArray’s applicable published specifications for a period of 12 months after shipment for the Docking Station. The Integral Wafer is warranted for 6 months or a specified number of operating hours, whichever occurs first.
Software License Agreement The Software is owned by SensArray Corporation and is protected by United States copyright laws and international treaty provisions. Therefore, you must treat the Software like any other copyrighted material. Under the Copyright Laws, the Integral Wafer Software, or accompanying written materials, may not be copied, photo-copied, reproduced, translated, in whole or in part, without the prior written permission of SensArray.
Radio Frequency Interference Compliance Applies to the Storage Cases and RF Carrier Station NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
Table of Contents i Using This Manual ..................................................................................................................iii Overview .......................................................................................................................................... iii What You Need to Know................................................................................................................. iii Conventions Used in this Manual ...............................
iii Using This Manual Overview This manual consists of the following sections. • Chapter 1, Overview—Discusses features, components, and configurations of the Non-contact Integral Wafer System. • Chapter 2, System Setup—Discusses unpacking the system components, preparing the equipment for the cleanroom, and connecting the system cables. • Chapter 3, Using the Charge and Communication Carrier Station— provides an easy means to prepare the wafer for data acquisition and to perform data retrieval.
iv Using This Manual Conventions Used in this Manual Several standard conventions are used in the text of this manual to make the information presented a little clearer and easier to understand. Every attempt is made to be consistent in the application of these conventions. Note: Highlights important information. Bold Bold text indicates button names, icon names, and menu items. italic Italic text indicates the section and/or chapter name in a cross-reference.
1-1 Chapter 1 Overview The Integral Wafer User Manual is designed to document the setup and use of the Integral Wafer system in conjunction with the Integral Wafer Controller software. This manual will discuss only the non-contact version of the Integral Wafer. The results of the measurement run may be analyzed using the Thermal MAP Analysis Software included with the system. The Thermal MAP Analysis software program is documented in the Thermal MAP Analysis Software User Manual.
1-2 Overview Analyzing Data The data files acquired by the Integral Wafer may be analyzed using Thermal MAP Analysis Software to view XY graphs, contour maps, surface maps, animations, and data tables. For more information on the use of the Analysis portion of the Thermal MAP 3 software, please refer to the Thermal MAP 3 Analysis Software User Manual included on the CD. The data can be viewed and evaluated in table form if desired.
Overview 1-3 Figure 1-2. Displaying Data on a Line Plot Graph You can also create a two-dimensional color contour map as shown in Figure 1-3 or a threedimensional surface map as shown in Figure 1-4 of a single sample point. Figure 1-3. 2-Dimensional Color Contour Map Non-contact Integral Wafer User Manual Figure 1-4.
1-4 Overview With the Animation feature, an animation of the survey data can be created. The animation can be set for a particular range of the acquired samples, saved to a standard AVI file, and replayed at any time. The AVI file can be sent to other computers not running the Thermal MAP software and played using the Windows Media Player or other compatible video players. Data may also be exported to a spreadsheet program, edited in the spreadsheet, and loaded back to Thermal MAP for further analysis.
2-1 Chapter 2 System Setup Before you can begin working with the non-contact Integral Wafer system, you need to unpack the system components, prepare the equipment for transfer to the cleanroom, and charge the wafer batteries. Before You Begin Before using the Integral Wafer, there are several safety and handling precautions that should be noted. Please read the information provided in this manual and become familiar with the Integral Wafer before attempting your first thermal survey.
2-2 System Setup Unpacking Your System Inventory all items and compare to the packing list included with the shipment. Retain all packaging materials for the system. This is required for the return of the Integral Wafer for repairs or recalibration. If any parts are missing or damaged, contact SensArray immediately. Be prepared to provide a list of the missing and/or damaged components, the Purchase Order Number, and the SensArray Sales Order Number.
System Setup 2-3 The maintenance module is placed on top of the wafer to allow for wireless maintenance. The module is enclosed and sealed in a clean room compatible plastic bag. Do not remove the maintenance module from its bag. It is there to ensure that the surface the wafer comes into contact with is clean. There is an LCD screen that indicates the wafer serial number and battery voltage. A blinking blue LED also indicates that the wafer is good.
