K255B-SR Wi-Fi Dual-band 1X1 11a/b/g/n/ac +Bluetooth 5.
K255B-SR Module Datasheet Office: 6 Floor, Building U6, Junxiang U8 Park, Hangcheng Avenue, Bao'an District, Shenzhen City, CHINA Factory: No.8, Litong Road, Liuyang Economic & Technical Development Zone, Changsha, Hunan, CHINA TEL: +86-755-2955-8186 Website: www.fn-link.
K255B-SR Revision History Version Date Revision Content Draft Approved 1.0 2021/02/23 Draft version Lgp Szs 2.0 2021/03/18 Correct typo; Update RF specification; Update Pin definition; Add module picture Lgp Szs 3.0 2021/04/12 Update marking description Lgp Szs 4.0 2021/05/20 Update RF specification; Update module picture Lgp Szs 5.
CONTENTS K255B-SR 1 Overview....................................................................................................................................2 1.1 Introduction......................................................................................................................... 2 1.2 Features.............................................................................................................................. 2 1.3 General Specification..........................................
K255B-SR 1 Overview 1.1 Introduction K255B-SR support 1-stream 802.11a/b/g/n/ac solution with MU-MIMO STA mode with Bluetooth smart ready controller, SDIO 3.0 interface, HS-UART mixed interface. It combines WLAN MAC, a 1T1R WLAN baseband, RF in a single chip. Module complies with IEEE 802.11 a/b/g/n/ac standard and the speed can achieve up to 80MHz bandwidth and PHY data rate of 433Mbps. Module complies with Bluetooth core specification V5.0, support both classic BDR/EDR and BLE mode. 1.
K255B-SR Block Diagram: 1.3 General Specification Model Name K255B-SR Product Description Support Wi-Fi/Bluetooth functionalities Dimension L x W x H: 15 x 13 x 2.15 mm (typical) Wi-Fi Interface Support SDIO 3.0 BT Interface UART / PCM Operating temperature 0°C to 70°C Storage temperature -40°C to 85°C 1.4 Recommended Operating Rating Min. Typ. Max. Unit 0 25 70 VCC33 3.15 3.3 3.45 deg.C V VDDIO 1.62 1.8 1.98 V Operating Temperature ※1.
K255B-SR 2 Wi-Fi RF Specification 2.1 2.4GHz RF Specification Feature Description WLAN Standard IEEE 802.11 b/g/n Wi-Fi compliant Frequency Range 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz:Ch1 ~ Ch14 Spectrum Mask Min. b/g/n Typ. b/g/n Max. b/g/n Unit b/g/n 1st side lobes(to fc ± 11MHZ) - -43/-30/-40 - dBr 2st side lobes(to fc ± 22MHZ) - -52/-33/-58 - dBr Freq. Tolerance -20/-20/-20 - 20/20/20 ppm Test Items Typical Value EVM 802.11b /11Mbps: 15dBm ± 2.
K255B-SR 2.2 5GHz RF Specification Feature Description WLAN Standard IEEE 802.11a/n/ac 1x1, Wi-Fi compliant Frequency Range 5.150 GHz ~ 5.850 GHz (5.0 GHz Band) Number of Channels 5.0GHz:Please see the table1 Test Items Typical Value EVM 802.11a /54Mbps: 14 dBm ± 2.0 dB EVM ≤ -25dB 802.11n /MCS7(HT20): 14dBm ± 2.0 dB EVM ≤ -28dB 802.11n /MCS7(HT40): 13dBm ± 2.0 dB EVM ≤ -28dB 802.11ac /MCS8(vHT20): 13 dBm ± 2.0 dB EVM ≤ -30dB 802.11ac /MCS9(vHT40): 12dBm ± 2.0 dB EVM ≤ -32dB 802.
K255B-SR 5GHz(20MHz) Channel table 1 Band range 5180MHz~5240MHz 5260MHz~5320MHz 5550MHz~5700MHz 5745MHz~5825MHz FN-LINK TECHNOLOGY LIMITED Operating Channel Numbers Channel center frequencies (MHz) 36 5180 40 5200 44 5220 48 5240 52 5260 56 5280 60 5300 64 5320 100 5500 104 5520 108 5540 112 5560 116 5580 120 5600 124 5620 128 5640 132 5660 136 5680 140 5700 149 5745 153 5765 157 5785 161 5805 165 5825 6 Proprietary & Confidential Information
K255B-SR 3 Bluetooth Specification 3.1 Bluetooth Specification Feature Description General Specification Bluetooth Standard Bluetooth V5.0 Host Interface UART Antenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2402 MHz ~ 2480 MHz Number of Channels 79 channels Modulation GFSK, π/4-DQPSK,8DPSK RF Specification Output Power Min. Typical. Max. 2 4 6 Sensitivity @ BER=0.1% for GFSK (1Mbps) -70 dBm Sensitivity @ BER=0.
K255B-SR 4 Pin Assignments 4.1 Pin Outline < TOP VIEW > 4.
