Specification Sheet

DESCRIPTION
HyperX HX432S20IB2K2/16 is a kit of two 1G x 64-bit (8GB)
DDR4-3200 CL20 SDRAM (Synchronous DRAM) 1Rx8, memory
module, based on eight 1G x 8-bit DDR4 FBGA components.
Each module supports Intel® Extreme Memory Profiles (Intel®
XMP) 2.0. Total capacity is 16GB. This module has been
tested to run at DDR4-3200 at a low latency timing of 20-22-22
at 1.2V. Additional timing parameters are shown in the PnP
Timing Parameters section below. The JEDEC standard electri-
cal and mechanical specifications are as follows:
SPECIFICATIONS
20 cyclesCL(IDD)
Row Cycle Time (tRCmin) 45.75ns (min.)
Refresh to Active/Refresh 350ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 26.25ns (min.)
Maximum Operating Power TBD W*
0 - V 49gnitaR LU
Operating Temperature 0°C to 85°C
Storage Temperature -55°C to +100°C
*Power will vary depending on the SDRAM used.
HX432S20IB2K2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR4-3200 CL20 260-Pin SODIMM Kit
PnP JEDEC TIMING PARAMETERS:
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Height 1.18” (30.00mm)
• JEDEC/PnP: DDR4-3200 CL20-22-22 @1.2V
• XMP Profile #1: DDR4-3200 CL20-22-22 @1.2V
• XMP Profile #2: DDR4-2933 CL17-19-19 @1.2V
Document No. 4808596A 02/14/18 Page 1
hyperxgaming.com
HX432S20IB2K2/1
6
16
G
B
(
8
G
B 1
G
x 64-Bit x 2
p
cs.
)
Memory Module Specifications
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