Specifications

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AK-TC-M01Module specification

General Description

AK-TC-M01 module is a BLE wireless turn-key solution that supports multiple peripheral functions (ADC,

Timer, Counter, PWM) and Serial Communication Protocol (I2C, UART), Bluetooth 4.2 protocols with up

to 34GPIO pins.

Module Description

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size: 20*27.5*2.5

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Half hole process

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Up to 256 KB of flash memory with read accelerator and up to 32KB of SRAM

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Up to 34 GPIO pins

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Single mode module with Bluetooth 4.2

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Operating temperature range: -40°C-85°C

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48MHz ARM Cortex-M0 CPU with single cycle algorithm

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Internal low-speed oscillator dedicated to watchdog timer

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With SWD protocol burning port

Power consumption

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TX output power range: -18dbm-3dbm

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Received Signal Strength Indicator (RSSI): 1 db resolution

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RX current: 18.7mA

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TX current: 15.6mA (power is 0dbm)

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In low power mode:

Active mode: 3MHz flash execution program, current is 1.7mA

1.5 μA deep sleep mode current while monitoring crystal oscillator (WCO) operation

Sleep mode: Current is 150 nA when data is retained in RAM

Stop mode: 60 nA

Functional performance

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SAR ADC with 12-bit resolution and 1 Msps sample rate includes differential mode, single-ended mode,

and channel sequencer with signal averaging

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Two independent and reconfigurable serial communication modules (SCBs) with reconfigurable I2C,

UART functionality

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Four 16-bit timer, counter, pulse width modulator (TCPWM) modules

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LCD driver (Com or Seg driver) is supported on all pins

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Capable of operating in deep sleep mode with 4 bits of memory per pin

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I2S host interface

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Summary of content (20 pages)

