a module solution provider ZB7 SimpleLinkTM Multistandard Wireless MCU Module TI CC26X0 series BLE & 802.15.4 Solution With optional 4Mbits Serial SPI Flash Memory Datasheet Draft 0.2 Prepared By Reviewed By Approved By ----------------------------------------------------------------------------------------------------------------------------- --------------------Copyright © JORJIN TECHNOLOGIES INC. 2016 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 Index 1. OVERVIEW ....................................................................................................................................... 3 1.1. GENERAL FEATURES ........................................................................................................................ 3 1.2. APPLICATIONS ................................................................................................................................ 4 2. FUNCTIONAL FEATURES ..................
DOC No: ZB7-DTS-D02 4.18. LOW-POWER CLOCKED COMPARATOR............................................................................................. 22 4.19. PROGRAMMABLE CURRENT SOURCE .............................................................................................. 22 4.20. DC CHARACTERISTICS .................................................................................................................. 23 4.21. TIMING REQUIREMENTS.............................................................
DOC No: ZB7-DTS-D02 1. OVERVIEW The certified ZB7 module from JORJIN is a wireless MCU module targeting Bluetooth Smart, ZigBee®, 6LoWPAN, and ZigBee® RF4CE remote control applications. This module is based on TI CC26X0 wireless MCU QFN-32 package chip. The module is a cost-effective, ultralow power, 2.4-GHz RF devices.
DOC No: ZB7-DTS-D02 2.4-GHz RF Transceiver Compatible With Bluetooth Low Energy (BLE) 4.2 Specification and IEEE 802.15.4 PHY and MAC - Excellent Receiver Sensitivity (–96 dBm for BLE and –99 dBm for 802.15.
DOC No: ZB7-DTS-D02 2. FUNCTIONAL FEATURES 2.1. Module Block Diagram VDD GPIOs 4M bits SPI Flash Memory (Optional) ZB7 module ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 5 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 2.2.
DOC No: ZB7-DTS-D02 AES-128 Security Module True Random Number Generator (TRNG) Support for 8 Capacitive Sensing Buttons Integrated Temperature Sensor RF Section 2.4 GHz RF Transceiver Compatible With Bluetooth Low Energy (BLE) 4.1 specification and IEEE 802.15.4 PHY and MAC Excellent Receiver Sensitivity (–96 dBm for BLE and –99 dBm for 802.15.4), Selectivity, and Blocking Performance Link budget of 101 dB/104 dB (BLE/802.15.
DOC No: ZB7-DTS-D02 3. MODULE OUTLINE 3.1. Signal Layout (Top View) ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 8 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 3.2. Pin Description Table 3-1. Pin Description Pin No.
DOC No: ZB7-DTS-D02 21 DIO_14 Digital/Analog I/O 22 VDDS (1) Power 1.8 V to 3.8 V main chip and DC/DC supply Power 1.8 V to 3.8 V GPIO supply (1) GPIO, Sensor Controller, Analog 23 VDDS2 24 NC 25 GND GND Ground G1~G4 GND GND Ground NC No connection. (1) The power range is 1.8V to 3.6V for -04 module. ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 10 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 4. MODULE SPECIFICATIONS 4.1. Absolute Maximum Ratings(1)(2) over operating free-air temperature range (unless otherwise noted) Parameter Supply voltage, VDDS Conditions (3) Voltage on any digital pin (4) MIN MAX Unit -0.3 4.1 V -0.3 VDDS+0.3 V Max 4.1 Voltage on ADC input (Vin) Voltage scaling enabled -0.3 VDDS V Internal reference, voltage scaling disabled -0.3 1.49 V VDDS as reference, voltage scaling disabled -0.3 VDDS/2.
