a module solution provider WG7833-B0 Wireless Module TI WiLink8 IEEE 802.11a/b/g/n BT/BLE Solution Datasheet Revision 0.6 Prepared By Reviewed By Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 Index 1. OVERVIEW ..................................................................................................................................3 1.1. 1.2. 2. FUNCTIONAL FEATURES .............................................................................................................4 2.1. 2.2. 3. GENERAL MODULE REQUIREMENTS AND OPERATION ....................................................................12 WLAN RF PERFORMANCE ........................................
Doc No: WG7833-B0-DTS-R06 9. PACKAGE INFORMATION ..........................................................................................................40 9.1. 9.2. 9.3. 9.4. 9.5. 10. MODULE MECHANICAL OUTLINE...............................................................................................40 ORDERING INFORMATION ........................................................................................................41 PACKAGE MARKING .......................................................
Doc No: WG7833-B0-DTS-R06 1. OVERVIEW WG7833-B0, a WiFi, BT, BLE SiP (system in package) module, is the most demanded design for mobile devices, Audio, Computer, PDA and embedded system applications with Wilink8 solution from TI. 1.1. 1.2. Models Functional Blocks Model WLAN 2.4GHz WLAN 5GHz BT/BLE WG7833-B0 V V V General Features WLAN, Bluetooth, BLE with Integrated RF Front-End Module (FEM), Power Amplifier (PA), and Power Management on a Single Module. LGA106 pin package.
Doc No: WG7833-B0-DTS-R06 2. FUNCTIONAL FEATURES 2.1. Module Block Diagram WiLink8 VBAT_IN Power Management VIO_IN 32.768KHz WL 5G TX SLOW CLK WL 5G RX OSC CLK_REQ_OUT WLAN I/F: SDIO BPF SW BPF WLAN 26MHz TCXO SW WLAN 2.4G FAST CLK BT BT BT I/F: UART, PCM, I2S GPIO’s, Debug WG7833-B0 Figure 2-1. WG7833-B0 Block Diagram Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 2.2. Block Functional Feature 2.2.1. WLAN Features Integrated 2.4 & 5G GHz Power Amplifier (PA) for WLAN solution WLAN Baseband Processor and RF transceiver Supporting IEEE Std 802.11a/b/g/n WLAN 2.4/5 GHz SISO (20/40 MHz channels) Baseband Processor IEEE Std 802.11a/b/g/n data rates and IEEE Std 802.11n data rates with 20 or 40 MHz SISO. Fully calibrated system. Production calibration not required.
Doc No: WG7833-B0-DTS-R06 2.2.2. Bluetooth and BLE Features Supports Bluetooth Core Specification Version 4.2.
Doc No: WG7833-B0-DTS-R06 3. MODULE OUTLINE 3.1. Signal Layout (Top View) Figure 3-1 Device pins Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 3.2. Pin Description Table 3-1. Pin Description Pin No. A1 Signal Name GND Shut After Voltage Type Down Power Level state Up(1) GND Description Ground WLAN SDIO Data bit 3. Changes state to A2 WLAN_SDIO_D3 IO HiZ PU 1.8V PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization. (2) A3 WLAN_SDIO_CMD I/O HiZ HiZ 1.8V WLAN SDIO Command (2) A4 WLAN_SDIO_D2 IO HiZ HiZ 1.
Doc No: WG7833-B0-DTS-R06 B7 NC NC B8 NC NC B9 NC NC B10 NC NC B11 NC NC B12 NC NC B13 NC NC B14 NC NC B15 NC NC B16 NC NC C1 GND C2 NC NC C3 NC NC C4 BT_UART_DEBUG C5 NC C6 WLAN_UART_DBG OUT PU PU 1.8V C7 GPIO1 I/O PD PD 1.8V C8 NC C9 TCXO_CLK_IN C10 WLAN_EN GND OUT Ground PU PU 1.8V Option: Bluetooth logger NC Option: WLAN logger WL_RS232_TX (when IRQ_WL = 1 at power up) NC ANA IN TCXO clock input PD PD 1.
