Cinterion datasheet

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Cinterion

EHS5 Wireless Module

Highly Efﬁcient 3G in a 2G Footprint

Java

embedded

Embedded

TCP/IP Stack

FOTA

congurable &

free of charge

Multi Design

Capability

(LGA)

RLS Monitoring

(Jamming Detection)

USB 2.0

High Speed

compatible

Dual Band

HSPA

Advanced

Temperature

Management

eCall /

ERA GLONASS

Compliant

Bearer

Independent

Protocol

EHS5

PAGE 1
EHS5 3G Dual Band HSPA Java embedded Multi Design Capability (LGA) RLS Monitoring (Jamming Detection) USB 2.
PAGE 2
Cinterion® EHS5 Wireless Module Highly Efficient 3G in a 2G Footprint The Cinterion EHS5 module represents a milestone in embeddeded Java machine-to-machine (M2M) communication, offering smart connectivity for industrial applications. ment (DM) and separate mobile network operator approvals from application code development, allowing simultaneous progress of both phases for a shorter time to market. EHS5 delivers highly efficient 3G communication in an ultra-compact footprint.
PAGE 3
Cinterion® EHS5 Features GENERAL FEATURES >> 3GPP Rel.7 Compliant Protocol Stack >> Dual-Band UMTS (WCDMA /FDD) EHS5-E: 900 and 2100 MHz EHS5-US: 850 and 1900 MHz >> Dual-Band GSM EHS5-E: 900 and 1800 MHz EHS5-US: 850 and 1900 MHz >> SIM Application Toolkit, Class 3, with BIP and RunAT support >> 3GPP & Russian eCall support >> Embedded IP stack >> Control via standardized and extended AT commands (Hayes, TS 27.007 and 27.
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The information provided in this brochure contains merely general descriptions or characteristics of performance, which in case of actual use do not always apply as described or which may change as a result of further development of the products. An obligation to provide the respective characteristics shall only exist if expressly agreed in the terms of contract.