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AK-TC-M01Module specification General Description AK-TC-M01 module is a BLE wireless turn-key solution that supports multiple peripheral functions (ADC, Timer, Counter, PWM) and Serial Communication Protocol (I2C, UART), Bluetooth 4.2 protocols with up to 34GPIO pins. Module Description • • • • • • • • • size: 20*27.5*2.5 Half hole process Up to 256 KB of flash memory with read accelerator and up to 32KB of SRAM Up to 34 GPIO pins Single mode module with Bluetooth 4.
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Table of Contents General Description 1 Module Description.................................................................................................................. 1 Power consumption .................................................................................................................. 1 Functional performance ........................................................................................................... 1 Table of Contents 2 Overview 3 Module overview ...............
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Overview Module overview AK-TC-M01 is a complete module, designed to be used on an application board. The specific dimensions are shown in Table 1 and Figure 1. TABLE 1 MODULE SIZE Size name Module size Specifications Length 20mm+-0.15mm Width 27.5mm+-0.15mm Length 12.8mm+-0.15 Width 7.8+-0.15 PCB thickness Thickness 1mm+-0.1mm Shield thickness Thickness 1.5+-0.
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Pinouts TABLE 2 AK-TC-M01 PIN LIST Pin Name Type Descriptiom 1 CAPC GPIO IO 2 CAP1 GPIO IO 3 CAP2 GPIO IO 4 CAP3 GPIO IO 5 CAP4 GPIO IO 6 CAP5 GPIO IO 7 CAP6 GPIO IO 8 CAP7 GPIO IO 9 CAP8 NC Do not connect 10 SWA GPIO IO 11 SWB GPIO IO 12 SW2 GPIO IO 13 RES1 GPIO IO 14 RES2 GPIO IO 15 RES3 GPIO IO 16 RES4 GPIO IO 17 VDDR POWER 1.9 V to 5.
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TABLE 2 AK-TC-M01 PIN LIST 29 LED2 GPIO IO 30 LED3 GPIO IO 31 LED4 GPIO IO 32 LED5 GPIO IO 33 LED6 GPIO IO 34 LED7 GPIO IO 35 LED8 GPIO IO 36 LED9 GPIO IO 37 LED10 GPIO IO 38 LED11 GPIO IO 39 LED12 GPIO IO Module schematic FIGURE 2 AK-TC-M01 MODULE SCHEMATIC Key components TABLE 3 KEY COMPONENTS LIST Component Designator Description 5 of 18
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TABLE 3 KEY COMPONENTS LIST MCU U1 BLEQFNPSOC with 56 pins Crystal oscillator Y2 24MHz,12pF Crystal oscillator Y1 32.768KHz,12.5pF Antenna Parameters TABLE 4 ANTENNA PARAMETERS Parameter Value Frequency range 2400-2500MHz Peak gain 1.5dbm Average gain 0.
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TABLE 5 ABSOLUTE MAXIMUM RATINGS IGPIO_injection GPIO injection current, Max for VIH >VDDD, and Min for VIL
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TABLE 7 DC SPECIFICATION IDD4 Execute from flash; CPU at 3 MHz - - - mA T = –40 Cto 85 °C IDD5 Execute from flash; CPU at 6 MHz - 2.5 - mA T = 25 °C， VDD= 3.3 V IDD6 Execute from flash; CPU at 6 MHz - - mA T = –40 C to 85 °C IDD7 Execute from flash; CPU at 12 MHz - 4 - mA T = 25 °C， VDD= 3.3 V IDD8 Execute from flash; CPU at 12 MHz - - - mA T = –40 C to 85 °C IDD9 Execute from flash; CPU at 24 MHz - 7.1 - mA T = 25 °C， VDD= 3.
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TABLE 7 DC SPECIFICATION Deep Sleep Mode, VDD= 1.71 V to 1.89 V (Regulator Bypassed) IDD19 WDT with WCOon - - - µA T = 25 °C IDD20 WDT with WCOon - - - µA T = –40 °C to 85 °C Hibernate Mode, VDD = 1.8 V to 3.6 V IDD21 GPIOand reset active - 150 - nA T = 25 °C， VDD= 3.3 V IDD22 GPIOand reset active - - - nA T = –40 °C to 85 °C Stop Mode, VDD= 1.8 to 3.6 V IDD23 Stop mode current(VDD) - 20 - nA T = 25 °C， VDD= 3.
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TABLE 9 GPIO DC SPECIFICATIONS VIL Input voltage LOW threshold VIH LVTTL input，VDD< 2.7 V VIL LVTTL input，VDD< 2.7 V VIH LVTTL input，VDD>= 2.7 V VIL LVTTL input，VDD>= 2.7 V VOH Output voltage HIGH level VOH - 0.3* VDD V - - V - - 0.3* VDD V - - - V - - 0.8 V - VDD-0.6 - - V Ioh = 4 mA at VDD = 3.3 Output voltage HIGH level VDD-0.5 - - V Ioh = 1 mA at VDD = 1.8 VOL Output voltage LOW level - - 0.6 V Ioh = 8 mA at VDD = 3.
