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BT3L-A Datasheet

1 Product Overview

BT3L-A is an embedded Bluetooth Low Energy (BLE) module that Tuya has developed. It

consists of a highly integrated Bluetooth chip (TLSR8250F512AT32) and several

peripheral circuits, with an embedded Bluetooth network protocol stack and robust library

functions. BT3L-A also contains a low-power 32-bit multipoint control unit (MCU), BLE 5.0

or 2.4 GHz radio, 4 MB flash memory, 48 KB static random-access memory (SRAM), and

nine multiplexing I/O pins.

1.1 Features

 Embedded low-power 32-bit MCU, which can also function as an application

processor

 Clock rate: 48 MHz



Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF

performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is

normal.)

 Peripherals: nine pulse width modulation (PWM) pins

 BLE RF features



Compatible with BLE 5.0

 Up to 2 Mbit/s RF data rate

 TX power: +10 dBm



RX sensitivity: –94.5 dBm at BLE 1 Mbit/s

 Embedded Advanced Encryption Standard (AES) hardware encryption

 Onboard PCB antenna

 Working temperature: –20°C to +105°C

Tuya BT3L-A BLE Module

Version: 1.0.0

Date: 2019-10-24

No.: 0000000001

Product

Manual

Global Intelligent Platform

Summary of content (19 pages)

PAGE 1
Global Intelligent Platform Product Manual BT3L-A Datasheet Tuya BT3L-A BLE Module Version: 1.0.0 Date: 2019-10-24 No.: 0000000001 1 Product Overview BT3L-A is an embedded Bluetooth Low Energy (BLE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512AT32) and several peripheral circuits, with an embedded Bluetooth network protocol stack and robust library functions. BT3L-A also contains a low-power 32-bit multipoint control unit (MCU), BLE 5.0 or 2.
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BT3L-A Datasheet 1.
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BT3L-A Datasheet Change History No. 1 Date 2019-10-24 Change Description This is the first release. 3 Version After Change 1.0.
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BT3L-A Datasheet Contents 1 2 3 4 5 6 Product Overview.....................................................................................................................1 1.1 Features.........................................................................................................................1 1.2 Applications...................................................................................................................2 Module Interfaces...........................................
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BT3L-A Datasheet Figures Figure 2-1 BT3L-A front and rear views............................................................................... 6 Figure 6-1 BT3L-A mechanical dimensions and rear solder pad dimensions.............13 Figure 6-2 HIC for BT3L-A................................................................................................... 14 Figure 6-3 Oven temperature curve...................................................................................
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BT3L-A Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint BT3L-A has two rows of pins with a 2 mm pin spacing. The BT3L-A dimensions (H x W x D) are 3.3±0.15 mm x 16±0.35 mm x 24±0.35 mm. The PCB thickness is 0.8±0.1 mm. Figure 2-1 shows the BT3L-A front and rear views. Figure 2-1 BT3L-A front and rear views 2.2 Interface Pin Definition Table 2-1 BT3L-A interface pins Pin No.
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BT3L-A Datasheet Pin No.
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BT3L-A Datasheet Note: 1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. 2. If you have special requirements for light colors controlled by PWM outputs, contact Tuya business personnel.
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BT3L-A Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Value Maximum Value Unit Ts Storage temperature –65 150 °C VCC Power supply voltage –0.3 3.9 V Static electricity voltage (human body model) Tamb = 25°C N/A 2 kV Static electricity voltage (machine model) Tamb = 25°C N/A 0.5 kV 3.
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BT3L-A Datasheet 3.3 Power Consumption Table 3-3 Power consumption in different working modes Symbol Description Typical Value Unit Itx Constant transmission, 0 dBm output power 6.6 mA Irx Constant receiving 6.3 mA IDC Connected to a mesh network 7.3 mA Ideepsleep1 Deep sleep mode 1 (16 KB RAM is reserved.) 1.2 μA Ideepsleep2 Deep sleep mode 2 (No RAM is reserved.) 0.
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BT3L-A Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.4 GHz ISM band Wireless standard BLE 4.2 or 5.0 Data transmission rate 1 Mbit/s or 2 Mbit/s Antenna type Onboard PCB antenna 4.2 RF TX Power Table 4-2 Power during constant transmission Parameter Minimum Value Typical Value Maximum Value Average RF output power –22 10 10.
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BT3L-A Datasheet 4.3 RF RX Sensitivity Table 4-3 RX sensitivity Minimum Value Typical Value Maximum Value 1 Mbit/s N/A –94.5 N/A 2 Mbit/s N/A –91 N/A 1 Mbit/s –250 N/A +300 2 Mbit/s –300 N/A +200 N/A N/A –10 N/A Parameter RX sensitivity Frequency offset error Co-channel interference suppression Unit dB m kHz dB 5 Antenna Information 5.1 Antenna Type BT3L-A uses an onboard PCB antenna. 5.
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BT3L-A Datasheet 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions and Rear Solder Pad Dimensions Figure 6-1 BT3L-A mechanical dimensions and rear solder pad dimensions Note: The default dimensional tolerance is ±0.35 mm, and the tolerance for some measurements is ±0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.2 Production Instructions 1.
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BT3L-A Datasheet ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows: (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
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BT3L-A Datasheet (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur.
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BT3L-A Datasheet 6.
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BT3L-A Datasheet 7 MOQ and Packing Information MOQ and packing information Product Model BT3L-A MOQ 3600 Packing Method Carrier tape and reel packing Number of Number of Reel Modules in Each Packs in Each Box Reel Pack 900 4 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
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BT3L-A Datasheet interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.
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BT3L-A Datasheet Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this Bluetooth module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.