Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Version: DocId: 00.502 ELS31-V_ELS51-V_HIO_v00.502 M2M.GEMALTO.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 2 of 35 2 Document Name: Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Version: 00.502 Date: 2015-12-07 DocId: ELS31-V_ELS51-V_HIO_v00.502 Status: Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 1 of 35 Contents 35 Contents 1 Introduction ................................................................................................................. 2 1.1 Key Features at a Glance .................................................................................. 2 1.2 ELS31-V / ELS51-V System Overview .............................................................. 5 2 Interface Characteristics .........................................
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 1 of 35 Tables 35 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Signals of the SIM interface (SMT application interface) ................................. 9 GPIO lines and possible alternative assignment............................................ 11 Return loss in the active band........................................................................
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 1 of 35 Figures 35 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: ELS31-V / ELS51-V system overview.............................................................. 5 USB circuit ....................................................................................................... 6 Serial interface ASC0................................................................................
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 2 of 35 1 Introduction 5 1 Introduction This document1 describes the hardware of the Cinterion® ELS31-V and ELS51-V modules for Verizon Network. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 3 of 35 1.1 Key Features at a Glance 5 Feature Implementation Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4].
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 4 of 35 1.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 5 of 35 1.2 ELS31-V / ELS51-V System Overview 5 ELS31-V / ELS51-V System Overview Application Serial modem interface I2C SPI USB HSIC SDIO (with SIM detection) ADC Power supply 1 ON Emergency reset ADC POWER ANTENNA (LTE dual band) Antenna / div.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 6 of 35 2 Interface Characteristics 17 2 Interface Characteristics ELS31-V / ELS51-V is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interfaces. 2.1 Application Interface 2.1.1 USB Interface ELS31-V / ELS51-V supports a USB 2.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 7 of 35 2.1 Application Interface 17 2.1.2 Serial Interface ASC0 ELS31-V / ELS51-V offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). ELS31-V / ELS51-V is designed for use as a DCE.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 8 of 35 2.1 Application Interface 17 2.1.3 Serial Interface ASC1 (ELS51-V Only) ELS51-V provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). With ELS31-V, ASC1 can only be used as data interface.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 9 of 35 2.1 Application Interface 17 2.1.4 UICC/SIM/USIM Interface ELS31-V / ELS51-V has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 10 of 35 2.1 Application Interface 17 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC SIM 220nF 1nF CCRST CCIO CCCLK Figure 5: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on ELS31-V / ELS51-V and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 11 of 35 2.1 Application Interface 17 2.1.5 GPIO Interface ELS31-V / ELS51-V offers a GPIO interface with 17 GPIO and 3 GPO lines. The lines are shared with other interfaces or functions: Fast shutdown (see Section 2.1.11.2), status LED (see Section 2.1.11.1), a pulse counter (see Section 2.1.8), ASC0 (see Section 2.1.2), ASC1 (see Section 2.1.3), SPI (see Section 2.1.7), and HSIC (see Section 2.1.9).
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 12 of 35 2.1 Application Interface 17 2.1.6 I2C Interface I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 13 of 35 2.1 Application Interface 17 2.1.7 SPI Interface Four ELS31-V / ELS51-V GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface for control and data transfer between ELS31V / ELS51-V and the external application. Only one application can be connected to the SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 14 of 35 2.2 RF Antenna Interface 17 2.2 RF Antenna Interface The RF interface has an impedance of 50. ELS31-V /ELS51-V is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 15 of 35 2.2 RF Antenna Interface 17 2.2.1 Antenna Installation The antenna is connected by soldering the antenna pads (RF_OUT, pad #59 and DIV_ANT, pad 56) its neighboring ground pads (GND, i.e., pads #55, #57, #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for ELS31-V / ELS51-V. All RF data specified throughout this document is related to the ARP.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 16 of 35 2.3 Sample Application 17 2.3 Sample Application Figure 6 shows a typical example of how to integrate a ELS31-V / ELS51-V module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 17 of 35 2.3 Sample Application 17 ELS31-V/51-V Main Antenna SDIO WiFi Div.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 18 of 35 3 Operating Characteristics 19 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 4: Overview of operating modes Mode Function Normal operation LTE IDLE No data transfer is in progress and the USB connection is suspended by host (or is not present) and no active communication via ASC0/ ASC1.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 19 of 35 3.2 Power Supply 19 3.2 Power Supply ELS31-V/ ELS51-V needs to be connected to a power supply at the SMT application interface - 2 BATT lines and GND. There are two separate voltage domains for BATT: • BATT_BB with a line mainly for the baseband power supply. • BATT_RF with a line for the RF power amplifier supply.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 20 of 35 4 Mechanical Dimensions, Mounting and Packaging 21 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of ELS31-V / ELS51-V Figure 7 shows the top and bottom view of ELS31-V / ELS51-V and provides an overview of the board's mechanical dimensions. For further details see Figure 8. Product label Top view Bottom view Figure 7: ELS31-V– top and bottom view ELS31-V_ELS51-V_HIO_v00.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 21 of 35 4.1 Mechanical Dimensions of ELS31-V / ELS51-V 21 Figure 8: Dimensions of ELS31-V / ELS51-V (all dimensions in mm) Figure 9: Dimensions of ELS31-V / ELS51-V (all dimensions in mm) - bottom view ELS31-V_ELS51-V_HIO_v00.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 22 of 35 5 Regulatory and Type Approval Information 27 5 Regulatory and Type Approval Information 5.1 Directives and Standards ELS31-V / ELS51-V is designed to comply with the directives and standards listed below.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 23 of 35 5.1 Directives and Standards 27 Table 10: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 24 of 35 5.2 SAR requirements specific to portable mobiles 27 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 25 of 35 5.3 Reference Equipment for Type Approval 27 5.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 26 of 35 5.4 Compliance with FCC and IC Rules and Regulations 27 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 27 of 35 5.4 Compliance with FCC and IC Rules and Regulations 27 will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 28 of 35 6 Document Information 32 6 Document Information 6.1 Revision History New document: "Cinterion® ELS31-V/ELS51-V Hardware Interface Overview" v00.502 Chapter What is new -- Initial document setup. 6.2 [1] [2] [3] [4] [5] Related Documents ELS31-V / ELS51-V AT Command Set ELS31-V / ELS51-V Release Note Application Note 40: Thermal Solutions Application Note 48: SMT Module Integration Universal Serial Bus Specification Revision 2.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 29 of 35 6.3 Terms and Abbreviations 32 Abbreviation Description DAI Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 30 of 35 6.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 31 of 35 6.3 Terms and Abbreviations 32 Abbreviation Description SMS Short Message Service SMT Surface Mount Technology SRAM Static Random Access Memory TA Terminal adapter (e.g.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 32 of 35 6.4 Safety Precaution Notes 32 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS31-V. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 33 of 35 7 Appendix 34 7 Appendix 7.
Cinterion® ELS31-V/ELS51-V Hardware Interface Overview Page 34 of 35 7.1 List of Parts and Accessories 34 Table 14: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
35 About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2014 annual revenues of €2.5 billion and blue-chip customers in over 180 countries. Our 14,000 employees operate out of 99 offices, 34 personalization and data centers, and 24 research and software development centers located in 46 countries. Gemalto develops secure embedded software and secure products which we design and personalize.
