a module solution provider Part Number: WG7837-V1 WLAN/BT Module TI WiLink8 IEEE 802.11a/b/g/n MIMO Bluetooth / Bluetooth LE Solution Datasheet Revision 2.0 -------------------------------------------------------------------------------------------------------------------------------------------------Copyright © JORJIN TECHNOLOGIES INC. 2021 http://WWW.JORJIN.COM.
Part number:WG7837-V1 Model name :WG7837-V0 Index 1. HISTORY CHANGE ............................................................................................................................ 3 2. OVERVIEW ....................................................................................................................................... 4 MODELS FUNCTIONAL BLOCKS .......................................................................................................... 4 GENERAL FEATURES ...............
Part number:WG7837-V1 Model name :WG7837-V0 LAYOUT PATTERN AND STENCIL RECOMMENDATIONS ............................................................................ 39 10. PACKAGE INFORMATION ............................................................................................................. 40 MODULE MECHANICAL OUTLINE ................................................................................................... 40 MODULE MARKING ................................................................
Part number:WG7837-V1 Model name :WG7837-V0 1. HISTORY CHANGE Revision Date Description Rev. 1.0 2021-04-07 Initial Released Rev. 2.0 2021-06-23 Updated Module marking ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 3 http://www.jorjin.com.
Part number:WG7837-V1 Model name :WG7837-V0 2. OVERVIEW The WG7837-V1 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power saving technologies from TI. Models Functional Blocks Module P/N WLAN 2.4GHz SISO WLAN 2.4GHz MIMO (1) WLAN 2.
Part number:WG7837-V1 Model name :WG7837-V0 3. FUNCTIONAL FEATURES Module Block Diagram Figure 3-1. WG7837-V1 Block Diagram NOTE: 1. Dashed lines indicate optional configurations and are not applied by default. 2. The Part Number WG7837-V1 only support WLAN 2.4G/5G and Bluetooth / Bluetooth LE. 3. The Part Number WG7837-V1 can use GPIO control external ZigBee module. ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC.
Part number:WG7837-V1 Model name :WG7837-V0 Block Functional Feature WLAN Features WLAN Baseband Processor and RF transceiver supporting IEEE 802.11a/b/g/n. 20 and 40MHz SISO and 20MHz 2x2 MIMO at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP) 2.4-GHz MRC Support for Extended Range and 5GHz Diversity Capable Fully Calibrated: Production Calibration Not Required 4-Bit SDIO Host Interface Support Wi-Fi Direct Concurrent Operation.
Part number:WG7837-V1 Model name :WG7837-V0 4. MODULE OUTLINE Signal Layout (Bottom View) Figure 4-1. Module pins ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 7 http://www.jorjin.com.
Part number:WG7837-V1 Model name :WG7837-V0 Pin Description Table 4-1. Pin Description Pin No. Signal Name Type Shut Down State After Power Up(1) GND Voltage Level - Description 1 GND 2 GPIO11 IO PD PD 1.8V Reserved for future use. NC if not used. 3 GPIO9 IO PD PD 1.8V Reserved for future use. NC if not used. 4 GPIO10 IO PU PU 1.8V Reserved for future use. NC if not used. 5 GPIO12 IO PU PU 1.8V Reserved for future use. NC if not used. 6 WL_SDIO_CMD IO HiZ HiZ 1.
Part number:WG7837-V1 Model name :WG7837-V0 20 GND GND - 21 RESERVED1 I PD PD 1.8V Reserved for future use. NC if not used. 22 RESERVED2 I PD PD 1.8V Reserved for future use. NC if not used. 23 GND GND - Ground 24 GND GND - Ground 25 GPIO4 IO PD PD 1.8V 26 GPIO2 IO PD PD 1.8V 27 GPIO1 IO PD PD 1.
Part number:WG7837-V1 Model name :WG7837-V0 52 BT_HCI_TX O PU PU 1.8V UART TX to host. NC if not used. 53 BT_HCI_RX I PU PU 1.8V UART RX to host. NC if not used. 54 GND GND - Ground 55 GND GND - Ground 56 BT_AUD_IN I PD PD 1.8V 57 BT_AUD_OUT O PD PD 1.8V 58 BT_AUD_FSYNC IO PD PD 1.8V 59 GND 60 BT_AUD_CLK 61 GND 62 RESERVED3 63 GND GND - 64 RESERVED GND - GND GND - G1~G36 GND IO PD PD 1.8V GND O PD PD 1.8V Bluetooth PCM/I2S bus. Data in.
