CB3S Module Datasheet Version: 20210506 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 3 2 Module interfaces 2.1 Dimensions and package 3 3 . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical parameters 3.1 Absolute electrical parameters 3.2 Normal working conditions . . 3.3 RF power consumption . . .
Contents CB3S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB3S not only supports the Wi-Fi AP and STA modes but also supports the Bluetooth LE.
1 PRODUCT OVERVIEW 1 Product overview CB3S is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a 2-MB flash memory, and a 256-KB RAM, to support the Tuya cloud connection. The MCU instructions specially extended for signal processing can effectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM and UART. There are 5 channels of 32-bit PWM output, making the chip very suitable for high-quality LED control. 1.
2 MODULE INTERFACES • • • • • Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 04/15/2021 This is the first release. V1.0.0 2 Module interfaces 2.1 Dimensions and package The dimensions of CB3S are 16.00±0.35 mm (W)×24.00±0.35 mm (L) ×2.8±0.15 mm (H).
2 MODULE INTERFACES Pin number Symbol I/O type Function 1 RST I Low-level reset, high level active (the pin has been pulled high internally), correspond to CEN of the IC 2 ADC3 AI ADC pin, which corresponds to P23 of the IC 4 / 27
2 MODULE INTERFACES Pin number Symbol I/O type Function 3 CEN I Enabling pin, which is pulled high internally to be compatible with other modules 4 P14 I/O A common GPIO interface, which corresponds to P14 of the IC 5 P26 I/O GPIOP_26, which corresponds to P26 of the IC, PWM 5 6 P24 I/O GPIOP_24, which corresponds to P24 of the IC, PWM 4 7 P6 I/O 8 VCC P Power supply pin (3.
2 MODULE INTERFACES Pin number Symbol I/O type Function 11 TXD2 I/O UART2_TXD (used to display the module internal information), which corresponds to P0 of the IC 12 CSN I/O Production test control pin. Not recommended for use. High level by default. Not allowed to pull down before power on.
2 MODULE INTERFACES Pin number Symbol I/O type Function 17 ADC3 AI ADC pin, which corresponds to P23 of the IC 18 P22 I/O GPIOP_22, which corresponds to P22 of the IC 19 CSN I/O Production test control pin. Not recommended for use. High level by default. Not allowed to pull down before power on. 20 P20 I/O GPIOP_20, which corresponds to P20 of the IC 21 NC 22 NC Note: P indicates a power supply pin and I/O indicates an input/output pin.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -55 125 ℃ VBAT Power supply voltage -0.3 3.9 V Static electricity discharge voltage (human body model) TAMB-25℃ -4 4 KV Static electricity discharge voltage (machine model) TAMB-25℃ -200 200 V 3.
3 ELECTRICAL PARAMETERS Minimum value Typical value Maximum value Unit Parameter Description VOL I/O low level output VSS - VSS+0.3 V VOH I/O high level output VBAT-0. 3 - VBAT V Imax I/O drive current - 6 20 mA 3.
3 ELECTRICAL PARAMETERS Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit Quick network connection state (Bluetooth) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 63 245 mA Quick network connection state (AP) The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly 80 270 mA Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indi
4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.412 to 2.484 GHzIEEE 802.11 Standard b/g/n (channels 1 to 14) Bluetooth LE 5.1 11b: 1, 2, 5.5, 11 (Mbps); Datatransmissionrate 11g: 6, 9, 12, 18, 24, 36, 48, 54(Mbps） 11n:HT20/HT40 MCS 0 to 7; Bluetooth LE：1Mbps Antenna type onboard PCB antenna 4.2 Wi-Fi transmission performance Typical value Maximum value Unit Average RF output power, 802.
4 RF PARAMETERS Typical value Maximum value Unit Average RF output power, 802.11n OFDM Mode MCS7 14 - dBm Frequency error - 20 ppm Minimum value Typical value Maximum value Unit - -88 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 54M -74 - dBm PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 -73 - dBm PER<10%, RX sensitivity, Bluetooth LE 1M -96 - dBm Parameter Minimum value -20 4.3 Wi-Fi receiving performance Parameter PER<8%, RX sensitivity, 802.
5 ANTENNA INFORMATION 4.4 Bluetooth transmission performance Minimum value Typical value Maximum value Unit Working frequency 2402 - 2480 MHz Air rate - 1 - Mbps Transmit power -20 6 20 dBm Frequency error -150 - 150 KHz Unit Parameter 4.
5 ANTENNA INFORMATION 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 Production instructions 1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • More than 12 months have passed since the sealing of the bag. 4.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • A: Temperature axis • B: Time axis • C: Liquidus temperature: 217 to 220°C • D: Ramp-up slope: 1 to 3°C/s • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C • F: Duration above the liquidus: 50 to 70s • G: Peak temperature: 235 to 245°C • H: Ramp-down slope: 1 to 4°C/s Note: The above curve is just an example of the solder paste SAC305.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
8 APPENDIX-STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Packaging method CB3S 3600 Tape reel Qty of modules per reel Qty of reels per carton 900 4 8 Appendix-Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX-STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX-STATEMENT tive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
