Installation Guide

Installation manual of HRM1016
This document describes the guideance to install Bluetooth moduke HRM1016
(FCC ID:VIYHRM1016, IC:7305A-HRM1016) to customers PWB.
1.Mount Form
76 solder bumps, 1.2 mm pitch, diameter is 0.8 mm.
2.Reflow Profile
Maximum reflow times : 2 times
Recommended reflow temperature profile is shown in Figure 1.
Points of this profile are as follows:
- Ramp up temperature for preheat stage is 1 to 3 deg C/sec
- Preheat stage is from 155 to 165 deg C, from 120 to 150 sec
- Ramp up temperature for solder reflow is from 2 to 3 deg C/sec
- Peak temperature is from 240 to 245 deg C
- Time over 217 deg C is from 40 to 60 sec
- Cooling down temperature is from 2 to 4 deg C/sec.
Figure 1: Recommended reflow temperature profile
0
50
100
150
200
250
0 30 60 90 120 150 180 210 240 270 300 330 360 390
Temperature [deg C]
Time [sec]

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