Part number:WG7837-V1 Model name :WG7837-V0 5. MODULE SPECIFICATION General Module Requirements and Operation Absolute Maximum Ratings (1) Parameter Value Units VBAT 4.8 (2) V VIO -0.5 to 2.1 V Input voltage to Analog pins -0.5 to 2.1 V Input voltage limits (CLK_IN) -0.5 to VIO V Input voltage to all other pins -0.5 to (VIO + 0.
Part number:WG7837-V1 Model name :WG7837-V0 Recommended Operating Conditions Parameter VBAT (1) Condition SYM DC supply range for all modes VIO 1.8 V IO ring power supply voltage MIN TYP MAX 2.9 3.7 4.8 1.62 1.8 1.95 IO high-level input voltage VIH 0.65 x VIO VIO IO low-level input voltage VIL 0 0.35 x VIO VIH_EN 1.365 VIO VIL_EN 0 0.4 Enable inputs high-level input voltage Enable inputs low-level input voltage High-level output voltage @ 4 mA VOH VIO -0.
Part number:WG7837-V1 Model name :WG7837-V0 External Slow Clock Input (SLOW_CLK) The supported digital slow clock is 32.768 kHz digital (square wave). Parameter Condition SYM MIN. Input slow clock Frequency Input slow clock accuracy (Initial + temp + aging) WLAN, BT Tr,Tf 90%) Frequency input duty Cycle Input Impedance Input Capacitance MAX. 32.768 Input Transition time Tr,Tf (10% to Input Voltage Limits TYP 15 50 Units KHz ±250 ppm 200 ns 85 % Square Wave, VIH 0.
Part number:WG7837-V1 Model name :WG7837-V0 WLAN RF Performance WLAN 2.4-GHz Receiver Parameter Condition MIN TYP MAX Units 2484 MHz RF_ANT1 pin 2.4GHz SISO Operation frequency range 2412 Sensitivity 1 Mbps DSSS -95.0 - 20MHz Bandwidth 2 Mbps DSSS -92.0 - At < 10% PER limit 5.5 Mbps CCK -89.2 11 Mbps CCK -86.3 6 Mbps OFDM -91.0 9 Mbps OFDM -89.0 12 Mbps OFDM -88.0 18 Mbps OFDM -85.5 24 Mbps OFDM -82.5 36 Mbps OFDM -79.0 48 Mbps OFDM -74.0 54 Mbps OFDM -72.
Part number:WG7837-V1 Model name :WG7837-V0 Sensitivity level +3 dB for OFDM; Sensitivity level +6 dB for 11b 11Mbps CCK 38.0 dB 54Mbps OFDM 2.0 dB WLAN 2.4-GHz Transmitter Parameter Condition MIN TYP MAX Units RF_ANT1 Pin 2.4GHz SISO Output Power. 1 Mbps DSSS 17.3 - Maximum RMS output power 2 Mbps DSSS 17.3 measured at 1 dB from IEEE 5.5 Mbps CCK 17.3 11 Mbps CCK 17.3 6 Mbps OFDM 17.1 9 Mbps OFDM 17.1 12 Mbps OFDM 17.1 18 Mbps OFDM 17.1 24 Mbps OFDM 16.2 36 Mbps OFDM 15.
Part number:WG7837-V1 Model name :WG7837-V0 Operation frequency range 2412 2484 MHz Return loss -10.0 dB Reference input impedance 50.0 Ω (1) Regulatory constraints limit the module output power to the following: Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm.
Part number:WG7837-V1 Model name :WG7837-V0 WLAN 5-GHz Receiver Parameter Condition MIN TYP MAX Units 5825 MHz RF_ANT1 or RF_ANT2 Operation frequency range 4910 Sensitivity 6 Mbps OFDM -92.5 - 20MHz Bandwidth 9 Mbps OFDM -90.5 - At < 10% PER limit 12 Mbps OFDM -90.0 18 Mbps OFDM -87.5 24 Mbps OFDM -84.5 36 Mbps OFDM -81.0 48 Mbps OFDM -76.5 54 Mbps OFDM -74.6 MCS0 MM 4K -91.4 MCS1 MM 4K -88.0 MCS2 MM 4K -86.0 MCS3 MM 4K -83.0 MCS4 MM 4K -79.8 MCS5 MM 4K -75.
