PRODUCT SPECIFICATION Intelligent module product specification Type: VZS2R1 Version: 2020224 Version number V 1.2 Release time change 2020.02.25 issue Changed person Chen jiatao V 2.0 2021.08.24 Adjust content Chen jiatao V 2.1 2022.02.
物联科技 选威士丹利 catalogue 1 Product introduction .............................................................................................................................................................................. 2 II. Overview of Intelligent Module Products .................................................................................................................................... 2 2 Technical parameters of products ............................................................................
物联科技 选威士丹利 I 、 intelligent module VZS2R1 products www.vensi.
物联科技 选威士丹利 II、 Overview of Intelligent Module Products 1 Product introduction VZS2R1 is a ZigBee wireless communication intelligent module developed by Westphalia, which supports ZigBee3.0. Adopting the highly integrated wireless RF processor chip EFR32MG21A020 series of Silicon Labs, it has the advantages and characteristics of high wireless transmission power, strong receiving sensitivity, low power consumption and strong networking ability, which provides a perfect solution for ZigBee connection.
物联科技 选威士丹利 3 application area Wisdom lighting, illumination Wisdom campus Wisdom building Wisdom home furnishing Wisdom household appliances Wisdom socket Wisdom for the aged 4 naming rule Note: Take the model of VZS2R1 module as an example: V Z S2 R 1 Figure 2-1 Naming Rules Section 5 package pins: 1-30pin(R1-30pin) Section 4 Packaging Series: R-R Series Section 3 Chip Platform: S2- Core EFR32MG21 Section 2 communication type: Z-ZigBee Section 1 Manufacturer: V- Westphalia Vensi www.
物联科技 选威士丹利 III. Module Interface 1 Package size 1.1 VZS2R1 VZS2R1 has three rows of pins with a pitch of 1.27mm Dimensions of VZS2R1: 15 0.4mm (L) x 18 0.4mm (W) x 2.8 0.2mm (H) The dimensions of vzs2R1 are shown in the figure: Figure 3-1 Front view of module with shielding cover www.vensi.
物联科技 选威士丹利 www.vensi.
物联科技 选威士丹利 2 IO pin interface definition of module Pin number 1 GND GND/PAVSS GND function declarati on ground connection 2 NULL PB01(GPIO) NULL Use as GPIO 3 NULL PB00(GPIO) NULL Use as GPIO 4r NULL PA00(GPIO) NULL Use as GPIO 5 NULL PA03(GPIO) NULL Use as GPIO 6 NULL PA04(GPIO) NULL Use as GPIO 7 NULL PA05(GPIO) NULL Use as GPIO 8 NULL PA06(GPIO) NULL Use as GPIO 9 NULL PD04(GPIO) NULL Use as GPIO 10 NULL PD03(GPIO) NULL Use as GPIO 11 NULL PD02(GPIO)
物联科技 选威士丹利 23 NULL PD00(GPIO) NULL Use as GPIO 24 NULL PC02(GPIO) NULL Use as GPIO 25 NULL PC03(GPIO) NULL Use as GPIO 26 NULL PC04(GPIO) NULL Use as GPIO 27 NULL PC05(GPIO) NULL Use as GPIO 28 GND GND GND ground connection 29 VCC PAVDD/RFVDD VDD DC power supply (1.85~3.6V) 30 VCC PAVDD/RFVDD VDD DC power supply (1.85~3.
物联科技 选威士丹利 IV. RF parameters 1 Basic radio frequency characteristics Parameter item Detailed description Working frequency 2.405~2.480GHz ZigBee standard IEEE 802.15.4 rate of data signalling 250Kbps Table 4-1 Basic RF Characteristics 2 Launch performance Param eter item Maximum output minim um value typical value maxim um unit - 19.3 - dBm - -15.
物联科技 选威士丹利 V. Antenna information 1 Information The antenna of this module can be IPEX antenna, Pin antenna, etc. 2 Reduce antenna interference When using PCB antenna on ZigBee module, in order to ensure the optimization of ZigBee performance, it is recommended that the distance between the antenna part of the module and other metal parts should be at least 24.5mm The user PCB should not be wired or even copper-clad in the antenna area.
物联科技 选威士丹利 VI. Packaging Information and Design Reference 1 Mechanical dimensions The module size is: 15 x 18mm. Module size and pad size are shown in the figure. The dimension tolerance of the following modules is ±0.4mm Figure 6-1 Mechanical dimension drawing 2 side view 2.1 VZS2R1- with shielding cover Figure 6-2 Side view of module with shielding cover Figure 6-3 Side view of module without shield www.vensi.
物联科技 选威士丹利 3 Reference drawing Figure 6-4 Design Reference Diagram 4 schematic circuit diagram Figure 6-5 Circuit Schematic Diagram www.vensi.
物联科技 选威士丹利 5 PCB package diagram -SMT 5.1 VZS2R1- with shielding cover Figure 6-6 Front view of PCB package Figure 6-7 Back view of mechanical dimensions 5.2 VZS2R1 series-without shield Figure 6-8 Front view of PCB package www.vensi.
物联科技 选威士丹利 VII. Matters needing attention in production 1 Shelf life of modules a) Shelf life: 12 months, storage environment: temperature < 40℃, humidity < 90% R.H b) Inventory control: the principle of "first in, first out" 2 Time limit for SMT assembly after the module is unpacked a) Check the humidity card (as shown in Figure 6-1): the displayed value should be less than 20% (blue); If > 30% (red), it means that the module has absorbed Figure 7-1 Humidity Card Inspection moisture.
物联科技 选威士丹利 Table 8-1 Package Information of Module FCC STATEMENT 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2. any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
物联科技 选威士丹利 IX. Basic information 1 copyright statement The copyright of this manual belongs to Guangzhou Vistara Intelligent Technology Co., Ltd., and all rights of technical patents, specifications and definitions involved in all documents are reserved. Without the consent of Vistara Intelligent, no unit or individual is allowed to extract the contents of this manual without authorization. 2 disclaimer Due to product iteration, some content will be changed due to product iteration.
