Datasheet

ManualsBrandsKEMET ManualsCapacitorsCeramic Capacitor 2.2nF, 10V, 0402, ±5 %

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

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Benets

• AEC–Q200automotivequalied

• Up to 10x increase in capacitance versus C0G

• Extremely low effective series resistance (ESR)

• Extremely low effective series inductance (ESL)

• High ripple current capability

• Low noise solution similar to C0G

• Retains over 99% of nominal capacitance at full rated voltage

• Small predictable and linear capacitance change with respect

to temperature

• Operatingtemperaturerangeof−55°Cto+125°C

• Capacitance up to 470 nF

• DC voltage ratings up to 100 V

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC

(Commercial & Automotive Grade)

Overview

KEMET U2J dielectric features a maximum operating

temperatureof125°Candisconsideredstable.The

Electronics Industries Alliance (EIA) characterizes U2J

dielectric as a Class I material. Components of this

classicationaretemperaturecompensatingandare

suited for resonant circuit applications or those where Q

and stability of capacitance characteristics are required.

U2J is an extremely stable dielectric material that exhibits

a negligible shift in capacitance with respect to voltage

and boasts a predictable and linear change in capacitance

with reference to ambient temperature with no aging

effect. In addition, U2J dielectric extends the available

capacitance range of Class I MLCCs to achieve values

previously only available using Class II dielectric materials

like X7R, X5R, Y5V and Z5U.

U2J is not sensitive to DC Bias as compared to Class

II dielectric materials and retains over 99% of nominal

capacitance at full rated voltage. KEMET automotive grade

capacitors meet the demanding Automotive Electronics

Council'sAEC–Q200qualicationrequirements.

Capacitancechangeislimitedto−750±120ppm/°Cfrom

−55°Cto+125°C.Thesedevicesarelead(Pb)-free,RoHS

and REACH compliant without exception and are capable

ofwithstandingmultiplepassesthroughalead(Pb)-free

solderreowprole.

Applications

• Wireless charging

• Resonant LLC converters

• Powerconversion

• Pulsecircuits

• High ripple current

• Critical timing

• Decoupling

• Transient voltage suppression

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Summary of content (20 pages)

PAGE 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Overview KEMET U2J dielectric features a maximum operating temperature of 125°C and is considered stable. The Electronics Industries Alliance (EIA) characterizes U2J dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required.
PAGE 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Ordering Information C Ceramic 1206 Case Size Specification/ (L" x W") Series1 0402 0603 0805 1206 1210 1812 1 2 C C= Standard 104 Capacitance Code (pF) Two significant digits and number of zeros.
PAGE 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Qualification/Certification Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
PAGE 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components.
PAGE 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) L W B T S EIA Metric Size Size Code Code L Length W Width T Thickness B Bandwidth S Mounting Separation Technique Minimum 0402 1005 1.00 (0.040) ±0.05 (0.002) 0.50 (0.020) ±0.05 (0.002) 0.30 (0.012) ±0.10 (0.004) 0.30 (0.012) 0603 1608 1.60 (0.063) ±0.15 (0.006) 0.80 (0.032) ±0.15 (0.006) 0.35 (0.014) ±0.15 (0.006) 0.70 (0.
PAGE 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Electrical Characteristics (Typical) Capacitance vs. Temperature (TCC) Capacitance Change (%) 15 10 5 0 −5 −10 −15 −60 −40 −20 0 20 40 60 80 100 120 140 Temperature (°C) 0.0 Capacitance Change (%) Capacitance Change (%) DC & AC Bias Effective Capacitance −0.1 −0.2 −0.3 −0.4 −0.5 0 5 10 15 20 0.00 −0.02 −0.04 −0.06 −0.08 −0.
PAGE 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) 50 3 5 8 4 3 5 1 10 16 25 50 16 25 50 FB 10 FB 10 FB 50 FB 25 FB 16 EB 10 EB 50 EB 25 EB 16 DN DN DN DN DN DN DN DN DN 10 DN DN DN DN DN DN DN DN DN 50 DN DN DN DN DN DN DN DN DN 25 DN DN DN DN DN DN DN DN DN 16 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF
PAGE 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) cont'd 8 4 3 FB FB FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM FB FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM FB FB FB FB FB FC FC FC FE FG FG FG FH FT FI 5 50 1 25 5 16 3 10 4 100 50 8 50 25 5 25 16 Case Size/ Series 3 GB GB GB GB GB GB GB GB GB GB GB GB GC GH GK GB GB GB GB GB G
PAGE 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity1 Plastic Quantity Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB CF DN DP DG EB EC EE EF EH FB FC FE FG FH FM FT FI GB GC GH GK GN 0402 0603 0805 0805 0805 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 0.50 ± 0.05 0.
PAGE 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0402 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.
PAGE 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques.
PAGE 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Terminal Strength JIS-C-6429 Board Flex JIS-C-6429 Test or Inspection Method Package Size (L" x W") Force Duration 0402 0603 ≥ 0805 5 N (0.51 kg) 10 N (1.02 kg) 18 N (1.83 kg) 60 seconds Appendix 1, Note: Appendix 2, Note: 3.0 mm (minimum).
PAGE 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Construction Detailed Cross Section Barrier Layer (Ni) Termination Finish (100% Matte Sn) Dielectric Material (CaZrO3) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) Capacitor Marking (Optional): Laser marking option is no
PAGE 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
PAGE 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 (10 pitches cumulative tolerance on tape ±0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0.
PAGE 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.
PAGE 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel.
PAGE 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.
PAGE 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round
PAGE 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Oﬃces For a complete list of our global sales oﬃces, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change.