Part number:WG7837-V1 Model name :WG7837-V0 WLAN 5-GHz Transmitter Parameter Condition (1) MIN TYP MAX Units 5825 MHz RF_ANT1 or RF_ANT2 Operation frequency range 4910 RMS output power complies with 6 Mbps OFDM 18.0 IEEE mask and EVM 9 Mbps OFDM 18.0 requirements. (2) 12 Mbps OFDM 18.0 18 Mbps OFDM 18.0 24 Mbps OFDM 17.4 36 Mbps OFDM 16.5 48 Mbps OFDM 15.8 54 Mbps OFDM 14.5 MCS0 MM 18.0 MCS1 MM 4K 18.0 MCS2 MM 4K 18.0 MCS3 MM 4K 18.0 MCS4 MM 4K 16.5 MCS5 MM 4K 15.
Part number:WG7837-V1 Model name :WG7837-V0 Bluetooth RF Performance Bluetooth BR, EDR Receiver Characteristics—In-Band Signals Parameter Condition MIN BT BR, EDR operation frequency range TYP 2402 MAX Units 2480 MHz BT BR, EDR channel spacing 1 MHz BT BR, EDR input impedance 50 Ω BT BR, EDR sensitivity (1) Dirty TX on BR, BER = 0.1% -92.2 EDR2, BER = 0.01% -91.7 EDR3, BER = 0.01% -84.
Part number:WG7837-V1 Model name :WG7837-V0 Bluetooth Transmitter, BR Parameter BR RF output power MIN (1) TYP VBAT ≥ 3V 11.7 VBAT < 3V 7.2 BR Gain Control Range 30.0 BR Power Control Step 5.0 BR Adjacent Channel Power |M-N| = 2 -43.0 BR Adjacent Channel Power |M-N| > 2 -48.0 MAX Units dBm dB dBm (1) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command. Bluetooth Transmitter, EDR Parameter MIN EDR output power (1) TYP VBAT ≥ 3V 7.
Part number:WG7837-V1 Model name :WG7837-V0 BR drift rate lfk+5 – fkl , k = 0 …. max BR initial carrier frequency tolerance (2) f0 – fTX -75 15 kHz/ 50μs 75 kHz (1) Performance figures at maximum power (2) This number is added on top of the reference clock frequency accuracy Bluetooth Modulation, EDR Parameter (1) Condition MIN MAX Units -5 5 kHz -75 75 kHz EDR Carrier frequency stability EDR initial carrier frequency tolerance EDR RMS DEVM EDR 99% DEVM EDR Peak DEVM (2) TYP.
Part number:WG7837-V1 Model name :WG7837-V0 Bluetooth LE RF Performance Bluetooth LE Receiver Characteristics—In-Band Signals Condition (1) Parameter MIN BT LE Operation frequency range TYP 2402 MAX Units 2480 MHz BT LE Channel spacing 2 MHz BT LE Input impedance 50 Ω -92.2 dBm BT LE Sensitivity (2), Dirty Tx on BT LE Maximum useable input power -5 BT LE Intermodulation characteristics Level of interferers.
Part number:WG7837-V1 Model name :WG7837-V0 Bluetooth LE Modulation Condition (1) Parameter ∆f1avg BT LE modulation characteristics BT LE carrier frequency drift BT LE drift rate LE initial carrier frequency tolerance (2) ∆f2max ≥ limit for at least Mod data = 4-ones, 4zeros: 111100001111... MIN TYP MAX 240 250 260 215 ∆f2avg / ∆f1avg 85 90 lf0 – fnl , n = 2,3 …. K -25 lf1 – f0l and lfn – fn-5l ,n = 6,7…. K fn – fTX Units kHz 195 99.9% of all Δf2max Mod data = 1010101...
Part number:WG7837-V1 Model name :WG7837-V0 POWER CONSUMPTION Shutdown and Sleep Currents Parameter Power Supply TYP Shutdown mode VBAT 10 All functions shut down. VIO 2 WLAN sleep mode VBAT 160 BT sleep mode VBAT 110 Unit uA WLAN Power Currents Parameter Conditions TYP (AVG) at 25°C Low-power mode (LPM) 2.4GHz RX SISO20 single chain 49 2.4GHz RX search SISO20 58 2.4GHz RX search MIMO20 74 2.4GHz RX search SISO40 63 2.4GHz RX 20M SISO 11CCK 60 2.4GHz RX 20M SISO 6OFDM 61 2.
