Surface Mount Metallized PPS Film Capacitor LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Overview Applications Polyphenylene sulphide (PPS) film capacitor for surface mounting. Typical applications include timing, filtering and use as a memory capacitor. The LDB Series is designed for high stability, accuracy and temperature. Benefits • Rated voltage: 16VDC – 50VDC • Capacitance range: 0.0033µF – 0.
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Ordering Options Table Packaging Code Packaging Type Standard Packaging Options Tape & Reel (Standard Reel) N Dimensions – Millimeters L W B H W Size Code Chip Size (EIA) Nominal Tolerance A B C 1206 1210 1812 1.7 2.5 3.3 ±0.2 ±0.3 ±0.3 H (Maximum) See Part Number Table L B Nominal Tolerance Nominal Tolerance 3.3 3.3 4.7 +0.3/−0.1 +0.3/−0.1 +0.3/−0.2 0.5 0.5 0.5 +0.5/−0.
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Performance Characteristics Rated Voltage (VDC) Capacitance Range (μF) Chip Size (EIA) Capacitance Values Capacitance Tolerance Category Temperature Range Rated Temperature Voltage Derating 16 50 0.012 – 0.1 0.0033 – 0.1 1206 – 1812 E12 series ±2%, ±5% −55°C to +125°C +105°C VC (category voltage) = VR (rated voltage) up to 105°C. Vc is decreased with 1.
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC PPS Dielectric Typical Temperature Graphs PPS Dielectric Typical Frequency Graphs Capacitance vs. Frequency Capacitance vs. Temperature (f = 1 kHz) 2.0 1.5 1.0 ∆ C/C [%] 1.0 ∆ C/C [%] 0.5 0.0 −0.5 0.0 −1.0 −1.5 −0.5 −2.0 0.1 −1.0 −1.5 −60 −40 −20 0 20 40 60 80 1 10 100 f [kHZ] 100 tg δ x 10−4 80 Dissipation Factor vs.
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Environmental Test Data Damp Heat, Steady State Test Conditions Temperature Relative Humidity (RH) Test Duration Test Conditions Capacitance Change |∆ C/C| 93% ±2% DF Change (∆tgδ) 56 days Insulation Resistance ≤ 3% ≤ 50 x 10−4 at 1 kHz ≥ limit value No Mechanical Damage ≤ 5% DF Change (∆tgδ) ≤ 30 x 10 at 1 kHz Insulation Resistance ≥ 50% of limit value Bending −4 Test Conditions De
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Table 1 – Ratings & Part Number Reference Dimensions in mm VDC Capacitance Value (µF) Size Code Chip Size New KEMET Part Number Legacy Part Number W H (max) L 16 16 16 16 16 16 16 16 16 16 16 16 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.082 0.10 0.0033 0.0039 0.0047 0.0056 0.0068 0.0082 0.010 0.012 0.015 0.
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Soldering Process Reflow Recommendations Preheating Maximum Preheating Time 180 seconds Minimum Temperature 150°C Maximum Temperature 200°C Maximum Time within Tmax and Tmax – 5°C (∆T5) Maximum Time Over 217°C (∆T217) Maximum Temperature Ramp Rate Temperature Reflow Temperature Profile Tmax Tmax−5°C ∆T5 217°C Preheating ∆T217 30 seconds (Tmax ≤ 250°C) 10 seconds (250 °C < Tmax ≤ 260°C
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Flux/Cleaning/Storage and Moisture cont'd B Manual assembly recommendations If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the components. Our recommendations are the following (see Fig. 1): C 1. When using tweezers, the components should be gripped across the two terminations (A); 2. Avoid any contact with the two cutting surfaces (C); 3.
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Packaging Quantities Chip Size (EIA) 1206 1206 1206 1210 1210 1210 1210 1210 1210 1812 1812 Height (mm) Reel 1.1 1.2 1.3 1.4 1.5 1.7 1.9 2.0 2.3 1.7 2.0 3,000 3,000 3,000 2,250 2,250 2,250 2,250 2,250 2,250 4,000 3,000 Landing A B Size 1206 1210 1812 C D Dimensions in mm A B C D 1.5 2.3 3 1.1 1.1 1.7 2.3 2.3 3.1 4.5 4.5 6.
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end termination capacitor's body mechanical deformation capacitance drop (up to 20%) capacitance drop (over 20%) Typical cause Typical solution landing area dimensions see landing areas suggestions, page 9 solder paste quality see solder paste suggestions, page 9 not-uniform
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Carrier Taping & Packaging (IEC 60286–2) Horizontal Taping Orientation 2.0±0.05 1.5 +0.1 0 1.75±0.1 +0.3 W−0.1 L P±0.1 SMD Film Capacitor (Top View) Chip Size (EIA) Horizontal Mounting 1206 1210 1812 1812 W2 T B0 4.0±0.1 K0 A0 Tape Ø W1 Reel Dimensions in mm Taping Specification W H L W Nominal Nominal Nominal −0.1/+0.3 +/−0.1 P1 Nominal Nominal Nominal −/+2.
Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change.