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TABLE 9 GPIO DC SPECIFICATIONS TRISEF Rise time in FastStrong mode 2 12 ns 3.3 V VDDD， CLOAD= 25 pF TFALLF Fall time in FastStrong mode 2 12 ns 3.3 V VDDD， CLOAD= 25 pF TRISES Rise time in SlowStrong mode 10 60 ns 3.3 V VDDD， CLOAD= 25 pF TFALLS Fall time in SlowStrong mode 10 60 ns 3.3 V VDDD， CLOAD= 25 pF FGPIOUT1 GPIO Fout; 3.3 V=
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TABLE 11 SAR ADC DC SPECIFICATIONS A_OFFSET Input offset voltage - - 2 mV Measured with 1-V VREF A_ISAR Current consumption - - 1 mA - A_VINS Input voltage range single-ended VSS - VDDA V - A_VIND Input voltage range differential VSS - VDDA V - A_INRES Input resistance - - 2.2 k Ω - A_INCAP Input capacitance - - 10 pF - VREFSAR Trimmed internal reference to SAR -1 - 1 % Percentage of Vbg(1.
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TABLE 11 SAR ADC DC SPECIFICATIONS A_DNL Differential non linearity. VDD = 1.71 -1 - 2.2 LSB Vref = 1 V to VDD -1 - 2 LSB Vref = 1.71 V to VDD -1 - 2.2 LSB Vref = 1 V to VDD - - -65 dB Fin = 10 kHz Min Typ Max to 5.5 V, 1 Msps A_DNL Differential non linearity. VDD = 1.71 to 3.6 V, 1 Msps A_DNL Differential non linearity. VDD = 1.71 to 5.
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TABLE 16 FIXED UART AC SPECIFICATIONS Parameter Description Min Typ Max Units Details/Condit ions FUART Bit rate - - 1 Mbps - Details/Condit ions BLE Subsystem Electrical Specifications TABLE 17 BLE SUBSYSTEM ELECTRICAL SPECIFICATIONS Parameter Min Typ Max Units RX sensitivity with idle transmitter - -89 - dBm - RX sensitivity with idle transmitter excluding Balun loss - -91 - dBm Guaranteed by design simulation RXS、DIRTY RX sensitivity with dirty transmitter - -87 -70
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TABLE 17 BLE SUBSYSTEM ELECTRICAL SPECIFICATIONS CI4 Adjacent channel interference Wanted signal at –67 dBm and Inter- ferer at FRX ±3 MHz - -39 - dB RF-PHY Specification (RCVLE/CA/03/C) CI5 Adjacent channel interference Wanted Signal at –67 dBm and Inter- ferer at Image frequency (FIMAGE) - -20 - dB RF-PHY Specification (RCVLE/CA/03/C) CI6 Adjacent channel interference Wanted signal at –67 dBm and Inter- ferer at Image frequency (FIMAGE ± 1 - -30 - dB RF-PHY Specification (RCVLE/CA/03/
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TABLE 17 BLE SUBSYSTEM ELECTRICAL SPECIFICATIONS RXSE1 Receiver spurious emission 30 MHz to 1.0 GHz - - -57 dBm 100-kHz measurement bandwidth ETSI EN300 328 V1.8.1 RXSE2 Receiver spurious emission 1.0 GHz to 12.75 GHz - - -47 dBm 100-kHz measurement bandwidth ETSI EN300 328 V1.8.
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TABLE 17 BLE SUBSYSTEM ELECTRICAL SPECIFICATIONS FTX、INITDR Initial frequency drift -20 - 20 kHz RF-PHY Specification (TRMLE/CA/06/C) FTX, DR Maximum drift rate -20 - 20 kHz/ 50µs RF-PHY Specification (TRMLE/CA/06/C) IBSE1 In-band spurious emission at 2-MHz offset - - -20 dBm RF-PHY Specification (TRMLE/CA/03/C) In-band spurious emission at ≥3-MHz offset - - ±3 dBm RF-PHY Specification (TRMLE/CA/03/C) TXSE1 Transmitter spurious emissions (average), <1.0 GHz - - -55.
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TABLE 17 BLE SUBSYSTEM ELECTRICAL SPECIFICATIONS ITX,-6dBm TX current at –6-dBm setting (PA3) - 14.5 - mA - ITX,-12dBm TX current at –12-dBm setting (PA2) - 13.2 - mA - ITX,-18dBm TX current at –18-dBm setting (PA1) - 12.5 - mA - Iavg_1sec, 0dBm Average current at 1second BLE connection interval - 18.9 - µA TXP: 0 dBm; ±20-ppm master and slave clock accuracy. Iavg_4sec, 0dBm Average current at 4second BLE connection interval - 6.
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FCC WARNING This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
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This module meets the requirements of FCC part 15C(15.247).it specifically establish the 6dB Bandwidth, Peak Output Power, Radiated Spurious Emission, Power Spectral Density, Restricted Band of Operation and Band Edge ,Out of Band Emissions. It is a single module. PCB antenna, The antenna cannot be removed , Unconventional interface, The module with trace antenna designs, and This manual has been shown the layout of trace design,, antenna, connectors, and isolation requirements.