AXY2S Module Datasheet Version: 20211102 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 2 Module interfaces 2.1 Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 5 3 Electrical parameters 3.1 Absolute electrical parameters . . 3.2 Working conditions . . . . . . . . 3.
Contents AXY2S is a low-power-consumption embedded Wi-Fi 6+Bluetooth module that Tuya has developed. Embedded with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated wireless RF chip (ECR6600-TS2D).
1 Product overview 1 Product overview With a maximum clock rate of 240 MHz, AXY2S also contains a low-powerconsumption Andes D10 MCU, a WLAN MAC, a 1T1R WLAN, a 292-KB SRAM, a 2-MB flash memory, and extensive peripherals. AXY2S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required. 1.
2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint AXY2S has 2 lines of pins with a spacing of 2mm. The AXY2S dimensions are 15±0.35 mm (W)×17.91±0.35 mm (L) ×2.9±0.15 mm (H).
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2 Module interfaces 2.
2 Module interfaces Pin number Symbol Type Function 1 VBAT P Power supply pin (3.3V) 2 P25 I/O GPIO_25, hardware PWM, correspond to Pin 7 of the IC 3 GND P Power supply reference ground 4 P24 I/O GPIO_24, hardware PWM, correspond to Pin 8 of the IC 5 RX I/O GPIO_5, UART0_RXD (user serial interface) 6 P22 I/O GPIO_22, hardware PWM, Pin 4 of the IC 7 TX I/O GPIO_6, UART0_TXD (user serial interface) 8 ADC AI GPIO_20, common GPIO, which can be used as ADC.
2 Module interfaces Pin number Symbol Type Function 10 RST I/O Reset pin, reset at a low level. The module has been pulled to a high level and the user can control the pin externally. 11 P14 I/O GPIO_14, hardware PWM, correspond to Pin 29 of the IC Note: P indicates a power supply pin and I/O indicates an input/output pin.
3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -40 125 ℃ VDD Power supply voltage -0.3 3.6 V ESD voltage (human body model) TAMB-25℃ - 2 KV ESD voltage (machine model) TAMB-25℃ - 0.5 KV 3.2 Working conditions Minimum value Typical value Maximum value Unit Parameter Description Ta Operating temperature -40 - 85 ℃ VDD Operating voltage 3.0 - 3.
3 Electrical parameters Minimum value Typical value Maximum value Unit Parameter Description VOH Voltage output high 0.9vdd - - V Imax Drive current - 4 - mA Cpad Input pin capacitance - 2 - pF Peak value (Typical value) Unit 3.
3 Electrical parameters RX power consumption: Symbol Mode Average value Peak value (Typical value) IRF 11B 1M 32 32 mA IRF 11B 11M 32 32 mA IRF 11G 6M 33 33 mA IRF 11G 54M 34 34 mA IRF 11N HT20 MCS0 33 33 mA IRF 11N HT20 MCS7 34 34 mA IRF 11N HT40 MCS0 37 37 mA IRF 11N HT40 MCS7 38 38 mA IRF 11AX HT20 MCS0 32 32 mA IRF 11AX HT20 MCS7 32 32 mA Average value Peak value (Typical value) Unit 40 210 mA Unit 3.
3 Electrical parameters Working mode Working status, TA = 25°C Average value Peak value (Typical value) Unit Fast network configuration (EZ) The module is in fast network configuration state and the Wi-Fi indicator flashes fast 40 197 mA Fast network configuration (Bluetooth) The module is in fast network configuration state and the Wi-Fi indicator flashes fast 41 184 mA No operation during network connection The module is connected to the network and the Wi-Fi indicator is always on 34 5
4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Frequency range 2.400 to 2.4835 GHz Wi-Fi standard IEEE 802.11b/g/n/ax (channels 1 to 14) Bluetooth standard Bluetooth 5.1 Data transmission rate 11b: 1, 2, 5.5, and 11 (Mbps) Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) Data transmission rate 11n: HT20 MCS0 to 7 Data transmission rate 11n: HT40 MCS0 to 7 Data transmission rate 11ax: HE20 MCS0 to 7 Antenna type PCB antenna with a gain of 1.
