正基科技股份有限公司 SPECIFICATION REV： SPEC. NO.： 07.20. 2012 TP V. DATE： 1.9 WL-211 On ly for PRODUCT NAME： APPROVED CHECKED PREPARED DCC ISSUE NAME AMPAK Technology Inc. Doc. NO: www.ampak.com.
AMPAK WL-211 On ly for TP V. Wi-Fi SIP Module Spec Sheet AMPAK Technology Inc. Doc. NO: www.ampak.com.
Revision History Date Revised By Version Revision Content -Initial released Andy 1.0 2011/09/27 -Modify physical dimensions Andy 1.1 2011/10/19 -Modify block diagram Andy 1.2 2011/12/23 -Add Power Consumption Andy 1.3 2012/01/12 -Modify dimension Andy 1.4 2012/03/09 -Add packing information Andy 1.5 2012/03/19 -More info to recommended footprint Andy 1.6 2012/05/03 -Pin description revised Bart 1.
Contents TP V. Revision History ......................................................................................................... 1 Contents..................................................................................................................... 2 1. Introduction........................................................................................................... 3 2. Features .........................................................................................................
1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi functionalities. The highly integrated WL-211 module makes the possibilities of web browsing, VoIP, headsets and other applications. With seamless roaming capabilities and advanced security, WL-211 can also interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN. TP V. This wireless module complies with IEEE 802.
2. Features Single-band 2.4GHz IEEE 802.11b/g/n Supports standard interfaces SDIO v2.0(50MHz, 4-bit and 1-bit) and generic SPI(up to 50MHz) Integrated ARM Cortex-M3TM CPU with on-chip memory enables running IEEE802.11 firmware that can be field-upgraded with future features. Supports per packet Rx antenna diversity Security: i. Hardware WAPI acceleration engine ii. AES and TKIP in hardware for faster data encryption and IEEE 802.11i compatibility iii.
3. Deliverables 3.1 Deliverables The following products and software will be part of the product. Module with packaging Evaluation Kits Software utility for integration, performance test. Product Datasheet. Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications TP V. The product delivery is a pre-tested module, without the module level certification. For On ly for module approval, the platform’s antennas are required for the certification.
4. General Specification 4.1 Wi-Fi RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Description Product Name WL-211 Wi-Fi SIP Module WLAN Standard IEEE 802.11b/g/n, WiFi compliant Host Interface SDIO Dimension L x W x H: 9.5 x 9.5 x 1.5 (typical) mm Frequency Range 2.412 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 11 for North America, 13 for Europe, and 14 for Japan Modulation TP V. Feature 802.11b : DQPSK, DBPSK, CCK 802.
802.11b : 1, 2, 5.5, 11Mbps Data Rate 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps Data Rate (20MHz ,Long GI,800ns) 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Data Rate (20MHz ,short GI,400ns) 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps 802.11b : -10 dBm Maximum Input Level 802.11g/n : -20 dBm -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing TP V. Operating temperature 4.
5. Pin Assignments TP V. 5.1 PCB Pin Outline for < TOP VIEW > 5.2 Pin Definition Name 1 WLAN_ANT 2 3 Type Description RF signal I/O port GND I/O － JTAG_TRST_L I JTAG interface, if JTAG not used unconnected (NC) O JTAG interface, if JTAG not used unconnected (NC) this pin. This pin is also muxed with UART_TX, which can be enabled by software On ly NO 4 JTAG_TDO_UART_TX Ground 5 JTAG_TDI_UART_RX I JTAG interface, if JTAG not used unconnected (NC) this pin.
GND － Ground 15 GND － Ground 16 GND － Ground 17 GND － Ground 18 VIO I Digital I/O Voltage input 19 CLK_32K I Sleep clock (32.
GND － Ground 53 GND － Ground 54 GND － Ground 55 GND － Ground 56 GND － Ground 57 GND － Ground 58 GND － Ground 59 GND － Ground 60 GND － Ground 61 GND － Ground On ly for TP V. 52 AMPAK Technology Inc. Doc. NO: www.ampak.com.
6. Dimensions 6.1 Physical Dimensions (Unit: mm) < TOP VIEW > < Side View > TP V. 1.7 (MAX) On ly for < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.
6.2 Recommended Footprint (Unit: mm) On ly for TP V. < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.
7. External clock reference External LPO signal characteristics Parameter LPO Clock Units 32.768 kHz 30 ppm 30 - 70 % 1600 to 3300 mV, p-p Square-wave or sine-wave - Nominal input frequency Frequency accuracy Duty cycle Input signal amplitude Signal type >100k <5 pF Clock jitter (integrated over 300Hz – 15KHz) <1 Hz 7.1 SDIO Pin Description TP V. Input impedance On ly for The WL-211 supports SDIO version 1.
8. Host Interface Timing Diagram 8.1 Power-up Sequence Timing Diagram ※ WL_RST_N: Low asserting Reset for WLAN Core. This pin must be driven high or low (not left floating). On ly for TP V. 8.2 SDIO Default Mode Timing Diagram AMPAK Technology Inc. Doc. NO: www.ampak.com.
On ly for TP V. 8.3 SDIO High Speed Mode Timing Diagram AMPAK Technology Inc. Doc. NO: www.ampak.com.
9. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times 10 250℃ On ly for TP V. 2.5°C/sec 40~70 sec 2.5℃/sec AMPAK Technology Inc. Doc. NO: www.ampak.com.
10. Packing Information 10.1 Label Label A Anti-static and humidity notice On ly for TP V. Label B MSL caution / Storage Condition Label C Inner box label . Label D Carton box label . AMPAK Technology Inc. Doc. NO: www.ampak.com.
On ly for TP V. 10.2 Dimension AMPAK Technology Inc. Doc. NO: www.ampak.com.
B Humidity indicator A Desiccant TP V. C On ly for C D AMPAK Technology Inc. Doc. NO: www.ampak.com.
On ly for TP V. 10.3 MSL Level / Storage Condition ※NOTE : Accumulated baking time should not exceed 96hrs AMPAK Technology Inc. Doc. NO: www.ampak.com.
F Federal Co ommunicatiion Commission Interrference Sttatement This deevice compllies with Paart 15 of th he FCC Rules. Operatioon is subject to the folllowing two conditionns: (1) Th his device may not cause harm mful interferrence, and (2) this ddevice musst accept any a interferrence receiived, includinng interference that maay cause und desired operration. This eqquipment haas been tessted and fo ound to com mply with tthe limits for f a Class B digital device, pursuuant to Part 15 of the FCC F Rules .
This devicce is intended d only for O OEM integra ators under the followinng condition ns: 1) Thee antenna must m be instaalled such th hat 20 cm is maintainedd between th he anteenna and users, and 2) Thee transmitterr module m may not be co o-located with w any otheer transmittter or antenna. a As longg as 2 conditions abovee are met, fu urther transm mitter test w will not be requiredd.
