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<GSUB-0002>

UWB+BLE Combo SiP Module

Pb-free, halogen-free and RoHS compliant

Summary of content (19 pages)

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UWB+BLE Combo SiP Module Pb-free, halogen-free and RoHS compliant Version0.
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Restricted 1. Security warning The information contained in this document is the exclusive property of Goertek Microelectronics Co., Ltd. and should not be disclosed to any third party without the written consent of Goertek Microelectronics Co., Ltd. 2. Publication history Version Date Description V0.1 2021/10/18 First release V0.2 2021/12/18 Update DC/RF Characteristics V0.3 2022/02/26 Update Tape and Reel Packing V0.4 2022/03/10 Update DC / RF Characteristics V0.
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Content Restricted...................................................................................................................................... 2 Content ......................................................................................................................................... 3 1. Introduction ....................................................................................................................... 4 1.1 Functional Description ...........................................
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1. Introduction 1.1 Functional Description GSUB-0002 module is based on System-in-Package (SiP) technology which consists of a NORDIC nRF52840 Bluetooth SoC, a QORVO DW3120 UWB transceiver, a ST LIS2DW12TR 3axis accelerometer, a 1.6V step-down switching voltage regulator and the matched passive components. All these components are integrated in a tiny 97-pins 10.5x8.3x1.2 mm³ LGA package with sputter technology to achieve EMI shielding. GSUB-0002 can be used to scheme location application for IOT devices.
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  USB 2.0 full speed (12 Mbps) controller  QSPI 32 MHz interface  High-speed 32 MHz SPI UWB：  IEEE802.15.4-2015 UWB  IEEE802.15.4Z (BPRF mode)  Supports channels 5 & 9 (6489.6MHz & 7987.2 MHz)  Supports 2-way ranging, TDOA and PDOA location schemes  Worldwide UWB Radio Regulatory compliance  Low power consumption  Data rates of 850 kbps, 6.8 Mbps and 27Mbps  Integrated HW AES 256 1.
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4. Certification Information FCC ID: 2A5EY-GSUB -0002 *Please follow installation manual of Appendix This module is only FCC authorized for the specific rule FCC 15.247 and 15.519 listed on the grant, and that the host manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification, final host product requires Part 15 Subpart B compliance testing with the modular transmitter installed.
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5.2 Dimensions Transistor 5.3 Terminal Configurations Pin NO. Name of pin NO. Connection IC terminal to Function Recommended usage 1 GND_1 GND Ground 2 P0.05/AIN3 P0.05/AIN3 GPIO/Analog input 3 P0.04/AIN2 P0.04/AIN2 GPIO/Analog input 4 P0.27 P0.27 GPIO 5 P0.26 P0.26 GPIO 6 P0.30/AIN6 P0.30/AIN6 GPIO/Analog input Standard drive, low frequency I/O only 7 P0.28/AIN4 P0.28/AIN4 GPIO/Analog input Standard drive, low frequency I/O only 8 P0.02/AIN0 P0.
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18 GND_3 GND Ground 19 GND_4 GND Ground 20 P1.07 P1.07 GPIO Standard drive, low frequency I/O only 21 P1.06 P1.06 GPIO Standard drive, low frequency I/O only 22 P1.05 P1.05 GPIO Standard drive, low frequency I/O only 23 GND_5 GND Ground Serial wire debug 24 SWDCLK SWDCLK clock input for debug and programming Serial wire debug I/O 25 SWDIO SWDIO for debug and programming 26 GND_6 GND Ground 27 ANT2 ANT2 28 GND_7 GND Ground 29 P0.22 P0.22 GPIO 30 P0.19 P0.