K255B-SR 5 GND - Ground connections 6 GND - Ground connections 7 GND - Ground connections 8 GND - Ground connections 9 ANT1/NC 10 GND - Ground connections 11 GND - Ground connections 12 ANT2/NC 13 GND 14 NC - I/O Dual band Wi-Fi RF I/O for FGK255BSRX-00; NC for FGK255BSRX-XM Dual band Wi-Fi RF I/O for FGK255BSRX-XM; NC for FGK255BSRX-00 - Ground connections - No connect CHIP_EN 15 CHIP_EN I This pin can externally shut down WLAN function when pulled 1.
K255B-SR 36 VCC33 37 NC - No connect 38 NC - No connect 39 GND 40 UART_TXD O Bluetooth UART interface 1.8V 41 UART_RXD I Bluetooth UART interface 1.8V 42 UART_RTS_N O Bluetooth UART interface 1.8V 43 UART_CTS_N I 1.8V 44 NC - No connect 45 NC - No connect 46 GND 47 ANT_SEL/NC 48 GND 49 50 P Main power voltage source input 3.
K255B-SR 5 Dimensions 5.1 Module Picture L x W : 15 x 13 (+0.3/-0.1) mm FGK255BSRX-XM: FGK255BSRX-00: H: 2.15 (±0.2) mm Weight 0.81 (±0.1) g 5.
K255B-SR 5.
K255B-SR 5.
K255B-SR 6 Host Interface Timing Diagram 6.
K255B-SR 6.2 SDIO Pin Description The module supports SDIO version 3.0 for all 1.8V to 3.3V. SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK Clock CMD Command Line 6.
K255B-SR Outputs:CMD, DAT(referenced to CLK) Output delay time - Data Transfer mode tODLY 0 - 14 ns Output delay time - Identification mode tODLY 0 - 50 ns Typical Maximum Unit a. Timing is based on CL ≤ 40 pF load on CMD and Data. b. Min(Vih) = 0.7 × VDDIO and max(Vil) = 0.2 × VDDIO. 6.
6.5 SDIO Bus Timing Specifications in SDR Modes K255B-SR Clock timing(SDR Modes) Parametwer Symbol Minimum Maximum Unit Comments - tCLK 40 - ns SDR12 mode 20 - ns SDR25 mode 10 - ns SDR50 mode 4.8 - ns SDR104 mode - 0.2 × tCLK ns tCR, tCF < 2.00 ns (max)@100 MHz, - tCR, tCF CCARD = 10 pF tCR, tCF < 0.96 ns (max)@208 MHz, CCARD = 10 pF Clock duty - 30 70 % - Maximum Unit Comments Card Input timing (SDR Modes) Symbol Minimum SDR104 Mode tIS 1.
K255B-SR Card output timing (SDR Modes up to 100MHz) Symbol Minimum Maximum Unit Comments tODLY - 7.85a ns tCLK≥10 ns CL=30 pF using driver type B for SDR50 tODLY - 14.0 ns tCLK≥20 ns CL=40 pF using for SDR12, SDR25 tOH 1.5 - ns Hold time at the tODLY(min) CL=15 pF a. SDIO 3.0 specification value is 7.5 ns.
K255B-SR △tOP = +1550 ps for junction temperature of △tOP = 90 degrees during operation △tOP = -350 ps for junction temperature of △tOP = -20 degrees during operation △tOP = +2600 ps for junction temperature of △tOP = -20 to +125 degrees during operation 6.6 SDIO Bus Timing Specifications in DDR50 Mode parameter Symbol Minimum Maximum Unit Comments - tCLK 20 - ns DDR50 mode - tCR, tC - 0.2 ×tCLK ns tCR, tCF < 4.
K255B-SR parameter Symbol Minimum Maximum Unit Comments Input setup time tISU 6 - ns CCARD < 10 pF (1 Card) Input hold time tIH 0.8 - ns CCARD < 10 pF (1 Card) Output delay time tODLY - 13.7 ns CCARD < 30 pF (1 Card) Output hold time tOH 1.5 - ns CCARD < 15 pF (1 Card) Input setup time tISU2x 3 - ns CCARD < 10 pF (1 Card) Input hold time tIH2x 0.8 - ns CCARD < 10 pF (1 Card) Output delay time tODLY2x - 7.
K255B-SR 7 Reference Design Note: The function of PIN49 and PIN50 will be updated in future version.
K255B-SR 8 Ordering Information Part No. Description FGK255BSRX-XM W155S1, a/b/g/n/ac, Wi-Fi, BT5.0, 1T1R, SDIO+UART, 2 Antenna version, 13x15mm(XIAOMI VERSION) FGK255BSRX-00 W155S1, a/b/g/n/ac, Wi-Fi, BT5.0, 1T1R, SDIO+UART, 2 Antenna version, 13x15mm(GENERAL VERSION) 9 The Key Material List Item Part Name Description 1 Inductor 2016 2.2uH,±20% Sunlord, Ceaiya, Cenker 2 Diplexer 1608 Dual-band, dual-mode 2.4GHz/5GHz WLAN Glead, Walsin, ACX, Murata, MAG.
K255B-SR 10 Recommended Reflow Profile Referred to IPC/JEDEC standard.
K255B-SR 11 Package Information 11.1 Reel A roll of 1500pcs 11.
K255B-SR 11.3 Packaging Detail 11.4 Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.