Part number:WG7837-V1 Model name :WG7837-V0 Bluetooth Currents Current measurements are done at the following output power: BR at 11.7dBm EDR at 7.2dBm. Use Case (1) (2) (1) (2) (3) (4) TYP BR Voice HV3 + sniff 11.6 EDR voice 2-EV3 no retransmission + sniff 5.9 Sniff 1 attempt 1.28s 178.0 EDR A2DP EDR2 (master). SBC high quality – 345Kbs 10.4 EDR A2DP EDR2 (master). MP3 high quality – 192Kbs 7.5 Full throughput ACL RX: RX-2DH5 (3) 4) 18.0 Full throughput BR ACL TX: TX-DH5 (4) 50.
Part number:WG7837-V1 Model name :WG7837-V0 6. HOST INTERFACE TIMING CHARACTERISTICS The following table summarizes the Host Controller interface options. All interfaces operate independently. WLAN Shared HCI for all functional blocks except WLAN BT Voice/Audio WLAN HS SDIO Over UART BT PCM The device incorporates UART module dedicated to the BT shared-transport Host Controller Interface (HCI) transport layer.
Part number:WG7837-V1 Model name :WG7837-V0 SDIO Timing Specifications SDIO Switching Characteristics – Default Rate Figure 6-1. SDIO default input timing Figure 6-2. SDIO default output timing ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 27 http://www.jorjin.com.
Part number:WG7837-V1 Model name :WG7837-V0 Table 6-1. SDIO Default Timing Characteristics (1) PARAMETER(2) MIN MAX UNIT fclock Clock frequency, CLK 0.0 26.0 MHz DC Low/high duty cycle 40.0 60.0 % tTLH Rise time, CLK 10.0 ns tTHL Fall time, CLK 10.0 ns tISU Setup time, input valid before CLK↑ 3.0 ns tIH Hold me, input valid a er CLK↑ 2.0 ns tODLY Delay me, CLK↓ to output valid 7.0 CI Capacitive load on outputs 10.0 ns 15.
Part number:WG7837-V1 Model name :WG7837-V0 Figure 6-4. SDIO HS output timing Table 6-2. SDIO HS Timing Characteristics PARAMETER MIN MAX UNIT fclock Clock frequency, CLK 0.0 52.0 MHz DC Low/high duty cycle 40.0 60.0 % tTLH Rise time, CLK 3.0 ns tTHL Fall time, CLK 3.0 ns tISU Setup me, input valid before CLK↑ 3.0 ns tIH Hold me, input valid a er CLK↑ 2.0 ns tODLY Delay me, CLK↓ to output valid 7.0 CI Capacitive load on outputs 10.0 ns 10.
Part number:WG7837-V1 Model name :WG7837-V0 HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN) The HCI UART supports most baud rates (including all PC rates) for all fast clock frequencies up to a maximum of 4 Mbps. After power up the baud rate is set for 115.2 kbps, regardless of fast clock frequency. The baud rate can then be changed by using a VS command. The Device responds with a Command Complete Event (still at 115.2 kbps), after which the baud rate change occurs.
Part number:WG7837-V1 Model name :WG7837-V0 UART Timing Specifications Figure 6-6. UART Timing Diagram Table 6-4. UART Timing Characteristics Characteristic Condition Symbol Baud rate MIN TYP MAX Unit 37.5 4364 Kbps Baud rate accuracy per byte Receive-transmit -2.5 +1.5 % Baud rate accuracy per bit Receive-transmit -12.5 +12.5 % CTS low to TX_DATA on CTS low to TX_DATA off t3 Hardware flow control 0.0 t4 t6 1.0 RTS low to RX_DATA on t1 0.0 Interrupt set to 1/4 FIFO t2 us 1.
Part number:WG7837-V1 Model name :WG7837-V0 Bluetooth Codec-PCM(Audio) Timing Specifications Figure 6-8 shows the Bluetooth codec-PCM (audio) timing diagram. Table 6-5 lists the Bluetooth codec-PCM master timing characteristics. Table 6-6 lists the Bluetooth codec-PCM slave timing characteristics. Figure 6-8. Bluetooth Codec-PCM (Audio) Master Timing Diagram Table 5-5. Bluetooth Codec-PCM Master Timing Characteristics Parameter Symbol MIN MAX Cycle time Tclk 166.67 (6.
