BF8H-N Module Datasheet Version: 20220303 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 2 2 Module interfaces 2.1 Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 4 3 Electrical parameters 11 3.
Contents BF8H-N is a low-power embedded Bluetooth audio module that Tuya has developed. It mainly consists of a highly integrated Bluetooth chip (FR8018HA) and a few peripheral circuits with the Bluetooth communication protocol stack and rich library functions inside.
1 Product overview 1 Product overview BF8H-N includes an ARM Cortex M3 32-bit processor, a Bluetooth LE 5.0/2.4G radio, a 512-KB flash memory, a 48-KB SRAM, 30 reusable I/O ports, charging management for a lithium battery, and a 16-bit single-channel audio CODEC. 1.1 Features • 32-bit processor with the ARM Cortex M3 inside • Operating voltage: 1.8 to 4.3V. If the voltage is between 1.8 and 2.4V, the module can start, but the optimal RF performance cannot be ensured. If the voltage is between 2.5 and 3.
2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint The dimensions of BF8H-N are 25±0.35 mm (L)×18±0.35 mm (W) ×2.8±0.15 mm (H). The thickness of the PCB is 0.8±0.
2 Module interfaces 2.
2 Module interfaces Pin number Symbol Pin type Function 3 PA6 I/O Common I/O interface, which corresponds to Pin 6 of the IC 4 PA7 I/O Common I/O interface, which corresponds to Pin 5 of the IC 5 PB4 I/O Common I/O interface, which corresponds to Pin 42 of the IC 6 PB6 I/O Common I/O interface, which corresponds to Pin 43 of the IC 7 PB7 I/O Common I/O interface, which corresponds to Pin 44 of the IC 8 PD0 I/O Common I/O interface, which corresponds to Pin 41 of the IC 9 PD1 I
2 Module interfaces Pin number Symbol Pin type Function 11 PD3 I/O Common I/O interface, which corresponds to Pin 38of the IC 12 RX0 I/O Serial port UART0_RX, which can also be used a common I/O interface and corresponds to Pin 4 of the IC chip 13 TX0 I/O Serial port UART0_TX, which can also be used a common I/O interface and corresponds to Pin 3 of the IC chip. It can used to output logs. 14 BIAS AO MIC_BIAS, power supply for microphone, correspond to Pin 13 of the IC.
2 Module interfaces Pin number Symbol Pin type Function 16 AO-P AO AOUT_P, audio differential output (positive), correspond to Pin 16 of the IC 17 AO-N AO AOUT_N, audio differential output (negative), correspond to Pin 17 of the IC 18 RST AI Hardware reset pin (high active), correspond to Pin 18 of the IC 19 VCHG P Charger, pin for charging, which corresponds to Pin 19 of the IC.
2 Module interfaces Pin number Symbol Pin type Function 22 PD6 I/O Common I/O interface, which corresponds to P 27 of the IC 23 PD7 I/O Common I/O interface, which corresponds to Pin 26 of the IC 24 GND P Power supply reference ground 25 VCC P Power supply pin VCC (Typical value: 3.
2 Module interfaces Pin number Symbol Pin type Function 28 PC7 I/O Common I/O interface, which corresponds to Pin 30 of the IC 29 PC6 I/O Common I/O interface, which corresponds to Pin 31 of the IC 30 PC5 I/O Common I/O interface, which corresponds to P32 of the IC 31 PC3 I/O Common I/O interface, which corresponds to Pin 34 of the IC 32 PC2 I/O Common I/O interface, which corresponds to Pin 35 of the IC 33 PC1 I/O Common I/O interface, which corresponds to Pin 36 of the IC 34
2 Module interfaces Pin number Symbol Pin type Function 36 PB1 I/O Common I/O interface, which corresponds to Pin 46 of the IC 37 PB2 I/O Common I/O interface, which corresponds to Pin 47 of the IC 38 PB3 I/O Common I/O interface, which corresponds to Pin 48 of the IC :::info • The recommended voltage is 3.3V. The RF performance will be instable if the operating voltage is under 2.5V.
3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -40 120 ℃ I/O voltage ALDO_OUT 1.6 3.3 V VCC Power supply voltage 1.8 4.3 V ESD voltage (human body model) TAMB-25℃ - 2 KV ESD voltage (machine model) TAMB-25℃ - 2 KV 3.
3 Electrical parameters Minimum value Typical value Maximum value Unit Parameter Description VOL Voltage low output - - 0.33 V VOH Voltage high output 1.8 - - V The test condition for the above high/low voltage input/output is: VDDI/O = 3.3V. 3.3 Power consumption in operating mode Maximum value (Typical value) Unit Symbol Conditions Itx Constantly transmit with the output power of 40 dBm 14.3 mA Irx Constantly receive 15.
4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Operating frequency 2.4 GHz ISM band Wireless standard Bluetooth LE 5.0 Data transmission rate 1 Mbps, 2 Mbps Antenna type PCB antenna 4.
5 Audio CODEC parameters 5 Audio CODEC parameters 5.1 Digital to analog converter (single channel) Minimum value Typical value Maximum value Unit - - 16 Bits Sampling rate (Fs)* Synchronous 8 clock signal - 48 V uA SNR - 92 dB uA Digital gain 1/48dB -48 - 32 dB uA Analog gain 3dB 0 - 30 dB uA Full-scale output voltage VDDA=2.
5 Audio CODEC parameters Minimum value Typical value Maximum value Unit - - 16 Bits Sampling rate (Fs)* Synchronous 8 clock signal - 48 V uA SNR Weighted/nonweighted 79 - dB uA Digital gain 1/48dB -48 - 32 dB uA Analog gain 3dB 0 - 30 dB uA Parameter Condition Conversion precision 15 / 30
6 Antenna information 6 Antenna information 6.1 Antenna type BF8H-N uses the PCB antenna with a gain of 1.4 dBi. 6.2 Interference reduction To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna.
6 Antenna information 17 / 30
7 Packaging information and production instructions 7 Packaging information and production instructions 7.
7 Packaging information and production instructions 19 / 30
7 Packaging information and production instructions The following is a schematic diagram of BF8H-N which shows how pins correspond to each other: 20 / 30
7 Packaging information and production instructions Recommended PCB footprint 21 / 30
7 Packaging information and production instructions The default outline dimension tolerance is ±0.
7 Packaging information and production instructions tolerance is ±0.1 mm. If you have specific requirements on dimensions, specify them clearly in the datasheet after communication. 7.2 Production instructions 1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours.
7 Packaging information and production instructions 3. The module needs to be baked in the following cases: • • • • • The packaging bag is damaged before unpacking. There is no HIC in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months has passed since the sealing of the bag. 4.
7 Packaging information and production instructions measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 7.3 Recommended oven temperature curve Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.
7 Packaging information and production instructions in the solder paste specifications. 7.
8 MOQ and packaging information 8 MOQ and packaging information Product model MOQ (pcs) Packaging method BF8H-N 4000 Tape reel 27 / 30 The number of modules per reel The number of reels per carton 1000 4
9 Appendix: Statement 9 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
9 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
9 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