DOC No: ZB7-DTS-D02 4.2. ESD Ratings Parameter Electrostatic Human Body Model (HBM), per ANSI/ESDA/JEDEC Value Unit All pins ±2500 V RF pins ±750 V Non-RF pins ±750 V (1) discharge JS001 performance (VESD) Charged Device Model (CDM), per JESD22-C101 (2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 4.3.
DOC No: ZB7-DTS-D02 4.4. Electrical Characteristics Tc = 25°C, VDDS = 3.0 V with internal DC-DC converter, unless otherwise noted. Test Conditions Parameter Reset. RESET_N pin asserted or VDDS below Min Typ Max Units 100 nA Shutdown. No clocks running, no retention 150 nA Standby. With RTC, CPU, RAM and (partial) 1 μA 1.2 μA 2.5 μA 2.7 μA 550 μA Power-on-Reset threshold register retention. RCOSC_LF Standby. With RTC, CPU, RAM and (partial) register retention.
DOC No: ZB7-DTS-D02 4.5. General Characteristics Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Parameter Min Typ Max Units FLASH MEMORY Supported flash erase cycles 100 K before failure Cycles Flash page/sector erase current Flash page/sector erase time Average delta current (1) Flash page/sector size Flash write current Flash write time Average delta current, 4 bytes at a time (1) 4 bytes at a time 12.6 mA 8 ms 4 KB 8.
DOC No: ZB7-DTS-D02 Selectivity, ±5 MHz or 32 dB 25 dB 3/26(2) dB 30 MHz to 2000 MHz -20 dBm Out-of-band blocking 2003 MHz to 2399 MHz -5 dBm Out-of-band blocking 2484 MHz to 2997 MHz -8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz -8 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm.
DOC No: ZB7-DTS-D02 Spurious emission conducted measurement (1) (1) f < 1 GHz, outside restricted bands -43 dBm f < 1 GHz, restricted bands ETSI -65 dBm f < 1 GHz, restricted bands FCC -76 dBm f > 1 GHz, including harmonics -46 dBm Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.8. IEEE 802.15.
DOC No: ZB7-DTS-D02 Blocking and desensitization, Wanted signal at –97 dBm (3 dB above the 67 dB -50MHz from lower band edge sensitivity level), CW jammer, PER = 1% Spurious emissions, 30 MHz to Conducted measurement in a 50 Ω single-ended -71 dBm 1000 MHz load.
DOC No: ZB7-DTS-D02 4.10. Internal 24-MHz Crystal Oscillator (XOSC_HF)(1) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Parameter Min Typ Crystal frequency 24 Crystal frequency tolerance Start-up time Max (2) -40 MHz +40 (3) Units 150 ppm μs (1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device.
DOC No: ZB7-DTS-D02 4.13. 32-kHz RC Oscillator (RCOSC_LF) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Parameter Min Calibrated frequency Temperature coefficient Typ Max Units 32.8 KHz 50 ppm/°C 4.14. ADC Characteristics(1) Tc = 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. Test Conditions Parameter Min Input voltage range Typ 0 Resolution Gain error DNL (3) INL V Bits 200 ksps Internal 4.3-V equivalent reference 2 LSB Internal 4.
DOC No: ZB7-DTS-D02 input tone Internal 1.44-V reference, voltage scaling 69 dB (2) 67 dB VDDS as reference, 200 ksps, 9.6-kHz 72 dB 73 dB 50 Clock disabled, 32 samples average, 200 ksps, 300-Hz input tone SFDR – Internal 4.3-V equivalent reference , 200 Spurious-free dynamic range ksps, 9.6-kHz input tone input tone Internal 1.
DOC No: ZB7-DTS-D02 4.15. Temperature Sensor Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Parameter Min Resolution Typ Max 4 Range -40 Accuracy Supply voltage coefficient (1) Units °C +85 °C ±5 °C 3.2 °C/V (1) Automatically compensated when using supplied driver libraries. 4.16. Battery Monitor Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Parameter Min Resolution Typ Max 50 Range 1.8 Accuracy Units mV 3.8 V mV 13 4.17.
