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WG1400-00

TI CC3100 IEEE 802.11 b/g/n

Datasheet

Draft 0.5

Nov/25/2015

Prepared By Reviewed By Approved By

Summary of content (23 pages)

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Doc No: WG1400-00-DTS-D05 Index 1. OVERVIEW ............................................................................................................................... 2 1.1. 1.2. General Features ...............................................................................................2 Applications .......................................................................................................3 2. MODULE BLOCK DIAGRAM ...................................................................
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Doc No: WG1400-00-DTS-D05 1. OVERVIEW 1.1. General Features WIFI Network Processor Subsystems Featuring Wi-Fi Internet-On-a-Chip™ Wi-Fi Driver and Multiple Internet Protocols in ROM 802.
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Doc No: WG1400-00-DTS-D05 Advanced Low-Power Modes - Hibernate with RTC: 4 μA - Low-Power Deep Sleep (LPDS): - RX Traffic (MCU Active): 53 mA @ 54 OFDM - TX Traffic (MCU Active): 223 mA @ 54 OFDM, Maximum Power - Idle Connected: 690 μA @ DTIM = 1 115 μA Clock Source 40.0-MHz internal built-in crystal 32.768-kHz external clock source Package and Operating Temperature 23.5mm*23.5mm*2.4mm Ambient Temperature Range: -30°C to 85°C 1.2.
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Doc No: WG1400-00-DTS-D05 3. PRODUCTION SPECIFICATIONS 3.1. Absolute Maximum ratings Over operating free-air temperature range PARAMETERS PINS MIN MAX UNIT 3,4,6 -0.5 3.8 V Digital inputs -0.5 VBAT+0.5 V RF pins -0.5 2.1 V Analog pins (Clock input) -0.5 2.1 V Operating temperature range (TA) -30 +85 °C VBAT 3.2.
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Doc No: WG1400-00-DTS-D05 (VBAT_IN = 3.0V) IOH High-level source current, VOH = 2.4 6 mA IOL Low-level sink current, VOH = 0.4 6 mA Pin internal Pull up and Pull down (25°C)) PARAMETER IOH MIN Pull-Up current, VOH = 2.4 NOM MAX UNIT 10 μA 5 (VBAT_IN = 3.0V) IOH Pull-Down current, VOL = 0.4 5 μA (VBAT_IN = 3.0V) 3.4.
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Doc No: WG1400-00-DTS-D05 3.5. SPI Interface Host SPI Interface timing Fig 3.5.1 Host SPI interface timing Table 3.5.1 Host SPI interface timing parameter Parameter Parameter (1) Parameter Name Min Max Unit I1 F Clock frequency @ VBAT = 3.
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Doc No: WG1400-00-DTS-D05 3.6. Input Clocks/Oscillators Table 3.6.1 External RTC Digital Clock Requirements CHARACTERISTICS CONDITION SYM MIN Frequency TYP MAX 32768 UNIT Hz Frequency accuracy ±150 ppm 100 ns 80 % (Initial + temp + aging) Input transition time tr/tf (10% to 90%) tr/tf Frequency input duty cycle 20 Slow clock input voltage limits 50 Square wave, Vih 0.65 × VBAT VBAT V DC coupled Vil 0 0.35 × VBAT Vpeak 1 Input impedance MΩ 5 pF 3.7.
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Doc No: WG1400-00-DTS-D05 5.1. Pin Description Pin No. Signal Name State at Reset Type 1 GND GND GND 2 nRESET HI-Z I Description Ground. RESET input for the device. Active low input. The RC circuit (100K∥0.1μF) has been built in internal for power reset. 3 VBAT_IN POW POW Power supply input, 2.1 to 3.6V. 4 VBAT_IN POW POW Power supply input, 2.1 to 3.6V. 5 GND GND GND Ground. 6 NC_06 HI-Z NA 7 GND GND GND 8 EXT_RTC_IN HI-Z Analog 9 UART_RTS HI-Z O Unused.
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Doc No: WG1400-00-DTS-D05 is not used, connect to VBAT using 100K for pulling-up. 20 NC_20 HI-Z NA 21 FORCE_AP HI-Z I Unused. Leave unconnected. For forced AP mode, pull high on the board using 100K resistor. Otherwise, pull down to ground using 100K resistor. 22 GND GND GND 23 HOST_SPI_CLK HI-Z O Host interface SPI clock. 24 HOST_SPI DIN HI-Z I Host interface SPI data input. 25 HOST_SPI_DOUT HI-Z O Host interface SPI data output.
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Doc No: WG1400-00-DTS-D05 5.3. RF Connector P/N : U.FL-R-SMT-1 (U.FL Series) from HIROSE. Fig 5.3.1 RF connector drawing Table for Filed Antenna Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.
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Doc No: WG1400-00-DTS-D05 7. SMT AND BAKING RECOMMENDATION 7.1. Baking Recommendation Baking condition： - Follow MSL Level 4 to do baking process. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10% If baking is required, Devices may be baked for 8 hrs. at 125 °C. 7.2.
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Doc No: WG1400-00-DTS-D05 No. Item Temperature (°C) Time (sec) 1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 2 Soldering D2: = 220 T2: 60 +/- 10 3 Peak-Temp. Note: D3: 250 °C max (1) Reflow soldering is recommended two times maximum. (2) Add Nitrogen while Reflow process： SMT solder ability will be better. Stencil thickness：： 0.1~ 0.13 mm (Recommended) Soldering paste (without Pb)：： Recommended SENJU N705-GRN3360-K2-V can get better soldering effects. 8.
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Doc No: WG1400-00-DTS-D05 FCC Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
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Doc No: WG1400-00-DTS-D05 As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
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Doc No: WG1400-00-DTS-D05 Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
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Doc No: WG1400-00-DTS-D05 As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
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Doc No: WG1400-00-DTS-D05 produit final doit être étiqueté dans un endroit visible par le texte suivant: "Contient IC: 10462A-WG140000" Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.