Doc No: WG7833-B0-DTS-R06 D9 PA_DC2DC_OUT POW Internal DC2DC output D10 GPIO4 I/O PD PD 1.8V D11 GPIO2 I/O PD PD 1.8V D12 BT_EN In PD PD 1.
Doc No: WG7833-B0-DTS-R06 K4 GND GND Ground K5 GND GND Ground K6 GND GND Ground K7 BT_AUD_OUT OUT K8 GND GND Ground K9 EXT_32K ANA Input Sleep clock: 32.768 KHz K10 GND GND Ground K11 BT_AUD_IN IN PD PD 1.8V K12 BT_AUD_CLK OUT PD PD 1.8V K13 BT_AUD_FSYNC OUT PD PD 1.8V PD PD 1.8V Bluetooth PCM/I2S Bus. Data out. NC if not used. Bluetooth PCM/I2S Bus. Data in. NC if not used. Bluetooth PCM/I2S Bus. Clock. NC if not used. Bluetooth PCM/I2S Bus. Frame sync.
Doc No: WG7833-B0-DTS-R06 4. MODULE SPECIFICATION 4.1. General Module Requirements and Operation 4.1.1. Absolute Maximum Ratings (1) Parameter Value Units VBAT 4.8 (2) V VIO -0.5 to 2.1 V Input voltage to Analog pins -0.5 to 2.1 V Input voltage limits (CLK_IN) -0.5 to VIO V Input voltage to all other pins -0.5 to (VIO + 0.
Doc No: WG7833-B0-DTS-R06 4.1.2. Recommended Operating Conditions Parameter Condition Sym DC supply range VBAT (1) for all modes 1.8 V IO ring power supply voltage Min Max 2.9 4.8 1.62 1.95 IO high-level input voltage VIH 0.65 x VIO VIO IO low-level input voltage VIL 0 0.35 x VIO VIH_EN 1.365 VIO VIL_EN 0 0.4 Enable inputs high-level input voltage Enable inputs low-level input voltage High-level output voltage @ 4 mA VOH VIO -0.
Doc No: WG7833-B0-DTS-R06 4.1.3. External Slow Clock Input (SLOW_CLK) The supported digital slow clock is 32.768 kHz digital (square wave). Parameter Condition Sym Min. Input slow clock Frequency Max. Units 32.768 Input slow clock accuracy KHz WLAN, BT (Initial + temp + aging) Input Transition time Tr/Tf - Typ. Tr/Tf 10% to 90% Frequency input duty Cycle 15 Input Voltage Limits 50 +/-250 ppm 100 ns 85 % Square Wave, Vih 0.65xVIO VIO DC-coupled Vil 0 0.
Doc No: WG7833-B0-DTS-R06 4.2. WLAN RF Performance 4.2.1. WLAN 2.4-GHz Receiver Parameter Condition Operation frequency range Sensitivity - 20MHz Bandwidth - At < 10% PER limit Min Typ 2412 Max Units 2484 MHz 1 Mbps DSSS -96.3 -93.4 2 Mbps DSSS -93.2 -90.5 5.5 Mbps CCK -90.6 -87.9 11 Mbps CCK -87.9 -85.7 6 Mbps OFDM -92.0 -89.2 9 Mbps OFDM -90.4 -87.7 12 Mbps OFDM -89.5 -86.8 18 Mbps OFDM -87.2 -84.5 24 Mbps OFDM -84.1 -81.4 36 Mbps OFDM -80.
Doc No: WG7833-B0-DTS-R06 4.2.2. WLAN 2.4-GHz Transmitter Parameter Condition Operation frequency range Min Typ 2412 1 Mbps DSSS 15 17 2 Mbps DSSS 15 17 5.5 Mbps CCK 15 17 11 Mbps CCK 15 17 6 Mbps OFDM 15 17 9 Mbps OFDM 15 17 12 Mbps OFDM 15 17 18 Mbps OFDM 15 17 24 MbpS OFDM 14 16.2 Output Power 36 Mbps OFDM 13.1 15.3 - Maximum RMS output power 48 Mbps OFDM 12.4 14.6 measured at 1dB from IEEE 54 Mbps OFDM 11.8 13.8 spectral mask or EVM MCS0 MM 13.9 16.