DOC No: ZB7-DTS-D02 4.18. Low-Power Clocked Comparator Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Parameter Input voltage range Min Typ 0 Clock frequency Max Units VDDS V 32 kHz Internal reference voltage, VDDS / 2 1.49-1.51 V Internal reference voltage, VDDS / 3 1.01-1.03 V Internal reference voltage, VDDS / 4 0.78-0.79 V Internal reference voltage, DCOUPL / 1 1.25-1.28 V Internal reference voltage, DCOUPL / 2 0.63-0.
DOC No: ZB7-DTS-D02 4.20. DC Characteristics Test Conditions Parameter Min Typ 1.32 1.54 Max Units TA = 25°C, VDDS = 1.8 V GPIO VOH at 8-mA load IOCURR = 2, high drive GPIOs only GPIO VOL at 8-mA load IOCURR = 2, high drive GPIOs only GPIO VOH at 4-mA load IOCURR = 1 GPIO VOL at 4-mA load IOCURR = 1 0.21 GPIO pullup current Input mode, pullup enabled, Vpad=0V 71.7 μA GPIO pulldown current Input mode, pulldown enabled, Vpad=VDDS 21.
DOC No: ZB7-DTS-D02 VIL Highest GPIO input voltage reliably interpreted as 0.2 VDDS (1) a ”Low” (1) Each GPIO is referenced to a specific VDDS pin. See the CC2650 technical reference manual listed in Section 8.2 for more details. 4.21.
DOC No: ZB7-DTS-D02 (2) S1(TX and RX) tclk_per (SSIClk period) Normal duplex operation 8 65024 clocks S2 (2) tclk_high (SSIClk high time) 0.5 tclk_per S3 (2) tclk_low(SSIClk low time) 0.5 tclk_per (1) Device operating as MASTER. For SSI SLAVE operation, see Section 4.21. (2) (4) Refer to SSI timing diagrams Figure 4-1, Figure 4-2, and Figure 4-3. Figure 4-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement Figure 4-2.
DOC No: ZB7-DTS-D02 Figure 4-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 26 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 5. DESIGN RECOMMENDATIONS 5.1. Module Layout Recommendations Follow these module layout recommendations: Antenna For a module with on board chip antenna, to eliminate the influence from other components or ground, recommended that the module is placed in the corner of main PCB, and define a clearance area around the antenna, where no grounding or signal trace are contained. The clearance area applies to all layers of the main PCB.
DOC No: ZB7-DTS-D02 RF test point There are RF test points in the bottom side of this module. It is only for module production used. Do not connect any signal to these test points (leave no connection). Please reserve a keep out area. Do not route any signal or place via in this keep out area. RF test points keep out area Device and Documentation Support For a complete device and tool documents for the CC2650 platform, visit the Texas Instruments website at http://www.ti.com.
DOC No: ZB7-DTS-D02 5.2.
DOC No: ZB7-DTS-D02 6. CHIP ANTENNA PERFORMACE SUMMARY Measured on the Jorjin ZB7500E00 EM board with TA = 25°C 6.1. S-Parameter Test ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 30 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 6.2. DUT 3D Pattern Z X Y 6.3. Total Efficiency Parameter 2400MHz 2450MHz 2483MHz S11 -10.780 dB -17.338 dB -16.020 dB Efficiency% 53.97 % 56.87 % 53.64 % Peak Gain 1.080 dBi 1.256 dBi 1.034 dBi ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 31 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 7. PACKAGE INFORMATION 7.1. Module Mechanical Outline Top View Note: 1> Pad tolerance as ±30um 2> Unit: mm ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 32 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 Top and Side View Shielding case Opening Note: A: Typical: 2.45mm, Maximum: 2.69mm B: Typical: 2.00mm, Maximum: 2.20mm Unit: mm ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 33 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 7.2. Ordering Information Order Number Package Test Grade ZB7500-00 LGA-25 500-00 ZB7500-04 LGA-25 500-04 ZB7410-00 LGA-25 410-00 ZB7410-04 LGA-25 410-04 ZB7320-00 LGA-25 320-00 ZB7320-04 LGA-25 320-04 7.3. Package Marking JORJIN Model:ZB7 Grade:XX0-0X LTC:YYWWSSF R XXX-XXXXXX IC:10462A-ZB7 FCC ID:WS2-ZB7 CCXXxxYYyyyZz W Marking Description JORJIN Brand name ZB7 Model name XX0-0X Test grade (for more information, see Section 7.
