Cinterion® ELS61-US Hardware Interface Overview Version: DocId: 00.281 ELS61-US_HIO_v00.281 M2M.GEMALTO.
Cinterion® ELS61-US Hardware Interface Overview Page 2 of 40 2 Document Name: Cinterion® ELS61-US Hardware Interface Overview Version: 00.281 Date: 2016-02-11 DocId: ELS61-US_HIO_v00.281 Status Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS.
Cinterion® ELS61-US Hardware Interface Overview Page 3 of 40 Contents 40 Contents 1 Introduction ................................................................................................................. 6 1.1 Key Features at a Glance .................................................................................. 6 1.2 ELS61-US System Overview ............................................................................. 9 2 Interface Characteristics ..........................................
Cinterion® ELS61-US Hardware Interface Overview Page 4 of 40 Tables 114 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Signals of the SIM interface (SMT application interface) ............................... GPIO lines and possible alternative assignment............................................ Return loss in the active band........................................................................ Overview of operating modes ....
Cinterion® ELS61-US Hardware Interface Overview Page 5 of 40 Figures 114 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: ELS61-US system overview............................................................................. 9 USB circuit ..................................................................................................... 10 Serial interface ASC0.....................................................................................
Cinterion® ELS61-US Hardware Interface Overview Page 6 of 40 1 Introduction 9 1 Introduction This document1 describes the hardware of the Cinterion® ELS61-US module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.
Cinterion® ELS61-US Hardware Interface Overview Page 7 of 40 1.1 Key Features at a Glance 9 Feature Implementation SMS Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment Software AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M AT commands for RIL compatibility Java™ Open Platform Java™ Open Platform with • Java™ profile IMP-NG & CLDC 1.
Cinterion® ELS61-US Hardware Interface Overview Page 8 of 40 1.1 Key Features at a Glance 9 Feature Implementation GPIO interface 22 GPIO lines comprising: 13 lines shared with ASC0, ASC1 and SPI lines, with network status indication, PWM functionality, fast shutdown and pulse counter 9 GPIO lines not shared I2C interface Supports I2C serial interface SPI interface Serial peripheral interface, shared with GPIO lines Antenna interface pads 50Ω.
Cinterion® ELS61-US Hardware Interface Overview Page 9 of 40 1.2 ELS61-US System Overview 9 1.
Cinterion® ELS61-US Hardware Interface Overview Page 10 of 40 2 Interface Characteristics 21 2 Interface Characteristics ELS61-US is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface ELS61-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant.
Cinterion® ELS61-US Hardware Interface Overview Page 11 of 40 2.1 Application Interface 21 2.1.2 Serial Interface ASC0 ELS61-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). ELS61-US is designed for use as a DCE.
Cinterion® ELS61-US Hardware Interface Overview Page 12 of 40 2.1 Application Interface 21 2.1.3 Serial Interface ASC1 Four ELS61-US GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state).
Cinterion® ELS61-US Hardware Interface Overview Page 13 of 40 2.1 Application Interface 21 2.1.4 UICC/SIM/USIM Interface ELS61-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. .
Cinterion® ELS61-US Hardware Interface Overview Page 14 of 40 2.1 Application Interface 21 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC SIM 220nF 1nF CCRST CCIO CCCLK Figure 5: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on ELS61-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.
Cinterion® ELS61-US Hardware Interface Overview Page 15 of 40 2.1 Application Interface 21 2.1.5 GPIO Interface ELS61-US offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other interfaces or functions: Fast shutdown (see Section 2.2.4), status LED (see Section 2.2.3), the PWM functionality (see Section 2.2.1), an pulse counter (see Section 2.2.2), ASC0 (see Section 2.1.2), ASC1 (see Section 2.1.3), an SPI interface (see Section 2.2).
Cinterion® ELS61-US Hardware Interface Overview Page 16 of 40 2.2 SPI Interface 21 2.1.6 I2C Interface I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line.
Cinterion® ELS61-US Hardware Interface Overview Page 17 of 40 2.2 SPI Interface 21 2.2.1 PWM Interfaces The GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interface lines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzzers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOs see Section 2.1.5). GPIO and PWM functionality are mutually exclusive. 2.2.
Cinterion® ELS61-US Hardware Interface Overview Page 18 of 40 2.3 RF Antenna Interface 21 2.3 RF Antenna Interface The ELS61-US UMTS/LTE antenna interface comprises a UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF interface has an impedance of 50Ω. ELS61-US is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power.
Cinterion® ELS61-US Hardware Interface Overview Page 19 of 40 2.3 RF Antenna Interface 21 2.3.1 Antenna Installation The antenna is connected by soldering the antenna pad (ANT_MAIN or ANT_DRX) and its neighboring ground pads (GND) directly to the application’s PCB. The antenna pads are the antenna reference points (ARP) for ELS61-US. All RF data specified throughout this document is related to the ARP.
Cinterion® ELS61-US Hardware Interface Overview Page 20 of 40 2.4 Sample Application 21 2.4 Sample Application Figure 6 shows a typical example of how to integrate a ELS61-US module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines.
