Datasheet

MPW - MPF
Metallized polypropylene lm capacitor
MKP - Low dissipation general purpose
Ed.03 Rev.00 07.2012
9.1
Main applications
Blocking, ltering, bypassing, timing, coupling, decoupling, audio
applications, general applications in electronics. Low power
switching applications. Medium-low pulse operation
Dielectric
Polypropylene
Electrodes
Vacuum deposited metal layers
Coating
UL 510 / CSA TIL I-26 polyester tape wrapping; UL 94V-0 resin end
ll. Flame retardant execution
Construction
Extended metallized lm (refer to general technical information).
Internal series connection for Ur≥1000Vdc. Non inductive type
Leads
Tinned copper wire (lead free)
Reference standard
IEC 60384/16, IEC 60068, RoHS compliant
Climatic category
55/100/56 (IEC 60068/1), FMD (DIN 40040)
Operating temperature range
-55°...+105°C
Rated capacitance (Cr)
1000pF to 33µF, In compliance with IEC 60063, E6 series. Refer
to article table
Capacitance tolerance (at 1kHz)
±10% (code=K), ±5% (code=J), ±20% (code=M). Other
tolerances upon request
Capacitance temperature coefcient
Refer to graphs in general technical information
Long term stability (at 1 kHz)
Capacitance variation ≤ ±1% after a period of 2 years at standard
environmental conditions
Rated voltage (Ur)
160, 250, 400, 630, 1000, 1500 Vdc
(permissible AC voltage at 60Hz: 90, 200, 220, 250, 450, 600Vac)
Category voltage (Uc)
UC=Ur at +85°C; Uc=0,8xUr at +100°C
Temperature derated voltage
For T > +85°C, Ur must be decreased 1,25% for every °C exceeding
+85°C
Self inductance
≤ 1nH/mm of capacitor and leads length used for connection
Maximum pulse rise time
Refer to article table. The pulse characteristic Ko depends on the
voltage waveform.In any case the value given in the article table
must not be exceeded.
Dissipation factor (DF), max.
(tgδ x10
-4
, measured at 25±5°C)
Freq. Cr ≤ 0.1μF 0.1μF< Cr ≤ 1μF Cr> 1μF
1kHz 6 6 6
10kHz 10 20 -
100kHz 30 - -
Insulation resistance (IR)
Measured between terminals, at 25±°C, after 1 minute of
electrication at 100Vdc
Cr IR
≤ 0,33µF ≥ 100GΩ
> 0,33µF ≥ 30000s
Test voltage between terminals (Ut)
1,6xUr (DC) applied for 2s at 25±5°C (1 minute for type test)
Damp heat test (steady state)
Test conditions:
Temperature= +40±2°C
Relative humidity=93±2%
Test duration= 56 days
Performance:
Capacitance change ≤ ±1%
DF change ≤ 0.0010 at 10kHz for Cr ≤ 1μF
DF change ≤ 0.0010 at 1kHz for Cr > 1μF
IR≥ 50% of initial limit value
Endurance test
Test conditions:
Temperature= +85±2°C
Test duration= 2000h
Voltage applied=1,25xUr(DC)
Performance:
Capacitance change ≤ ±1%
DF change ≤ 0.0010 at 10kHz for Cr ≤ 1μF
DF change ≤ 0.0010 at 1kHz for Cr > 1μF
IR≥ 50% of initial limit value
Resistance to soldering heat test
Test conditions:
Solder bath temperature= +260±5°C
Dipping time (with heat screen)= 10±1s
Performance:
Capacitance change ≤ ±1%
DF change ≤ 0.0010 at 10kHz for Cr ≤ 1μF
DF change ≤ 0.0010 at 1kHz for Cr > 1μF
IR≥ 50% of initial limit value
Reliability (MIL HDB 217)
Application conditions:
Applied voltage= 0,5 x Ur(DC)
Temperature= +40±2°C
Failure rate:
(1FIT=1x10
-9
failures/components x hours)
≤ 3FIT
Failure criteria (DIN44122):
Capacitance change > ±10%
DF change > 2 x initial value
IR< 0,005 x initial limit value
Short or open circuit
Warning: this specication must be completed with the data given in the
“General technical information” chapter