BTU Module Datasheet Version: 20210525 Online Version
Contents Contents 1 Product overview 2 1.1 Features ................................................................................................2 1.2 Applications ....................................................................................... 2 1.3 Change history ................................................................................... 2 2 Module interfaces 3 2.1 Dimensions and package .................................................................... 3 2.2 Pin definition ..........
Contents BTU is a low-power embedded Bluetooth module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250), a few peripheral circuits, an embedded Bluetooth network communication protocol stack, and rich library functions.
1 PRODUCT OVERVIEW 1 Product overview BTU consists of a low-power 32-bit MCU, a Bluetooth LE 5.0/2.4G radio-frequency band, 4-Mbit/s flash memory, and 48-KB SRAM. 1.1 Features • Embedded with a low-power 32-bit MCU, which can also function as an application processor. – The clock rate: 48 MHz • Working voltage: 1.8 to 3.6 V. If the voltage is between 1.8 and 2.7 V, the module can start, but the optimal RF performance cannot be ensured. If the voltage is between 2.8 and 3.
2 MODULE INTERFACES Update date Updated content Version after update May 7, 2021 This is the first release. V1.0.0 2 Module interfaces 2.1 Dimensions and package BTU has 3 rows of pins with the spacing of 1.4±0.1 mm. The dimensions of the BTU are 20.3±0.35 mm (L)×15.8±0.35 mm (W) ×3.0±0.15 mm (H). The dimensions of BTU are as follows: 2.
2 MODULE INTERFACES Pin number Symbol I/O type Function 1 D3 I/O Common I/O pin, which corresponds to D3 (Pin 32) on the internal IC 2 D7 I/O Common I/O pin, which corresponds to D7 (Pin 2) on the internal IC 3 C0 I/O Common I/O pin, which corresponds to C0 (Pin 20) on the internal IC 4 SWS I/O Burning pin, which corresponds to SWS (Pin 5) on the internal IC 5 B6 I ADC pin, which corresponds to B6 (Pin 16) on the internal IC 6 A0 I/O Common I/O pin, which corresponds to A0 (Pin
2 MODULE INTERFACES Pin number Symbol I/O type Function 7 A1 I/O Common I/O pin, which corresponds to A1 (Pin 4) on the internal IC 8 C2 I/O Support hardware PWM and correspond to C2 (Pin 22) on the internal IC 9 C3 I/O Support hardware PWM and correspond to C3 (Pin 23) on the internal IC 10 D2 I/O Support hardware PWM and correspond to D2 (Pin 31) on the internal IC 11 B4 I/O Support hardware PWM and correspond to B4 (Pin 14) on the internal IC 12 B5 I/O Support hardware PWM an
2 MODULE INTERFACES Pin number Symbol I/O type Function 14 VCC P Power supply pin (3.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -65 150 ℃ VCC Power supply voltage -0.3 3.9 V Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV 3.
3 ELECTRICAL PARAMETERS Minimum value Typical value Maximum value Unit Parameter Description VIL I/O low-level input VSS - VCC*0.3 V VIH I/O high-level input VCC*0.7 - VCC V VOL I/O low-level output VSS - VCC*0.1 V VOH I/O high-level output VCC*0.9 - VCC V 3.3 Power consumption in working mode Maximum value (typical value) Unit Symbol Conditions I tx Constantly transmit, the output power of 11.5 dBm 22.6 mA I rx Constantly receive 6.
4 Symbol Conditions IIdeepsleep2 Deep sleep mode (not reserve RAM) RF PARAMETERS Maximum value (typical value) Unit 0.4 μA 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2400 - 2483.5 MHz Wireless standard Bluetooth LE 4.2/5.0 Data transmission rate 1 Mbps/2 Mbps Antenna type Onboard PCB antenna 4.2 RF output power Minimum value Average RF output power Bandwidth of 20-dB modulation Parameter Typical value Maximum value Unit -21 10 11.
5 Minimum value RX sensitivity 1 Mbps ANTENNA INFORMATION Typical value Maximum value Unit - -94.5 - dBm Frequency offset error 1 Mbps -250 - +300 KHz Co-channel interference suppression - - -10 dB Parameter 5 Antenna information 5.1 Antenna type BTU uses the onboard PCB antenna with a gain of 1.1 dBi. 5.2 Antenna interference reduction To ensure the RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions The dimensions of the PCB are 20.3±0.35 mm (L)×15.8±0.35 mm (W) ×1.0±0.1 mm (H).
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.3.1 Diagram of PCB package-SMT 6.4 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 3. The module needs to be baked in the following cases: • • • • • The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months has passed since sealing of the bag. 4.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Set oven temperatures according to the following curve. • A: Temperature axis • B: Time axis • C: Liquidus temperature: 217 to 220° C • D: Ramp-up slope: 1 to 3° C/s • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200° C • F: Duration above the liquidus: 50 to 70s • G: Peak temperature: 235 to 245° C • H: Ramp-down slope: 1 to 4° C/s Note: The above curve is just an example of the solder paste SAC305.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS {width=100%} Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 ° C Soldering temperature 360±20° C Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260±5° C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 18 / 22
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
8 APPENDIX: STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method BTU 4400 Tape reel The number of modules per reel The number of reels per carton 1100 4 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX: STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX: STATEMENT of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