Part number:WG7837-V1 Model name :WG7837-V0 7. CLOCK AND POWER MANAGEMENT The slow clock is a free-running, 32.768 kHz clock supplied from an external clock source. The clock is connected to the SLOW_CLK pin and is a digital square-wave signal in the range of 0 to 1.8V nominal Reset-Power-Up System After VBAT and VIO are fed to the device and while BT_EN and WL_EN are deasserted (low), the device is in SHUTDOWN state, during which functional blocks, internal DC-DCs, and LDOs are disabled.
Part number:WG7837-V1 Model name :WG7837-V0 Bluetooth/BLE Power-Up Sequence Figure 7-2 shows the Bluetooth/BLE power-up sequence. Figure 7-2 Bluetooth/Bluetooth LE Power-Up sequence ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 34 http://www.jorjin.com.
Part number:WG7837-V1 Model name :WG7837-V0 8. REFERENCE SCHEMATICS BT_EN WLAN_EN WLAN/BT Enable Control. Connect to Host GPIO.
Part number:WG7837-V1 Model name :WG7837-V0 9. DESIGN RECOMMENDATIONS Module Layout Recommendations Follow these module layout recommendations: Supply and Interface The power trace for VBAT must be at least 40-mil wide. The 1.8-V trace must be at least 18-mil wide. Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. If possible, shield VBAT traces with ground above, below, and beside the traces.
Part number:WG7837-V1 Model name :WG7837-V0 Have a complete ground pour in layer 2 for thermal dissipation. (See Figure 9-2) Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. (See Figure 9-2) Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible. Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer.
Part number:WG7837-V1 Model name :WG7837-V0 Figure 9-2 Module Layout : Layer-2 (Solid GND) Figure 9-3 Block of Ground Pads on Bottom Side of Package ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 38 http://www.jorjin.com.
Part number:WG7837-V1 Model name :WG7837-V0 Layout Pattern and stencil Recommendations Figure 9-4. Recommended PCB Pattern Figure 9-5. Recommended Stencil Outline ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 39 http://www.jorjin.com.
Part number:WG7837-V1 Model name :WG7837-V0 10. PACKAGE INFORMATION Module Mechanical Outline Figure 10-1. Module mechanical outline MARKING MIN (mm) NOM (mm) MAX (mm) MARKING MIN (mm) NOM (mm) MAX (mm) L (body size) 13.20 13.30 13.40 c2 0.65 0.75 0.85 W (body size) 13.30 13.40 13.50 c3 1.15 1.25 1.35 T (thickness) 1.90 2.00 d1 0.90 1.00 1.10 a1 0.30 0.40 0.50 d2 0.90 1.00 1.10 a2 0.60 0.70 0.80 e1 1.30 1.40 1.50 a3 0.65 0.75 0.85 e2 1.30 1.40 1.
Part number:WG7837-V1 Model name :WG7837-V0 Module Marking Module P/N : WG7837-V1 Model : WG7837V0 FCC ID : WS2-WG78DBV0, single modular FCC grant ID LTC : YYWWSSF YY = year (for example, 21 = 2021) WW = Week SS = Serial number matching manufacturer lot number F = Reserve for internal use ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 41 http://www.jorjin.com.
Part number:WG7837-V1 Model name :WG7837-V0 Tape / Reel / Shipping Box Specification Figure 10-2. Tape Specification Table 10-2. Dimensions for Tape Specification Figure 10-3. Reel Specification Table 10-3. Dimensions for Reel Specification The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is packed into a reel box. ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 42 http://www.
Part number:WG7837-V1 Model name :WG7837-V0 Figure 10-4. Reel Box Figure 10-5. Shipping Box ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2021 43 http://www.jorjin.com.
Part number:WG7837-V1 Model name :WG7837-V0 11. SMT AND BAKING RECOMMENDATION Baking Recommendation Baking condition： Follow MSL Level 4 to do baking process. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. Devices require bake, before mounting, if Humidity Indicator Card reads >10% If baking is required, Devices may be baked for 8 hrs at 125 °C.
Part number:WG7837-V1 Model name :WG7837-V0 12. REGULATORY INFORMATION United State FCC WARING STATEMENT This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
Part number:WG7837-V1 Model name :WG7837-V0 Notice to OEM integrator The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 1.
Part number:WG7837-V1 Model name :WG7837-V0 However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by tuning the equipment off and on, the user is encouraged to try and correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna -Increase the distance between the equipment and the receiver.