2-4 System Setup Place maintenance module back into case, flip RF shield back over module and replace lid. Save case for future use. Charging the Equipment Before Use Place the Integral Wafer into the carrier station shipped with the unit to maintain the charge on the internal batteries. Please see Using the Charge and Communication Carrier Station for more information on inserting and removing the wafer to and from the carrier stations.
System Setup 2-5 5. Using Windows Explorer or My Computer, navigate to the \THERMAL MAP.INSTALL folder and run the installer program. Follow the onscreen directions of the installer program. Do not change any default directories; this could cause problems when the program is run. 6. Remove the Integral Wafer CD from the CD drive. 7. Insert the Wafer Configuration CD and run the setup.exe program on the CD. This will install the calibration file for your wafer into the proper directory on the computer.
2-6 System Setup Cleaning the Carrier Station. The carrier station is easily cleaned by wiping the surfaces with a cleanroom cloth dampened with IPA. Nothing harsher is needed to remove contamination from the surface. Be sure to clean the interior of the carrier station. Debris on the surface may cause stress points on the Integral Wafer when the lid is closed. To avoid damage to the Integral Wafer, only clean the interior of the carrier when the wafer is not present.
3-1 Chapter 3 Using the Charge and Communication Carrier Station The Carrier Station is available in both 200 and 300mm versions and provides a method of charging and communicating with the wafer through an RF signal rather than a set of contact pins. Using the Carrier Station The carrier station protects the Wafer and maintains the battery charge during storage. It also provides the communication link between the Wafer and the host computer.
3-2 Using the Carrier Station Table 3-1: LED status indicators LED color Indicates Green Successful USB connection to computer Yellow USB communications activity Red Wafer Charging Blue Communication received from wafer Red/Blue alternating Wafer measurement has been initiated Carrier reset switc h Green LED USB port Yellow LED Red LED Blue LED Figure 3-2.
Using the Carrier Station 3-3 Removable rec hargeable battery Figure 3-3. Backside of C/C Carrier Figure 3-4.
3-4 Using the Carrier Station Figure 3-5. C/C Carrier Station Closed To open the carrier station and gain access to the wafer, push in the white Delrin cover latch button as shown in Figure 3-6 and lift the handle attached to the lid. Latch Button Figure 3-6.
Using the Carrier Station 3-5 Once the lid is raised completely, spring tension will keep it open. Figure 3-7. Carrier Station Open CAUTION: Only handle the Wafer on the edges with gloves on. The wafer is locked to the surface of the white plastic insert on the carrier station by a spring-loaded clamp mounted to the side of the carrier station. To unclamp the wafer, pull the wafer clamp straight out until it clears the side of the wafer carrier.
3-6 Using the Carrier Station Wafer Clamp Figure 3-8. Wafer Clamp Removing the Wafer from the Carrier Station While the Lid is opened, you can slide the wafer off the carrier plastic insert surface. A groove is provided on the right-hand side of the carrier station surface to allow you to get your finger below the side of the wafer as shown in Figure 3-9.
Using the Carrier Station 3-7 Figure 3-9. Wafer Removal Points Remove wafer in this direction only Figure 3-10. Removing the Wafer from the Carrier Station You can now place the wafer in a wafer cassette or other loading mechanism to perform the thermal survey. CAUTION: Only handle the wafer from the bottom or by the edges as much as possible. Always ensure the backside of wafer is cleaned of any particle or any other materials.
3-8 Using the Carrier Station Latched Unlatched Figure 3-11. Lid Locking Pin The C/C carrier has an LCD on top left corner. When lid is opened, the message System Idle should be displayed. LCD Display White insert Figure 3-12. Idle Message Displayed When wafer is present and lid is closed, the LCD will display Loading Wafer. Once the wafer is detected, the message Wafer Ready will display and the blue LED will blink.
