正基科技股份有限公司 正基科技股份有限公司 SPECIFICATION SPEC. NO.： ： DATE： ： REV： 1.1 04. 26. 2015 PRODUCT NAME： ： APPROVED AP6255 CHECKED PREPARED DCC ISSUE NAME AMPAK Technology Inc. Doc. NO: www.ampak.com.
AMPAK AP6255 WiFi 11ac + Bluetooth 4.1 Module Spec Sheet AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet Revision History Date Revision Content Revised By Version 2015/04/09 - Preliminary Gary 1.0 2015/04/26 - Add GPIO pin definiion Gary 1.1 AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet Contents Contents ................................................................................................................... 3 1. Introduction......................................................................................................... 4 2. Features............................................................................................................... 5 3. Deliverables ..............................................................................................
AP6255 Datasheet 12.2 Dimension................................................................................................... 31 12.3 MSL Level / Storage Condition ................................................................... 33 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi, Bluetooth functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets applications.
AP6255 Datasheet 2. Features IEEE 802.11a/b/g/n/ac dual-band radio with virtual-simultaneous dual-band operation Single-stream spatial multiplexing up to 433.3 Mbps data rate. Supports 20, 40, 80 MHz channels with optional SGI(256 QAM modulation) Bluetooth V4.0+EDR with integrated Class 1 PA and Low Energy (BLE) support Concurrent Bluetooth, and WLAN operation Simultaneous BT/WLAN receive with single antenna Supports standard SDIO v3.0 and backward compatible with SDIO v2.
AP6255 Datasheet 3. Deliverables 3.1 Deliverables The following products and software will be part of the product. Module with packaging Evaluation Kits Software utility for integration, performance test. Product Datasheet. Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification.
AP6255 Datasheet 4. General Specification 4.1 General Specification Model Name AP6255 Product Description Support Wi-Fi/Bluetooth functionalities Dimension L x W x H: 12 x 12 x 1.5 (typical) mm WiFi Interface SDIO v2.0/v3.0 BT Interface UART / PCM Operating temperature -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol VBAT VDDIO Description Min.
AP6255 Datasheet 5. Wi-Fi RF Specification 5.1 2.4GHz RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11b/g/n/ac, WiFi compliant Frequency Range 2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch14 Modulation 802.11b : DQPSK, DBPSK, CCK 802.11g/n : 64-QAM,16-QAM, QPSK, BPSK 802.11ac : 256-QAM, 64-QAM,16-QAM, QPSK, BPSK 802.11b /CCK Output Power : 16 dBm ± 1.5 dB @ EVM ≤ -9dB 802.11g /64-QAM(R=3/4) : 15 dBm ± 1.
AP6255 Datasheet @10% PER Receive Sensitivity (11ac,20MHz) @10% PER Receive Sensitivity (11ac,40MHz) @10% PER - MCS=2 PER @ -84 dBm, typical - MCS=3 PER @ -80 dBm, typical - MCS=4 PER @ -76 dBm, typical - MCS=5 PER @ -72 dBm, typical - MCS=6 PER @ -70 dBm, typical - MCS=7 PER @ -69 dBm, typical - MCS=0 PER @ -90 dBm, typical - MCS=1 PER @ -87 dBm, typical - MCS=2 PER @ -86 dBm, typical - MCS=3 PER @ -82 dBm, typical - MCS=4 PER @ -79 dBm, typical - MCS=5 PER @ -75 dBm, typical - M
AP6255 Datasheet 5.1 5GHz RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11a/b/g/n/ac, Wi-Fi compliant Frequency Range 4.900 GHz ~ 5.845 GHz (5.0 GHz ISM Band) Number of Channels 5.0GHz：Please see the table1 Modulation 802.11a/n : 64-QAM,16-QAM, QPSK, BPSK 802.11ac : 256-QAM, 64-QAM,16-QAM, QPSK, BPSK 802.11a /64-QAM(R=3/4) : 14 dBm ± 1.5 dB @ EVM ≤ -25dB Output Power 802.11n /64-QAM(R=5/6) : 13 dBm ± 1.5 dB @ EVM ≤ -28dB 802.
AP6255 Datasheet Receive Sensitivity (11ac,20MHz) @10% PER Receive Sensitivity (11ac,40MHz) @10% PER Receive Sensitivity (11ac,80MHz) @10% PER Maximum Input Level Antenna Reference AMPAK Technology Inc. Doc.