Doc No: WG7833-B0-DTS-R06 4.2.3. WLAN 5-GHz Receiver Parameter Condition Operation frequency range Sensitivity - 20MHz bandwidth. - At < 10% PER limit Max Input Level, At < 10% PER limit Adjacent channel rejection Sensitivity level +3dB for OFDM Min Typ 4910 Max Units 5825 MHz 6 Mbps OFDM – -91.5 -87.6 9 Mbps OFDM – -89.7 -85.7 12 Mbps OFDM – -88.9 -84.9 18 Mbps OFDM – -86.4 -82.4 24 Mbps OFDM – -83.3 -79.3 36 Mbps OFDM – -79.9 -75.9 48 Mbps OFDM – -75.6 -71.
Doc No: WG7833-B0-DTS-R06 4.2.4. WLAN 5-GHz Transmitter Parameter Condition Operation frequency range Min Typ 4910 Max Units 5825 MHz 6 Mbps OFDM 14.7 16.8 – 9 Mbps OFDM 14.7 16.8 – 12 Mbps OFDM 14.7 16.8 – 18 Mbps OFDM 14.7 16.8 – 24 MbpS OFDM 14.1 15.7 – 36 Mbps OFDM 13.4 15.0 – 48 Mbps OFDM 12.6 14.2 – Output Power 54 Mbps OFDM 11.6 13.4 – - Maximum RMS output power MCS0 MM 14.4 16.4 measured at 1dB from IEEE MCS1 MM 14.4 16.
Doc No: WG7833-B0-DTS-R06 4.3. Bluetooth RF Performance 4.3.1. BT Receiver Characteristics, In-Band Signals Parameter Condition Min BT BR, EDR operation frequency range Typ 2402 Max Units 2480 MHz BT BR, EDR channel spacing 1 MHz BT BR, EDR input impedance 50 Ω BT BR, EDR sensitivity (1) Dirty TX on BR, BER = 0.1% -92.2 -88.7 EDR2, BER = 0.01% -91.7 -87.7 EDR3, BER = 0.01% -84.7 -80.
Doc No: WG7833-B0-DTS-R06 4.3.2. BT Transmitter, BR Parameter BR RF output power Min (1) Typ VBAT >= 3V 11.7 VBAT < 3V 7.2 BR Gain Control Range 30 BR Power Control Step 5 BR Adjacent Channel Power |M-N| = 2 -43.0 BR Adjacent Channel Power |M-N| > 2 -48.0 Max Units dBm dB dBm (1) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command. 4.3.3. BT Transmitter, EDR Parameter Min EDR output power (1) Typ VBAT >= 3V 7.2 VBAT < 3V 5.
Doc No: WG7833-B0-DTS-R06 BR initial carrier frequency tolerance (2) f0 – fTX -75 75 kHz (1) Performance figures at maximum power (2) This number is added on top of the reference clock frequency accuracy 4.3.5. BT Modulation, EDR Parameter (1) Condition Min Typ.
Doc No: WG7833-B0-DTS-R06 4.4. BT LE RF Performance 4.4.1. BT LE Receiver Characteristics, In-Band Signals Condition (2) Parameter Min BT LE Operation frequency range Typ 2402 Max Units 2480 MHz BT LE Channel spacing 2 MHz BT LE Input impedance 50 Ω -92.2 dBm BT LE Sensitivity (1), Dirty Tx on BT LE Maximum useable input power -5 BT LE Intermodulation characteristics Level of interferers.
Doc No: WG7833-B0-DTS-R06 4.4.3. BT LE Modulation Characteristics Condition (1) Parameter ∆f1avg BT LE modulation characteristics ∆f2max ≥ limit for at least 99.9% of all Δf2max Performances Min Mod data = 4-ones, 4-zeros: 111100001111... Mod data = 1010101... ∆f2avg / ∆f1avg BT LE carrier frequency drift BT LE drift rate LE initial carrier frequency tolerance (2) lf0 – fnl , n = 2,3 …. K -25 lf1 – f0l and lfn – fn-5l ,n = 6,7….