Cinterion® ELS61-US Hardware Interface Overview Page 21 of 40 2.4 Sample Application 21 Main antenna GND VDDLP ANT_MAIN Switch on GND EMERG_RST ANT_DRX GND 100k RESET Diversity antenna GND ON VDDLP V180 PWR_IND BATT+RF VCORE 22k BATT+BB 150µF, Low ESR! 53 33pF 204 Power supply 100k 50µF, Low ESR! 4.7k 33pF ELS6x 100k Blocking** Blocking** 4 4 8 3 GPIO20...GPIO23 GPIO16...GPIO19/ ASC1/ SPI ASC0 (including GPIO1...
Cinterion® ELS61-US Hardware Interface Overview Page 22 of 40 3 Operating Characteristics 23 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 4: Overview of operating modes Mode Function Normal UMTS / HSPA / operation LTE SLEEP Power saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active communication via ASC0.
Cinterion® ELS61-US Hardware Interface Overview Page 23 of 40 3.2 Power Supply 23 3.2 Power Supply ELS61-US needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+BB with a line mainly for the baseband power supply. • BATT+RF with a line for the UMTS/LTE power amplifier supply. Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF.
Cinterion® ELS61-US Hardware Interface Overview Page 24 of 40 4 Mechanical Dimensions 25 4 Mechanical Dimensions 4.1 Mechanical Dimensions of ELS61-US Figure 7 shows the top and bottom view of ELS61-US and provides an overview of the board's mechanical dimensions. For further details see Figure 8. Product label Top view Bottom view Figure 7: ELS61-US– top and bottom view ELS61-US_HIO_v00.
Cinterion® ELS61-US Hardware Interface Overview Page 25 of 40 4.1 Mechanical Dimensions of ELS61-US 25 Figure 8: Dimensions of ELS61-US (all dimensions in mm) ELS61-US_HIO_v00.
Cinterion® ELS61-US Hardware Interface Overview Page 26 of 40 5 Regulatory and Type Approval Information 32 5 Regulatory and Type Approval Information 5.1 Directives and Standards ELS61-US is designed to comply with the directives and standards listed below.
Cinterion® ELS61-US Hardware Interface Overview Page 27 of 40 5.1 Directives and Standards 32 Table 7: Standards of European type approval ETSI EN 301 489-24 V1.5.1 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment ETSI EN 301 908-01 V5.2.
Cinterion® ELS61-US Hardware Interface Overview Page 28 of 40 5.1 Directives and Standards 32 Table 10: Toxic or hazardous substances or elements with defined concentration limits ELS61-US_HIO_v00.
Cinterion® ELS61-US Hardware Interface Overview Page 29 of 40 5.2 SAR requirements specific to portable mobiles 32 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a UMTS module must be in accordance with the guidelines for human exposure to radio frequency energy.
Cinterion® ELS61-US Hardware Interface Overview Page 30 of 40 5.3 Reference Equipment for Type Approval 32 5.
Cinterion® ELS61-US Hardware Interface Overview Page 31 of 40 5.4 Compliance with FCC and IC Rules and Regulations 32 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.
Cinterion® ELS61-US Hardware Interface Overview Page 32 of 40 5.4 Compliance with FCC and IC Rules and Regulations 32 If Canadian approval is requested for devices incorporating ELS61-US modules the below notes will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.
Cinterion® ELS61-US Hardware Interface Overview Page 33 of 40 6 Document Information 37 6 Document Information 6.1 Revision History New document: "Cinterion® ELS61-US Hardware Interface Overview" Version 00.281 Chapter What is new -- Initial document setup. 6.2 [1] [2] [3] [4] [5] Related Documents ELS61-US AT Command Set ELS61-US Release Note Application Note 48: SMT Module Integration Application Note 40: Thermal Solutions Universal Serial Bus Specification Revision 2.
Cinterion® ELS61-US Hardware Interface Overview Page 34 of 40 6.3 Terms and Abbreviations 37 6.3 Terms and Abbreviations Abbreviation Description ADC Analog-to-digital converter AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0/ASC1 Asynchronous Controller.
Cinterion® ELS61-US Hardware Interface Overview Page 35 of 40 6.3 Terms and Abbreviations 37 Abbreviation Description FCC Federal Communications Commission (U.S.
Cinterion® ELS61-US Hardware Interface Overview Page 36 of 40 6.3 Terms and Abbreviations 37 Abbreviation Description RAM Random Access Memory RF Radio Frequency RLS Radio Link Stability RMS Root Mean Square (value) RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment.
Cinterion® ELS61-US Hardware Interface Overview Page 37 of 40 6.4 Safety Precaution Notes 37 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS61-US. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
Cinterion® ELS61-US Hardware Interface Overview Page 38 of 40 7 Appendix 39 7 Appendix 7.
Cinterion® ELS61-US Hardware Interface Overview Page 39 of 40 7.1 List of Parts and Accessories 39 Table 12: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
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