Using the Carrier Station 3-9 Figure 3-13. Wafer Ready Displayed If you close the LID and no wafer is inside the carrier, you will see the message No Wafer detected. There may be a delay between the carrier LCD display messages and the system controller application message on your laptop. Do not use the wafer until you actually see the message display on the system controller application. Figure 3-14.
4-1 Chapter 4 Using the Integral Wafer System Controller Software The Integral Wafer System Controller is a software program that communicates with the Integral Wafer through the 200 mm and 300 mm carrier station. It monitors the status of the system, retrieves data from completed thermal surveys, and sets up the parameters for the next set of surveys. Before using the controller software, please read instructions on using the Carrier Station.
4-2 Using the Carrier Station Controller NOTE: If the program cannot locate the Integral Wafer or the carrier station, verify that the carrier station is connected to the computer, the wafer is correctly aligned inside the carrier station with lid closed and that the appropriate calibration file for the wafer is loaded onto the computer. If the carrier station is connected but no wafer is present, you will see the screen in Figure 42. Figure 4-2.
Using the Carrier Station Controller 4-3 Figure 4-3. Wafer Voltage Too Low At the very bottom of the screen, a small box displays status messages for actions performed by the software. Clicking the Exit button at any time will cause the program to end and return you to Windows. The System Info tab screen shows the vital information for the carrier station, and the wafer. When the carrier station is attached, it also displays the voltages of the Carrier CPU and Main Battery.
4-4 Using the Carrier Station Controller Figure 4-4. System Info Tab Program Screen The Wafer Type section shows the model and serial number of the wafer currently connected, as well as the firmware version. It also shows the current wafer voltage and status of the wafer battery monitor (enabled or disabled). The Station Type section shows the model and serial number of the docking station currently connected, as well as the firmware version. It also displays the controller software version.
Using the Carrier Station Controller 4-5 Figure 4-5. The About Tab Screen If the program is not properly licensed, the about screen will show the message No Valid License Found in the Product Registration Status area. The program will not make a measurement unless it is properly registered. Improper registration can occur if a fresh installation was performed on the computer after a system crash or other similar occurrence or if the license key file was accidentally deleted. Figure 4-6.
4-6 Using the Carrier Station Controller Click on the Software Licensing Information button at the bottom of the screen to open an information box. The box will display a unique registration key that is specific to your computer. Figure 4-7. Registration Key Dialog Copy the text displayed in the Registration Key box exactly as it appears. Send an email to SensArray or the Sales representative you purchased the software from and include the text from the registration key.
Using the Carrier Station Controller 4-7 Wafer Time Limit Feature To ensure optimum performance, as well as to help prevent possible structural or mechanical wafer failures, Integral Wafers that are intended for use in certain processes or applications are equipped with a built-in time limit feature. When the maximum recommended operating time has been reached, the wafer will automatically cease to operate. Refer to your wafer’s specifications for environmental operational limits and allotted usage hours.
4-8 Using the Carrier Station Controller When the available usage time has elapsed, the Measurement tab will no longer display any wafer deployment options. Figure 4-11.
Using the Carrier Station Controller 4-9 Defining a Survey 1. From the Measurement tab, click on the Configure Sensor Banks button to setup the measurement parameters. The number of banks and sensors displayed on the configuration screens depends on the size of the wafer. 2. If you note sensor locations on the sensor display that are marked with an X, these are sensors that are disabled. You cannot enable or disable individual sensors using this program, only banks of sensors. Figure 4-12.
4-10 Using the Carrier Station Controller Figure 4-13. Select Enabled Sensors Window 7. Click the Save button when finished to save the new configuration to the Integral Wafer. The window closes and returns you to the Measurement Options window NOTE: The disabled sensors will be noted in the Integral Wafer memory. Data will still be taken during the measurement, but the data will not be written to the output file when the data is transferred from the wafer.
Using the Carrier Station Controller 4-11 Figure 4-14. Selecting Temperature Trigger Type 10. Select Absolute from the drop down list next to Temperature Trigger Type. Enter the desired trigger temperature into the box in degree Celsius. Your Trigger is now set. If the trigger temperature is unknown or varies from run to run, selecting Transient from the drop down list may be a preferred option. With the temperature trigger set to transient, a 0.35°C per second gradient will activate the wafer.