Doc No: WG7833-B0-DTS-R06 4.5. POWER CONSUMPTION All measurements are performed with Vbat = 3.7V, VIO = 1.8V, Temperature at 25°C. 4.5.1. Shutdown and Sleep Currents Parameter Power Supply Current Typ Max. Unit Shutdown mode VBAT 10 15 All functions shut down. VIO 2 3 WLAN sleep mode VBAT 160 340 BT sleep mode VBAT 110 285 Power Supply Current Typ Max. Unit uA 4.5.2.
Doc No: WG7833-B0-DTS-R06 2.4GHz TX 20M SISO 54OFDM 13.8dBm 247 328 mA 2.4GHz TX 20M SISO MCS7 12.6dBm 238 321 mA 2.4GHz TX 40M SISO MCS7 12.2dBm 243 329 mA 5GHz TX 20M SISO 6OFDM 16.8dBm 365 452 mA 5GHz TX 20M SISO 54OFDM 13.4dBm 326 388 mA 5GHz TX 20M SISO MCS7 12.4dBm 324 385 mA 5GHz TX 40M SISO MCS7 11.6dBm 330 390 mA 4.5.4. Bluetooth Currents Current measurements are done at the following output power: BR at 11.7dBm, EDR at 7.2dBm.
Doc No: WG7833-B0-DTS-R06 4.5.5. Bluetooth LE Currents All current measurements are done at output power of 7dBm Use Case Typ Units Advertising, non-connectable (1) 131 uA Advertising, discoverable (1) 143 uA Scanning (2) 266 uA Connected, master role, 1.28sec connect interval 3) 124 uA Connected, slave role, 1.28sec connect interval (3) 132 uA (1) Advertising in all 3 channels, 1.28sec advertising interval, 15 Bytes advertise data. (2) Listening to a single frequency per window, 1.
Doc No: WG7833-B0-DTS-R06 5. HOST INTERFACE TIMING CHARACTERISTICS The following table summarizes the Host Controller interface options. All interfaces operate independently. WLAN Shared HCI for all functional blocks except WLAN BT Voice/Audio WLAN HS SDIO Over UART BT PCM The device incorporates UART module dedicated to the BT shared-transport Host Controller Interface (HCI) transport layer.
Doc No: WG7833-B0-DTS-R06 5.2. SDIO Timing Specifications 5.2.1. SDIO Switching Characteristics – Default Rate Figure 5-1. SDIO default input timing Figure 5-2. SDIO default output timing Table 5-1. SDIO Default Timing Characteristics(1) PARAMETER(2) MIN MAX UNIT Fclock Clock frequency, CLK 0 26 MHz DC Low/high duty cycle 40 60 % tTLH Rise time, CLK 10 ns tTHL Fall time, CLK 10 ns tISU Setup time, input valid before CLK↑ 3 Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.
Doc No: WG7833-B0-DTS-R06 tIH Hold time, input valid after CLK↑ 2 tODLY Delay time, CLK↓ to output valid 2.5 CI Capacitive load on outputs ns 14.8 ns 15 pF (1) To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit. (2) Parameter values reflect maximum clock frequency. 5.2.2. SDIO Switching Characteristics – High Rate Figure 5-3. SDIO HS input timing Figure 5-4. SDIO HS output timing Copyright © JORJIN TECHNOLOGIES INC.
Doc No: WG7833-B0-DTS-R06 Table 5-2. SDIO HS Timing Characteristics PARAMETER MIN MAX UNIT Fclock Clock frequency, CLK 0 50 MHz DC Low/high duty cycle 40 60 % tTLH Rise time, CLK 3 ns tTHL Fall time, CLK 3 ns tISU Setup time, input valid before CLK↑ 3 ns tIH Hold time, input valid after CLK↑ 2 ns tODLY Delay time, CLK↓ to output valid 2.5 CI Capacitive load on outputs Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 5.3. HCI UART Shared Transport Layers for All Functional Blocks The HCI UART supports most baud rates (including all PC rates) for all fast clock frequencies up to a maximum of 4 Mbps. After power up the baud rate is set for 115.2 kbps, regardless of fast clock frequency. The baud rate can then be changed by using a VS command. The Device responds with a Command Complete Event (still at 115.2 kbps), after which the baud rate change occurs.
