CB3L Module Datasheet Version: 20210507 Online Version
Contents Contents 1 Product overview 2 1.1 Features................................................................................................... 2 1.2 Applications......................................................................................................... 3 2 Module interfaces 4 2.1 Dimensions and package............................................................................. 4 2.2 Pin definition........................................................................................
Contents 7 MOQ and packaging information 23 8 Appendix-Statement 23 ii
Contents CB3L is an embedded low-power Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB3L not only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE.
1 PRODUCT OVERVIEW 1 Product overview CB3L is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a 2-MB flash memory, and a 256-KB RAM, so as to support the Tuya cloud connection. The MCU instructions specially extended for signal processing can effectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM, UART and SPI. There are six 32-bit PWM outputs, making the chip very suitable for highquality LED control. 1.
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2 MODULE INTERFACES 2 Module interfaces 2.1 Dimensions and package CB3L has two rows of pins with a spacing of 2±0.1 mm. The CB3L dimensions are 16±0.35 mm (W)×24±0.35 mm (L) ×2.8±0.15 mm (H). 2.
2 MODULE INTERFACES Pin number Symbol I/O type Function 3 EN I Enabling pin, the module has been pulled up 4 P14 I/O General I/O pin 5 P26 I/O Support hardware PWM and correspond to P26 on the internal IC 6 P24 I/O Support hardware PWM and correspond to P24 on the internal IC 7 P6 I/O Support hardware PWM and correspond to P6 on the internal IC 8 VCC P Power supply pin (3.
2 MODULE INTERFACES Pin number Symbol I/O type Function 12 CSN I/O It is not recommended for customers. If you need to use it, make sure that the level of the CSN pin remains high before powering on. The pin corresponds to P21 of the IC.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -55 125 ℃ VBAT Power supply voltage -0.3 3.9 V Static electricity discharge voltage (human body model) TAMB-25℃ -4 4 KV Static electricity discharge voltage (machine model) TAMB-25℃ -200 200 V 3.
3 ELECTRICAL PARAMETERS Minimum value Typical value Maximum value Unit Parameter Description VOL I/O low level output VSS - VSS+0.3 V VOH I/O high level output VBAT-0. 3 - VBAT V Imax I/O drive current - 6 20 mA 3.
3 Working mode Working status, Ta = 25°C ELECTRICAL PARAMETERS Average value Maximum value (Typical value) Unit Quick network connection state (Bluetooth ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 70 270 mA Quick network connection state (AP) The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly 80 305 mA Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi in
4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.412 to 2.484 GHz Standard Bluetooth LE 5.1 IEEE 802.11 b/g/n (channels 1 to 14) Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7; 11n: HT40 MCS 0 to 7 Bluetooth LE ：1Mbps Antenna type onboard PCB antenna 4.2 Wi-Fi transmission performance Typical value Maximum value Unit Average RF output power, 802.
4 Minimum value Average RF output power, 802.11n OFDM Mode MCS7 Frequency error RF PARAMETERS Typical value Maximum value Unit - 14 - dBm -20 - 20 ppm Minimum value Typical value Maximum value Unit PER<8%, RX sensitivity, 802.11b DSSS Mode 11M - -88 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -74 - dBm PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -72 - dBm PER<10%, RX sensitivity, Bluetooth 1M - -93 - dBm Parameter 4.
5 ANTENNA INFORMATION 4.4 Bluetooth transmission performance Minimum value Typical value Maximum value Unit Working frequency 2402 - 2480 MHz Air rate - 1 - Mbps Transmit power -20 6 20 dBm Frequency error -150 - 150 KHz Unit Parameter 4.
5 ANTENNA INFORMATION 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions The PCB dimensions are 16±0.35 mm (W)×24±0.35 mm (L) ×0.8±0.1 mm (H).
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.3 The schematic diagram of packaging 6.4 The diagram of PCB packaging-pin header CB3L can be packaged with the SMT or pin header.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.5 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours.
6 – – – – PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire and flux Thermal profiler • Baking devices: – Cabinet oven – Anti-electrostatic and heat-resistant trays – Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module: • The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than90%.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. • If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • A: Temperature axis • B: Time axis • C: Liquidus temperature: 217 to 220°C • D: Ramp-up slope: 1 to 3°C/s • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C • F: Duration above the liquidus: 50 to 70s • G: Peak temperature: 235 to 245°C • H: Ramp-down slope: 1 to 4°C/s Note: The above curve is just an example of the solder paste SAC305.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS {width=100%} Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 °C Soldering temperature 360±20°C Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260±5°C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 21 / 25
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
8 APPENDIX-STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method CB3L 3600 Tape reel The number of modules per reel The number of reels per carton 900 4 8 Appendix-Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX-STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX-STATEMENT of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