4-12 Using the Carrier Station Controller 12. Click on the Enable Measure Delay check box to allow setting a measurement delay. Click on the down arrow on the drop-down box and select the amount of delay desired before the measurement starts. You can only select the fixed values (from 1 minute to 1 hour) in the drop-down list, typing a custom time value will not work. Figure 4-16.
Using the Carrier Station Controller 4-13 Transferring Wafer Data 1. Connect the carrier station to the computer with the USB cable. The program will automatically recognize the wafer. Figure 4-17. Getting Wafer Data NOTE: If you are connected to the wafer through a carrier station, and there is data on the wafer, a message appears for you to download the data. Figure 4-18. Download Data Click Yes to download the data or No to ignore it.
4-14 Using the Carrier Station Controller Figure 4-19. File Transfer Dialog Box 5. The Save As dialog box appears. This is a standard Windows dialog box. 6. Type the new name for the file in the File name: box or select an existing file name from the list. Figure 4-20. Selecting the Folder 7. Select the directory to place the file into in the Save in: dropdown and click the Save button to start the download. You may create a new folder, if needed, by clicking the new folder icon. 8.
Using the Carrier Station Controller 4-15 program, please read the Analysis Software User Manual located in the C:\SensArray\Documentation folder on the host computer or use the Help file in the Thermal MAP Program. NOTE: If the Thermal MAP Analysis does not start automatically, this normally means that the program was not upgraded on your computer. You can start Thermal MAP from the desktop icon or click Start»Programs»SensArray»Thermal MAP from the start menu. Verify that the version is 3.0.6 or higher.
A-1 Appendix A Reference Information Sensor Bank Reference Tables 1 and 2 detail the sensors that make up each bank for 200mm and 300mm wafers. Table 1. 200mm Bank Definitions for 53 Sensors Bank Sensors 1 C07 C11 F30 F32 G34 G36 H40 H48 2 C09 C13 F31 F33 G35 G37 H44 H52 3 C08 C12 D16 D20 E24 E28 H42 H50 4 C06 C10 D14 D18 E22 E26 H38 H46 5 H39 H41 H43 H45 H47 H49 H51 H53 6 D15 D17 D19 D21 E23 E25 E27 E29 7 B02 B03 B04 B05 A01 Table 2.
A-2 Reference Information Correlating Sensor Coordinates Use the R, theta coordinates listed in tables 3 and 4 along with the layout drawings in figures 1 and 2 to match the sensor position on the wafer to the matching position on your hotplate or surface. For reference only. Drawing not to scale. Figure 1.
Reference Information A-3 Table 3. 200mm Integral Wafer Sensor Positions Sensor Radius (mm) Theta Sensor Radius (mm) Theta A01 0 0 E27 77 315 B02 14 90 E28 77 0 B03 14 180 E29 77 45 B04 14 270 F30 90 135 B05 14 0 F31 90 225 C06 35 90 F32 90 315 C07 35 135 F33 90 45 C08 35 180 G34 94 135 C09 35 225 G35 94 225 C10 35 270 G36 94 315 C11 35 315 G37 94 45 C12 35 0 H38 97 90 C13 35 45 H39 97 112.
A-4 Reference Information For reference only. Drawing not to scale. Figure 2.
Reference Information A-5 Table 4. 300mm Integral Wafer Sensor Positions Sensor Radius (mm) Theta Sensor Radius (mm) Theta A01 0 0 E34 110 270 B02 9 135 E35 110 292.5 B03 9 225 E36 110 315 B04 9 315 E37 110 337.5 B05 9 45 E38 110 0 C06 37 90 E39 110 22.5 C07 37 180 E40 110 45 C08 37 270 E41 110 67.5 C09 37 0 F42 147 90 D10 74 90 F43 147 105 D11 74 112.5 F44 147 120 D12 74 135 F45 147 135 D13 74 157.
