CB3SE Module Datasheet Version: 20210611 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 3 2 Module interfaces 2.1 Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 Definitions on test points . . . . . . . . . .
Contents 8 Appendix: Statement 26 ii
Contents CB3SE is an embedded low-power Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB3SE not only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE.
1 PRODUCT OVERVIEW 1 Product overview CB3SE is built in with a 32-bit MCU whose running speed can be up to 120 MHz, 2-MB flash memory, and 256-KB RAM, so as to support the Tuya IoT cloud connection. The MCU instructions specially extended for signal processing can effectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM and UART. There are six 32-bit PWM outputs, making the chip very suitable for high-quality LED control. 1.
2 • • • • • MODULE INTERFACES Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 06/10/2021 This is the first release. V1.0.0 2 Module interfaces 2.1 Dimensions and footprint The dimensions of CB3SE are 16.00±0.35 mm (W)×24.00±0.35 mm (L) ×2.8±0.15 mm (H).
2 MODULE INTERFACES 2.2 Pin definition Pin number Symbol I/O type Function 1 NC I Directly connected to Pin 3.
2 MODULE INTERFACES Pin number Symbol I/O type Function 2 ADC3 AI ADC pin, which corresponds to P23 of the IC 3 CEN I Enabling pin, which is pulled high internally to be compatible with other modules 4 P14 I/O A common GPIO interface, which corresponds to P14 of the IC 5 P26 I/O GPIOP_26, which corresponds to P26 of the IC, PWM 5 6 P24 I/O GPIOP_24, which corresponds to P24 of the IC, PWM 4 7 P6 I/O GPIOP_6，which corresponds to P6 of the IC, PWM 0 8 3V3 P Power supply pin (3
2 MODULE INTERFACES Pin number Symbol I/O type Function 11 GND P Power supply reference ground 12 P20 I/O GPIOP_20, which corresponds to P20 of the IC 13 P17 I/O GPIOP_17, which corresponds to P17 of the IC 14 P16 I/O GPIOP_16, which corresponds to P16 of the IC 15 GND P Power supply reference ground 16 P9 I/O GPIOP_9, which corresponds to P9 of the IC, PWM 3 17 TXD2 I/O UART2_TXD (used to display the module internal information), which corresponds to P0 of the IC 18 RXD2
2 MODULE INTERFACES Pin number Symbol I/O type Function 20 P7 I/O GPIOP_7, which corresponds to P7 of the IC, PWM 1 21 RXD1 I/O UART1_RXD (User serial port), which corresponds to P10 of the IC Do not pull it up. By default, the docking serial port of the MCU needs to be in low level state or high impedance state. 22 TXD1 I/O UART1_TXD (User serial port), which corresponds to P11 of the IC Do not pull it up.
3 ELECTRICAL PARAMETERS Pin number Symbol I/O type Function - CSN I/O It’s a mode selection pin. If it is connected to ground before being powered on, enter the firmware test mode. If it is not connected or connected to VCC before being powered on, enter the firmware application mode. Correspond to P21 of the IC Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin. For the MCU solution, please refer to CBx Module. 3 Electrical parameters 3.
3 ELECTRICAL PARAMETERS Parameter Description Minimum value Maximum value Unit ESD voltage (human body model) TAMB-25℃ -4 4 KV ESD voltage (machine model) TAMB-25℃ -200 200 V 3.2 Normal working conditions Minimum value Typical value Maximum value Unit Parameter Description Ta Working temperature -40 - 85 ℃ VBAT Power supply voltage 3 3.3 3.6 V VOL I/O low level output VSS - VSS+0.3 V VOH I/O high level output VBAT-0.
3 ELECTRICAL PARAMETERS Average value Peak value (Typical value) Working status Mode Rate Transmit power/ Receive Transmit 11b 11Mbps +16dBm 81 240 mA Transmit 11g 54Mbps +15dBm 82 238 mA Transmit 11n MCS7 +14dBm 85 234 mA Receive 11b 11Mbps Constantly 73 receive 82 mA Receive 11g 54Mbps Constantly 75 receive 82 mA Receive 11n MCS7 Constantly 75 receive 82 mA 3.
3 ELECTRICAL PARAMETERS Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit Quick network connection state (EZ) The module is in fast network connection state and the Wi-Fi indicator flashes fast 78 246 mA Connected The module is connected to the network and the Wi-Fi indicator is always on 25 342 mA Weakly connected The module and the hotspot are weakly connected and the Wi-Fi indicator is always on 205 350 mA Disconnected The module is disconnected
4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.412 to 2.484 GHz Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14) Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7; 11n: HT40 MCS 0 to 7 Antenna type PCB antenna 4.2 Wi-Fi transmission performance Typical value Maximum value Unit Average RF output power, 802.11b CCK Mode 11M 16 - dBm Average RF output power, 802.
4 Typical value Maximum value Unit Average RF output power, 802.11n OFDM Mode MCS7 14 - dBm Frequency error - 20 ppm Minimum value Typical value Maximum value Unit - -88 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 54M -74 - dBm PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 -73 - dBm PER<10%, RX sensitivity, Bluetooth LE 1M -96 - dBm Parameter Minimum value RF PARAMETERS -20 4.3 Wi-Fi receiving performance Parameter PER<8%, RX sensitivity, 802.
5 ANTENNA INFORMATION 4.4 Bluetooth transmission performance Minimum value Typical value Maximum value Unit Working frequency 2402 - 2480 MHz Air rate - 1 - Mbps Transmit power -20 6 20 dBm Frequency error -150 - 150 KHz Unit Parameter 4.
5 ANTENNA INFORMATION 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
5 16 / 28 ANTENNA INFORMATION
5 17 / 28 ANTENNA INFORMATION
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 19 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 20 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 21 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 Production instructions 1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • More than 12 months has passed since the sealing of the bag. 4.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • A: Temperature axis • B: Time axis • C: Liquidus temperature: 217 to 220°C • D: Ramp-up slope: 1 to 3°C/s • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C • F: Duration above the liquidus: 50 to 70s • G: Peak temperature: 235 to 245°C • H: Ramp-down slope: 1 to 4°C/s Note: The above curve is just an example of the solder paste SAC305.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
8 APPENDIX: STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method CB3SE 3600 Tape reel The number of modules per reel The number of reels per carton 900 4 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX: STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX: STATEMENT of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
