ZT2S Module Datasheet Version: 20210911 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 2 2 Module interfaces 2.1 Pin distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 5 3 Electrical parameters 3.
Contents ZT2S is a Zigbee module that Tuya has developed. It consists of a highly integrated wireless RF chip (Z2) and some peripherals. ZT2S also contains a low-power 32-bit CPU, 1024-KB flash memory, 64-KB RAM, and rich peripherals.
1 Product overview 1 Product overview Based on ZT2S, you can develop Zigbee products as required. 1.1 Features • • • • • Embedded with a low-power 32-bit CPU Clock rate: 48 MHz Wide operating voltage: 1.8 to 3.6V Peripherals: 5 GPIOs, 1 UART, and 1 ADC Zigbee connectivity – Support 802.15.4 MAC/PHY – Operating channels 11 to 26 @2.400 to 2.
1 Product overview Update date Updated content July 15th, 2021 This is the first release. Version after update V1.0.
2 Module interfaces 2 Module interfaces 2.1 Pin distribution ZT2S has 2 lines of pins, 11 pins in total, with a spacing of 2 mm. The dimensions of ZT2S are: 14.99±0.35 mm (W)×17.90±0.35 mm (L) ×2.80±0.15 mm (H) The thickness of the PCB is 0.8±0.1 mm.
2 Module interfaces 2.2 Pin definition Pin number Symbol Type Function 1 VCC P Power supply pin (Typical value: 3.
2 Module interfaces Pin number Symbol Type Function 2 C2 I/O Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_C2 of the IC (Pin 22) 3 GND P Power supply reference ground 4 C3 I/O Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_C3 (Pin 23 5 RX I/O Uart_RXD, which corresponds to B7 (Pin 17) on the internal IC 6 D2 I/O Common I/O interface, which can be used as PWM output of the LED drive and corres
2 Module interfaces Pin number Symbol Type Function 8 C4 I/O ADC pin, which corresponds to TL_C4 (Pin 24) on the internal IC 9 B4 I/O Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_B4 of the IC (Pin 14) 10 RST I Reset pin (low active), correspond to RESETB (Pin 25) on the internal IC 11 B5 I/O Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_B5 of the IC (Pin15) 12 SWS I/O Burning pin, which cor
2 Module interfaces PWM output, please contact the Tuya business personnel.
3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Operating temperature -5 150 ℃ VCC Supply voltage -0.3 3.6 V ESD voltage (human body model) TAMB-25℃ - 2 KV ESD voltage (machine model) TAMB-25℃ - 0.5 KV 3.2 Normal working conditions Minimum value Typical value Maximum value Unit Parameter Description Ta Operating temperature -40 - 85 ℃ VCC Operating voltage 1.9 3.3 3.
3 Electrical parameters Parameter Description VOH Voltage output high Minimum value Typical value Maximum value Unit VDD*0.8 - - V 3.3 TX and RX power consumption Average value Peak value (Typical value) Operating status Mode Rate Transmit power/receive Transmit - 250 Kbps +0 dBm 4.7 22.91 mA Transmit - 250 Kbps +10 dBm 9.25 38.78 mA Receive - 250 Kbps Constantly 7.35 receive 7.61 mA 3.
3 Electrical parameters Operating mode Deep sleep Operating status, Ta = 25°C Deep sleep mode, reserve 32-KB SRAM Average value Maximum value (Typical value) Unit 2.
4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Operating frequency 2.405 to 2.480 GHz Zigbee standard IEEE 802.15.4 Data transmission rate 250 Kbps Antenna type PCB antenna with a gain of 2 dBi 4.2 TX performance TX performance Minimum value Typical value Maximum value Unit Maximum output power (250Kbps) - 10 - dBm Minimum output power (250Kbps) - -25 1 dBm Output power adjustment stepping - 0.
4 RF parameters 4.
5 Module power-on timing requirements 5 Module power-on timing requirements The Z2 chip has requirements on the power-on sequence. During the power-on process, the system starts when the RST pin reaches 1.62V. At this time, the VCC needs to reach more than 1.8V within 10ms. Because the RST pin has the RC link, the VCC of the bare module is much more than 1.8V when the RST reaches 1.62V.
5 Module power-on timing requirements below 0.6V, the module will probably crash when it is restarted. It is required that the power supply pin VCC_3.3V of the module needs to be connected with a dummy load of 1K to release power quickly. You can refer to the following figure which shows parts of power-driven links. As the voltage backflow occurs when interfaces of the module are connected to others, you can pull down the CEN or RST pin, to reduce the power consumption when the module doesn’t work.
6 Antenna information 6 Antenna information 6.1 Antenna type ZT2S uses the PCB antenna with a gain of 2 dBi. 6.2 Antenna interference reduction To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials wrap around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna.
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7 Packaging information and production instructions 7 Packaging information and production instructions 7.
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7 Packaging information and production instructions 7.2 Recommended footprint 7.3 Production instructions 1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours). 2.
7 Packaging information and production instructions • Cabinet oven • Anti-electrostatic and heat-resistant trays • Anti-electrostatic and heat-resistant gloves 4. The module needs to be baked in the following cases: • • • • • The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking.
7 Packaging information and production instructions Recommended soldering temperature: Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 °C Soldering temperature 360±20°C Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260±5°C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 23 / 29
7 Packaging information and production instructions 7.5 Storage conditions Storage conditions for a delivered module: • The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%. • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. • There is a humidity indicator card (HIC) in the packaging bag.
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8 MOQ and packaging information 8 MOQ and packaging information Product model MOQ (pcs) Packing method ZT2S 4400 Tape reel 26 / 29 Modules per reel Reels per carton 1100 4
9 Appendix: Statement 9 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
9 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
9 Appendix: Statement the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