Doc No: WG7833-B0-DTS-R06 5.4. UART Timing Specifications Figure 5-6. UART Timing Diagram Table 5-4. UART Timing Characteristics Characteristic Condition Symbol Baud rate Min Typ Max Unit 37.5 4364 Kbps Baud rate accuracy per byte RX/TX -2.5 +1.5 % Baud rate accuracy per bit RX/TX -12.5 +12.
Doc No: WG7833-B0-DTS-R06 5.5. Bluetooth Codec-PCM(Audio) Timing Specifications Figure 5-8 shows the Bluetooth codec-PCM (audio) timing diagram. Table 5-5 lists the Bluetooth codec-PCM master timing characteristics. Table 5-6 lists the Bluetooth codec-PCM slave timing characteristics. Figure 5-8. PCM Interface Timing Table 5-5. Bluetooth Codec-PCM Master Timing Characteristics Parameter Symbol Min Max Cycle time Tclk 166.67 (6.
Doc No: WG7833-B0-DTS-R06 6. CLOCK AND POWER MANAGEMENT The slow clock is a free-running, 32.768 kHz clock supplied from an external clock source. The clock is connected to the RTC_CLK pin and is a digital square-wave signal in the range of 0 to 1.8V nominal 6.1. Reset-Power-Up System After VBAT and VIO are fed to the device and while BT_EN and WL_EN are deasserted (low), the device is in SHUTDOWN state, during which functional blocks, internal DC-DCs, and LDOs are disabled.
Doc No: WG7833-B0-DTS-R06 6.3. Bluetooth/BLE Power-Up Sequence Figure 6-2 shows the Bluetooth/BLE power-up sequence. Figure 6-2 Bluetooth/BLE power-up sequence Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 7. REFERENCE SCHEMATIC VIO_IN Must reserve PU cricuit R1 for Debug. NL_10K RES1005 WLAN_IRQ_1V8 TCXO1 TCXO/2016/26MHz TCXO-2.0X1.6 1 3 GND OUT VCC GND WL_5G ANT (For WG7833/03 Only) 50 ohms single ended 2 VBAT_IN R3 1 BT_EN_1V8 0R RES1005 J1 U.FL-R-SMT-1(10) U.FL TP4 J4 J5 J6 J7 J8 J9 J10 J11 J12 J13 3 D19 D20 GND RF_ANT_A D16 D17 D18 RF_ANT_BG GND GND NL GND NL GND NL GND NL BT_AUD_OUT U1 WG7833_03_31_01-B0 D01 Module E-12X12.8-0.
Doc No: WG7833-B0-DTS-R06 8. DESIGN RECOMMENDATIONS 8.1. Design Note on Debug Port Pin# C6, C4 serve as WLAN and BT debug port, respectively. So test points for these two signals should be reserved for debugging purpose. Pin# C11 (WLAN_IRQ) needs to be pulled high via 10Kohm and use Pin# D11, C7 (WL_RS232_RX, WL_RS232_TX) as hardware interface to communicate with system platform and TI RTTT test utility for WLAN RF performance test, debug and manufacturing application. 8.2.
Doc No: WG7833-B0-DTS-R06 Power Trace Power trace for VBAT should be 20mil wide. 1.8V trace should be 15mil wide, at least. Isolate different power traces with Ground plane Ground Having a complete Ground and more GND vias under module in layer1 for system stable and thermal dissipation. Have a complete Ground pour in layer 2 for thermal dissipation. Increase the GND pour in the 1st layer, move all the traces from the 1st layer to the inner layers if possible. Move GND vias close to the pad.
Doc No: WG7833-B0-DTS-R06 8.3. RF Connections The RF connection recommendation is connect to RF U.FL connector and link to external antenna, the information of Antenna as below: 2.4GHz PCB type Antenna Figure 8-1 shows the recommended 2.4GHz PCB Antenna. Figure 8-1. 2.4GHz PCB Antenna 5GHz PCB type Antenna Figure 8-2 shows the recommended 5GHz PCB Antenna. Figure 8-2. 5GHz PCB Antenna Max. Antenna Gain (dBi) Antenna Type PCB Brand Part Number BT/WLAN 2.4GHz Unictron WLAN WLAN WLAN WLAN 5.