AP6255 Datasheet 1 5GHz Channel table Band (GHz) 5.15GHz~5.25GHz 5.25GHz~5.35GHz 5.5GHz~5.7GHz 5.725GHz~5.825GHz AMPAK Technology Inc. Doc. NO: Operating Channel Numbers 36 40 44 48 52 56 60 64 100 104 108 112 116 120 124 128 132 136 140 149 153 157 161 165 www.ampak.com.
AP6255 Datasheet 6. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth Standard Bluetooth V4.0 of 1, 2 and 3 Mbps. Host Interface UART Antenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2402 MHz ~ 2480 MHz Number of Channels 79 channels Modulation FHSS, GFSK, DPSK, DQPSK RF Specification Min. Typical. Output Power (Class 1.
AP6255 Datasheet 7. Pin Assignments 7.1 Pin Outline < TOP VIEW > 7.
AP6255 Datasheet 14 SDIO_DATA_2 I/O SDIO data line 2 15 SDIO_DATA_3 I/O SDIO data line 3 16 SDIO_DATA_CMD I/O SDIO command line 17 SDIO_DATA_CLK I/O SDIO clock line 18 SDIO_DATA_0 I/O SDIO data line 0 19 SDIO_DATA_1 I/O SDIO data line 1 20 GND － Ground connections 21 VIN_LDO_OUT P Internal Buck voltage generation pin 22 VDDIO P I/O Voltage supply input 23 VIN_LDO P Internal Buck voltage generation pin 24 LPO I External Low Power Clock input (32.
AP6255 Datasheet 8. Dimensions 8.1 Physical Dimensions (Unit: mm) < TOP VIEW > < Side View > < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 8.2 Layout Recommendation (Unit: mm) < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 9. External clock reference External LPO signal characteristics Parameter Specification Units 32.768 kHz ± 30 ppm 30 - 70 % Input signal amplitude 400 to 1800 mV, p-p Signal type Square-wave - Nominal input frequency Frequency accuracy Duty cycle Input impedance >100k <5 pF Clock jitter (integrated over 300Hz – 15KHz) <1 Hz 0.7Vio - Vio V Output high voltage AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 10.1 SDIO Pin Description All three package options of the WLAN section provide support for SDIO version 3.0 including the new UHS-I modes: DS: Default speed up to 25MHz (3.3V signaling). HS: High speed up to 50MH (3.3V signaling). SDR12: SDR up to 25MHz (1.8V signaling). SDR25: SDR up to 50MHz (1.8V signaling). SDR50: SDR up to 100MHz (1.8V signaling). SDR104: SDR up to 208MHz (1.8V signaling). DDR50: DDR up to 50MHz (1.8V signaling).
AP6255 Datasheet 10. Host Interface Timing Diagram 10.1 Power-up Sequence Timing Diagram The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable.
AP6255 Datasheet WLAN=OFF, Bluetooth=OFF WLAN=ON, Bluetooth=OFF WLAN=OFF, Bluetooth=ON AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 10.2 SDIO Default Mode Timing Diagram AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 10.3 SDIO High Speed Mode Timing Diagram AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 10.4 SDIO Bus Timing Specifications in SDR Modes Clock timing (SDR Modes) Card Input timing (SDR Modes) AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet Card output timing (SDR Modes up to 100MHz) Card output timing (SDR Modes 100MHz to 208MHz) AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet ∆t OP Consideration for Variable Data Window (SDR 104 Mode) 10.5 SDIO Bus Timing Specifications in DDR50 Mode AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet Data Timing AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 11. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times ℃ 250 2.5°C/sec 40~70 sec ℃ 2.5 /sec AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet Solder Paste definition AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 12. Package Information 12.1 Label Label A Anti-static and humidity notice Label B MSL caution / Storage Condition Label C Inner box label . Label D Carton box label . AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 12.2 Dimension AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet B Humidity indicator A Desiccant C C D AMPAK Technology Inc. Doc. NO: www.ampak.com.
AP6255 Datasheet 12.3 MSL Level / Storage Condition ※NOTE : Accumulated baking time should not exceed 96hrs AMPAK Technology Inc. Doc. NO: www.ampak.com.
Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
le gain maximal d’antenne permis (pour les dispositifs utilisant la bande 5 725-5 825 MHz) doit se conformer à la limite de p.i.r.e. spécifiée pour l’exploitation point à point et non point à point, selon le cas.