DOC No: ZB7-DTS-D02 YYWWSSF Lot Trace Code: YYWWSSF YY= Digit of the year, ex: 2016=16 WW= Week (01~52) SS= Serial number from 01~98 match to MFG’s lot number, or 99 to repair control code F= Reverse for internal use TELEC compliance mark, and ID 10462A-ZB7 Canada IC ID WS2-ZB7 FCC ID NCC compliance mark, and ID 7.4. Test Grades The ZB7 module offers six footprint-compatible, function variants by embedded software. Test Grade BLE 802.15.
DOC No: ZB7-DTS-D02 8. SMT AND BAKING RECOMMENDATION 8.1. Baking Recommendation Baking condition： - Follow MSL Level 4 to do baking process. - After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10% - If baking is required, Devices may be baked for 8 hrs. at 125 °C. 8.2.
DOC No: ZB7-DTS-D02 No. Item Temperature (°C) Time (sec) 1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 2 Soldering D2: = 220 T2: 60 +/- 10 3 Peak-Temp. D3: 250 °C max Note: (1) Reflow soldering is recommended two times maximum. (2) Add Nitrogen while Reflow process： SMT solder ability will be better. Stencil thickness： 0.1~ 0.13 mm (Recommended) Soldering paste (without Pb)： Recommended SENJU N705-GRN3360-K2-V can get better soldering effects.
DOC No: ZB7-DTS-D02 9. TAPE REEL INFROMATION 9.1. Cover / Carrier Tape Dimension Packing Qty Dry Bag Inner Box Outer Box 1200 EA / Reel 1 Reel (1200 EA) 1 Dry Bag (1200 EA) 4 Inner Box (4800 EA) Inner Box Size : 352mm x 352mm x 56mm Outer Box Size : 354mm x 362mm x 250mm ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 38 http://WWW.JORJIN.COM.
DOC No: ZB7-DTS-D02 10. REGULATORY INFORMATION This section outlines the regulatory information for the following countries: United States Canada Europe Japan Taiwan 10.1. United States Federal Communications Commission Statement 15.21. You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules.
DOC No: ZB7-DTS-D02 module. The end user manual shall include all required regulatory information/warning as shown in this manual. 10.2. Canada This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
DOC No: ZB7-DTS-D02 module. The end user manual shall include all required regulatory information/warning as shown in this manual. 10.3. Europe This module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. This module is conformity with the following standards EN300328 v1.9.1 (Bluetooth Low Energy) EN300328 v1.9.1 (802.15.4) IEC/EN62479:Ver 2010 (MPE) (replacing EN50371) EN301489-1 v1.9.
DOC No: ZB7-DTS-D02 10.5. Taiwan The ZB7 is certified as a module with type certification number XXXXXXXXXXXXXX. End products that integrate this module do not need additional NCC Taiwan certification for the end product. End product can display the certification label of the embedded module.
DOC No: ZB7-DTS-D02 11. HISTORY CHANGE Revision Date Description 2015/06/22 Initial Released D 0.1 2016/01/21 1. Upgrade the design to Revision B 2. Module size extended to 16.9mm x 11mm 3. Change antenna D 0.2 2016/08/02 1. 2. 3. 4. 5. 6. 7. Revision A Design D 0.