Doc No: WG7833-B0-DTS-R06 9. PACKAGE INFORMATION 9.1. Module Mechanical Outline 12.8±0.1 mm 1.63±0.1 mm 12.0±0.1 mm Figure 9-1. Module mechanical outline Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 Figure 9-2. Module pad dimensions *We recommend adopting the same dimensions listed above for building PCB footprint. ** Pad tolerance as +/- 30um 9.2. Ordering Information Part number: WG7833-B0 Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 9.3. Package Marking PIN-1 Marking Figure 9-3. Package Marking 9.4.
Doc No: WG7833-B0-DTS-R06 9.5. Packaging 9.5.1. Tape Specification Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 Product label Pin 1 Pull Direction Packing Direction Copyright © JORJIN TECHNOLOGIES INC. 2018 http://www.jorjin.com.
Doc No: WG7833-B0-DTS-R06 10. SMT AND BAKING RECOMMENDATION 10.1. Baking Recommendation Baking condition: - Follow MSL Level 4 to do baking process. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. Devices require bake, before mounting, if Humidity Indicator Card reads >10% If baking is required, Devices may be baked for 8 hrs. at 125 °C. - 10.2.
Doc No: WG7833-B0-DTS-R06 No. Item Temperature (°C) Time (sec) 1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 2 Soldering D2: = 220 T2: 60 +/- 10 3 Peak-Temp. D3: 250 °C max Note: (1) Reflow soldering is recommended two times maximum. (2) Add Nitrogen while Reflow process: SMT solder ability will be better. Stencil thickness: 0.1~ 0.13 mm (Recommended) Soldering paste (without Pb): Recommended SENJU N705-GRN3360-K2-V can get better soldering effects. Copyright © JORJIN TECHNOLOGIES INC.
Doc No: WG7833-B0-DTS-R06 11. Regulatory Information This section outlines the regulatory information for the following countries: United States Canada Japan Europe 11.1. United States FCC WARING STATEMENT This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
Doc No: WG7833-B0-DTS-R06 FCC RF Radiation Exposure Statement: 1. This Transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter. 2. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. According to FCC 15.407(e), the device is intended to operate in the frequency band of 5.15GHz to 5.
Doc No: WG7833-B0-DTS-R06 11.2. Canada Industry Canada statement: This device complies with ISED’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence.
Doc No: WG7833-B0-DTS-R06 Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.
Doc No: WG7833-B0-DTS-R06 Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
Doc No: WG7833-B0-DTS-R06 (iii) pour les dispositifs munis d’antennes amovibles, le gain maximal d’antenne permis (pour les dispositifs utilisant la bande de 5 725 à 5 850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée, selon le cas; (detachable antenna only) (iv) lorsqu’il y a lieu, les types d’antennes (s’il y en a plusieurs), les numéros de modèle de l’antenne et les pires angles d’inclinaison nécessaires pour rester conforme à l’exigence de la p.i.r.e.
Doc No: WG7833-B0-DTS-R06 11.4. Europe Jorjin Technologies Inc. declares that the radio equipment type RF module is in compliance with Directive 2014/53/EU. The compliance has been verified in the operating frequency band of 2400 MHz to 2480 MHz、5180 MHz to 5240 MHz、5260 MHz to 5320 MHz、5500 MHz to 5700 MHz、5745 MHz to 5825 MHz. Developers and integrators that incorporate the WG7833-B0 Module in any end products are responsible for obtaining applicable regulatory approvals for such end product.
Doc No: WG7833-B0-DTS-R06 12. HISTORY CHANGE Revision Date Description R 0.1 2014/08/28 New Released R 0.2 2014/09/29 Modify the module thickness from 1.7±0.05 mm to 1.63±0.1 mm Modify the package marking. R 0.3 2016/01/06 1. Separated from WG78XX-B0 series datasheet. 2. Updated Marking of module. 3. Added FCC Waring Statement. 4. Support to Bluetooth 4.1. 5. Remove ANT function of module. R 0.4 2017/02/03 1. 2. 3. 4. R 0.5 2018/10/29 1.