4 RF parameters Minimum value Typical value Maximum value Unit Average RF output power, 802.11g OFDM Mode 54M - 15 - dBm Average RF output power, 802.11n HT20 OFDM Mode MCS0 - 17 - dBm Average RF output power, 802.11n HT20 OFDM Mode MCS7 - 14 - dBm Average RF output power, 802.11n HT40 OFDM Mode MCS0 - 15 - dBm Average RF output power, 802.11n HT40 OFDM Mode MCS7 - 13 - dBm - 17 - dBm Parameter Average RF output power, 802.
4 RF parameters Minimum value Typical value Maximum value Unit Average RF output power, 802.11ax HE20 OFDMA Mode MCS7 - 14 - dBm Average RF output power, Bluetooth 5.1 2M - 7 - dBm Frequency error -20 - 20 ppm EVM@802.11b CCK 11Mbps Mode 17dBm - - -10 dB EVM@802.11g OFDM 54Mbps Mode 15dBm - - -29 dB EVM@802.11n HT20 OFDM MCS7 Mode 14dBm - - -30 dB EVM@802.11n HT40 OFDM MCS7 Mode 13dBm - - -30 dB EVM@802.
4 RF parameters Minimum value Typical value Maximum value Unit PER<8%，RX sensitivity, 802.11b CCK Mode 1M - -95 - dBm PER<8%，RX sensitivity, 802.11b CCK Mode 11M - -86 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 6M - -90 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -74 - dBm PER<10%，RX sensitivity, 802.11n HT20 OFDM Mode MCS0 - -90 - dBm PER<10%，RX sensitivity, 802.11n HT20 OFDM Mode MCS7 - -71 - dBm PER<10%，RX sensitivity, 802.
4 RF parameters Minimum value Typical value Maximum value Unit PER<10%，RX sensitivity, 802.11n HT40 OFDM Mode MCS7 - -68 - dBm PER<10%, RX sensitivity, 802.11ax OFDMA Mode MCS0 - -90 - dBm PER<10%, RX sensitivity, 802.11ax OFDMA Mode MCS7 - -70 - dBm PER<10%, RX sensitivity, Bluetooth 5.1 1M - -93 - dBm PER<10%, RX sensitivity, Bluetooth 5.
5 Antenna information 5 Antenna information 5.1 Antenna type AXY2S uses only the onboard PCB antenna with a gain of 1.97 dBi. 5.2 Antenna interference reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions The mechanical dimensions of the PCB of AXY2S are 15±0.35 mm (W)×17.91±0.35 mm (L) ×0.8±0.1 mm (H).
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6 Packaging information and production instructions Note: The default dimensional tolerance is ±0.35 mm. If customers have specific requirements on dimensions, they should make them clear in the module datasheet after communication. 6.
6 Packaging information and production instructions PCB footprint of AXY2S: 22 / 32
6 Packaging information and production instructions 6.3 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours.
6 Packaging information and production instructions – Automated optical inspection (AOI) equipment • (Wave soldering process) Wave soldering devices – – – – – Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire and flux Thermal profiler • Baking devices: – Cabinet oven – Anti-electrostatic and heat-resistant trays – Anti-electrostatic and heat-resistant gloves 2.
6 Packaging information and production instructions • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. • If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time.
6 Packaging information and production instructions • A: Temperature axis • B: Time axis • C: Liquidus temperature: 217 to 220°C • D: Ramp-up slope: 1 to 3°C/s • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C • F: Duration above the liquidus: 50 to 70s • G: Peak temperature: 235 to 245°C • H: Ramp-down slope: 1 to 4°C/s Note: The above curve is just an example of the solder paste SAC305.
6 Packaging information and production instructions Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 °C Soldering temperature 360±20°C Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260±5°C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 27 / 32
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7 MOQ and packaging information 7 MOQ and packaging information Product model MOQ (pcs) Packaging method AXY2S 4400 Tape reel 29 / 32 The number of modules per reel The number of reels per carton 1100 4
8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
8 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
8 Appendix: Statement This product must not be disposed of as normal household waste, by the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm.