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Main Power 46 VDDMCU VDD and VDDH Supply(2.5~3.6V) for BLE 47 GND_12 GND Ground 48 P1.08 P1.08 GPIO 49 P1.09 P1.09/TRACEDAT GPIO/Trace buffer A3 TRACEDATA[3] 50 P0.08 P0.08 GPIO 51 P0.07 P0.07/TRACECLK 52 P0.06 P0.06 GPIO 53 GND_13 GND GND 54 P0.12 P0.12/TRACEDAT GPIO/Trace buffer A1 TRACEDATA[1] 55 P0.11 P0.11/TRACEDAT GPIO/Trace buffer A2 TRACEDATA[2] 56 P0.13 P0.13 GPIO 57 P0.14 P0.14 GPIO 58 P0.31/AIN7 P0.31/AIN7 GPIO/Analog input 59 P0.
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5.4 Module Internal Connection nRF52840 DW3120 P0.17(J6) P1.00(J3) P0.15(K7) P0.16(H6) P0.25(K2) P1.02(G3) P1.01(J1) P0.23(H5) P0.20(J5) P1.03(F3) P1.04(H1) SPICLK SPICSn SPIMISO SPIMOSI DW_WAKEUP DW_IRQ DW_RSTn SCL SDA INT1 INT2 SPICLK(A8) SPICSn(B5) SPIMISO(A6) SPIMOSI(B7) WAKEUP(B9) IRQ(B1) RSTn(A10) LIS2DW12 SCL/SPC(1) SDA/SDI/SDO(4) INT1(12) INT2(11) *Note: 1. About DW3120 reset: The P1.
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6. Absolute Maximum Ratings Parameter Min Max Unit Storage Temperature -40 85 ℃ VDD1 -0.3 4.0 V VDD2 -0.3 4.0 V VUSB -0.3 5.8 V VDDMCU -0.3 3.9 V Supply Voltage *Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability.
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9.1 Current Consumption Items Status Min. Typ. Max. Unit 1 uA DW3120: Deep sleep nRF52840 :System OFF DEEP Sleep mode DW3120: Deep sleep nRF52840: System ON, RTC TBD uA 7.1 mA 5.7 mA 41.2 mA 54.2 mA 48.3 mA 59.8 mA RX CH5 49.7 mA RX CH9 61.0 mA and Sensor are disabled DW3120: IDLE-RC mode IDLE-RC mode nRF52840: a wake DW3120: INIT-RC mode INIT mode nRF52840: a wake TX CH5(nominal power@ -41.
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9.3 Transmitter Characteristics (UWB) Items Frequency range Min. Typ. Max. Unit 8250 MHz 6250 Center Frequency Channel 5 6489.6 Center Frequency Channel 9 7987.2 Channel bandwidths 499.2 MHz Output Power spectral density -41.3 (programmable)*1 Output Chanel Power -18.5 dBm/MHz dBm *Using the pre-loaded embedded firmware of the module, otherwise see the DW3000 datasheet. 9.4 DC/RF Characteristics for Bluetooth (LE) Items Contents Bluetooth specification (power class) Version 5.
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Number of RF channel - 40 - - -20 - 8 dBm 1) Δf1avg 225 - 275 kHz 2) Δf2max (at 99.9%) 185 - - kHz 3) Δf2avg / Δf1avg 0.8 - - - 1) Frequency offset - - 150 kHz 2) Frequency drift - - 50 kHz 3) Drift rate - - 20 kHz Receiver sensitivity (PER < 30.8%) - -95 - dBm 0 - - dBm TBD - TBD % Output power Modulation Characteristics Carrier frequency offset and drift Maximum received signal strength (PER< 0.
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Number of RF channel - 40 - - -20 - 8 dBm 1) Δf1avg 225 - 275 kHz 2) Δf2max (at 99.9%) 185 - - kHz - - - - 1) Frequency offset - - 150 kHz 2) Frequency drift - - 50 kHz 3) Drift rate - - 19.2 kHz Receiver sensitivity (PER < 30.8%) - -103 - dBm 0 - - dBm TBD - TBD % Output power Modulation Characteristics 3) Δf2avg / Δf1avg Carrier frequency offset and drift Maximum received signal strength (PER< 0.1%) PER Report Integrity (-30dBm input) 10.
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12. Soldering Conditions The recommendation conditions of soldering are as in the following figure. Soldering must be carried out by the mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Goertek Microelectronics before use if concerning other soldering conditions. Version0.
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Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 13. Tape and Reel Packing 13.1 Dimension of Tape Version0.
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13.2 Dimensions of Reel Unit：mm 13.3 Packing Explain Carrier Tape Pin1 Reel Sprocket Holes Feeding Direction Roll up carrier tape with reel, 3000pcs/reel. Version0.
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Appendix FCC ID:2A5EY-GSUB-0002 FCC statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.