M.2-B048-101 FII Industrial PCIE M.2 Module Product specification V1.0 Project Name Sirisu Fly mPro Module Code M.
M.2-B048-101 Revision history Version V1.
M.2-B048-101 TABLE OF CONTENTS 1. PRODUCT OVERVIEW ........................................................................................................ 4 2. ELECTRICAL TECHNICAL INDICATORS........................................................................... 6 2.1 Electrical characteristics ............................................................................................. 6 2.2 Module Interface ..........................................................................................
======================================== FCC regulatory compliance statement §15.19 Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. §15.
that apply to the host not covered by the modular transmitter grant of certification. Host manufacturer in any case shall ensure host product which is installed and operating with the module is in compliant with Part 15B requirements. Please note that For a Class B or Class A digital device or peripheral, the instructions furnished the user manual of the end-user product shall include statement set out in §15.
M.2-B048-101 1. Product Overview The M.2-B048-101 PCIE M.2 data module is a PCI Express M.2 data module based on the LTE (Long Term Evolution) standard. It is mainly used by industry customers for secondary terminal development. The module is integrated into the terminal and used as an LTE Modem to provide a wireless data interface to realize the air interface data transmission function.
M.2-B048-101 Figure 1-2 Physical dimensions of M.
M.2-B048-101 2. Electrical technical indicators 2.1 Electrical characteristics Item Description 51×30×4.75mm（L×W×H） Size Weight ≤20g Interface Antenna Port Communication：USB 2.0、USB 3.0、SDIO 3.0、PCIE 3.0 Power：3.3V DC USIM：Support USIM UART：One 2-wire UART&One 4-wire UART Wakeup：Can be waked up 2 Antenna Port 50Ω Operating temperature -20℃~ +55℃ Storage temperature Frequency band -40℃~ +85℃ B48(3550~3700MHz) Channel Bandwidth 5MHz/10MHz/15MHz/20MHz Rated Output Power 15.
M.2-B048-101 2.3 Pin definition The pin definition of the module interface is shown in Table 2-1. Table 2-1 PCIE M.2 interface pin definition Pin Defination Function Pin Defination 75 CONFIG_2 (GND) 74 3.3V 73 GND 72 3.3V 71 GND 70 3.3V 69 CONFIG_1 (GND) 67 RESET# (I)(0/1.8V) 65 SDH0_CMD 63 GPIO (I/0)(0/1.8V) 61 GPIO (I/0)(0/1.8V) 59 GPIO (I/0)(0/1.8V) 57 GND 55 REFCLKP 68 32.768KHz 66 SIM DETECT 64 UART0_TX 32.768KHz UART0 62 UART0_RX 60 GPIO (I/0)(0/1.
M.2-B048-101 2.
M.2-B048-101 3. Thermal Design In the installation design integrated into the industry equipment, in order to ensure the stability and reliability of the M.2-B048-101 module, it is necessary to pay attention to the heat dissipation design of the module. The main heat dissipation measures are as follows: The PCB board does not need to be hollowed out.
M.2-B048-101 Figure 3-2 Schematic diagram of M.2-B048-101 module after installation Strengthen the air flow around the module. Try not to place any parts on the module projection area of the user backplane. Do not place heat sensitive components (such as crystals) or any other components that consume 1.5W or higher power around the module. Choose a large user baseboard. The thermal pad between the module and the user backplane can improve the heat dissipation performance of the multilayer backplane.
M.2-B048-101 5.
