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BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 1 of 11

BMD-ICN-1 Module for Bluetooth 4.1 LE

Table of Contents

1. QUICK SPECIFICATIONS ................................................................................................................................................ 2

2. PIN DESCRIPTIONS ....................................................................................................................................................... 3

3. ELECTRICAL SPECIFICATIONS ........................................................................................................................................ 4

3.1. ABSOLUTE MAXIMUM RATINGS ............................................................................................................................ 4

3.2. OPERATING CONDITIONS....................................................................................................................................... 4

3.3. GENERAL PURPOSE I/O .......................................................................................................................................... 4

3.4. DEBUG & PROGRAMMING .................................................................................................................................... 5

3.5. CLOCKS .................................................................................................................................................................. 5

4. MECHANICAL DATA ...................................................................................................................................................... 6

4.1. MODULE DIMENSIONS .......................................................................................................................................... 6

4.2. RECOMMENDED PCB LAND PAD ............................................................................................................................ 6

5. MODULE MARKING ...................................................................................................................................................... 7

5.1. MECHANICAL ENCLOSURE ..................................................................................................................................... 7

6. REGULATORY STATEMENTS ......................................................................................................................................... 8

6.1. FCC STATEMENT: ................................................................................................................................................... 8

6.2. FCC IMPORTANT NOTES: ........................................................................................................................................ 8

6.3. IC STATEMENT: ...................................................................................................................................................... 9

6.4. IC IMPORTANT NOTES: ........................................................................................................................................ 10

6.5. CE REGULATORY: ................................................................................................................................................. 10

7. SOLDER REFLOW TEMPERATURE-TIME PROFILE ......................................................................................................... 11

Summary of content (11 pages)

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BMD-ICN-1 Module for Bluetooth 4.1 LE Table of Contents 1. QUICK SPECIFICATIONS ................................................................................................................................................ 2 2. PIN DESCRIPTIONS ....................................................................................................................................................... 3 3. ELECTRICAL SPECIFICATIONS ..................................................................................
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1. Quick Specifications Bluetooth Version Security LE connections Radio Frequency Modulations Transmit power Receiver sensitivity Antenna 4.1 (Bluetooth Smart) Peripheral/Central (S130) AES-128 up to 3 as Central, up to one a Peripheral (S130, simultaneous) 2.402GHz to 2.
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2. Pin Descriptions 16 15 13 14 17 11 12 9 10 7 8 5 6 3 4 1 2 18 19 47 20 21 22 23 24 25 46 26 27 28 29 30 32 31 34 33 36 35 38 37 40 39 42 41 44 43 45 Figure 1- Pin out (Top View) Pin description Name P0.21 P0.22 P0.23 P0.24 P0.25 P0.26 P0.27 P0.28 P0.29 P0.30 P0.00 P0.01 P0.02 P0.03 P0.04 P0.05 P0.06 P0.07 P0.08 P0.09 P0.10 P0.11 P0.12 P0.13 P0.14 P0.15 P0.16 SWDIO SWCLK P0.17 P0.18 P0.19 P0.
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3. Electrical Specifications 3.1. Absolute Maximum Ratings Symbol Parameter Min. Max. Unit VCC_MAX Voltage on supply pin -0.3 3.9 V VIO_MAX Voltage on GPIO pins -0.3 VCC + 0.3 V Storage Temperature Range -40 125 °C TS Table 3 – Absolute Maximum Ratings 3.2. Operating Conditions Symbol VCC TR_VCC TA TAext Parameter Min. Typ. 1.8 3.0 3.6 V - - 60 ms -25 25 75 °C -25 25 85 °C Operating supply voltage Supply rise time (0V to 1.
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3.4. Debug & Programming The BMD-ICN-1 supports the two pin Serial Wire Debug (SWD) interface and allows for debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support. 3.5. Clocks The BMD-ICN-1 module requires two clocks, a high frequency clock and a low frequency clock. The high frequency clock is provided internally by a high-accuracy 16-MHz crystal as required by the nRF51822 for radio operation.
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4. Mechanical Data 4.1. Module Dimensions Figure 2- Module Dimensions (All dimensions are in mm) 4.2. Recommended PCB Land Pad Figure 3- Module Dimensions BMD-ICN-1 Datasheet v1.
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(All dimensions are in mm) 5. Module Marking Figure 4 – Module Marking – Rev A – BMD-ICN-1-A (16kB) Figure 5- Recommended RF Layout 5.1. Mechanical Enclosure Care should be taken when designing and placing the module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance. The module is designed and tuned for the antenna and RF components to be in free air.
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6. Regulatory Statements 6.1. FCC Statement: This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
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be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as the two (2) conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed (for example, digital device emission, PC peripheral requirements, etc.
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6.4. IC Important Notes: 1. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 2.
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7. Solder Reflow Temperature-Time Profile Figure 6 - Reflow Profile for Lead Free Solder BMD-ICN-1 Datasheet v1.