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Cinterion

ELS31-VA/ELS51-VA

Hardware Interface Description

Version: 01.000

DocId: ELS31-VA_ELS51-VA_HID_v01.000

Summary of content (106 pages)

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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Version: DocId: 01.000 ELS31-VA_ELS51-VA_HID_v01.000  M2M.GEMALTO.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 2 of 106 2 Document Name: Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Version: 01.000 Date: 2017-01-04 DocId: ELS31-VA_ELS51-VA_HID_v01.000 Status: Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 3 of 106 Contents 106 Contents 1 Introduction ................................................................................................................. 9 1.1 Key Features at a Glance .................................................................................. 9 1.2 ELS31-VA/ELS51-VA System Overview ......................................................... 12 1.3 Circuit Concept ................................................
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 4 of 106 Contents 106 3 Operating Characteristics ........................................................................................ 57 3.1 Operating Modes ............................................................................................. 57 3.2 Power Up/Power Down Scenarios ................................................................... 58 3.2.1 Turn on ELS31-VA/ELS51-VA ...............................................
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 5 of 106 Contents 106 4.3 Packaging ........................................................................................................ 86 4.3.1 Tape and Reel .................................................................................... 86 4.3.1.1 Orientation........................................................................... 86 4.3.1.2 Barcode Label .....................................................................
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 6 of 106 Tables 106 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23: Table 24: Table 25: Table 26: Table 27: Table 28: Table 29: Table 30: Table 31: Table 32: Table 33: Table 34:  Pad assignments...................................................................
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 7 of 106 Figures 106 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Figure
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 8 of 106 Figures 106 Figure 50: Figure 51: Figure 52: Figure 53: Figure 54: Figure 55: Figure 56:  Moisture Sensitivity Label .............................................................................. Humidity Indicator Card - HIC ........................................................................ Small quantity tray..........................................................................................
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 9 of 106 1 Introduction 13 1 Introduction This document1 describes the hardware of the Cinterion® ELS31-VA and ELS51-VA modules for Verizon Networks. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 10 of 106 1.1 Key Features at a Glance 13 Feature Implementation Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4].
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 11 of 106 1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 12 of 106 1.2 ELS31-VA/ELS51-VA System Overview 13 1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 13 of 106 1.3 Circuit Concept 13 1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 14 of 106 2 Interface Characteristics 56 2 Interface Characteristics ELS31-VA/ELS51-VA is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interfaces. 2.1 Application Interface 2.1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 15 of 106 2.1 Application Interface 56 Table 1: Pad assignments Pad no. Signal name Pad no. Signal name Pad no.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 16 of 106 2.1 Application Interface 56 2.1.2 Signal Properties Table 2: Signal properties Function Signal name IO Signal form and level Comment Power supply BATT_BB BATT_RF I VImax = 4.5V VInorm = 3.8V VImin = 3.3V Imax=720mA nominal voltage 3.8V - 300 mA for BATT_RF - 420 mA for BATT_BB Lines of BATT+ and GND must be connected in parallel for supply purposes because higher peak currents may occur.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 17 of 106 2.1 Application Interface 56 Table 2: Signal properties (Continued) Function Signal name IO Signal form and level Comment Fast shutdown FST_SHDN I VILmax = 0.63V VIHmin = 1.17V VIHmax = 1.85V This line must be driven low. If unused keep line open. ~~|___|~~ low impulse width > 10ms Note that the fast shutdown line is originally available as GPIO line.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 18 of 106 2.1 Application Interface 56 Table 2: Signal properties (Continued) Function 2 IC Signal name IO Signal form and level Comment I2CCLK IO I2CDAT IO VOLmax = 0.45V VOHmin = 1.35V VOHmax = 1.85V According to the I2C Bus Specification Version 2.1 for the fast mode a rise time of max. 300ns is permitted. There is also a maximum VOL=0.4V at 3mA specified. VILmax = 0.63V VILmin = -0.3V VIHmin = 1.17V VIHmax = 1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 19 of 106 2.1 Application Interface 56 Table 2: Signal properties (Continued) Function Signal name IO Signal form and level Comment Status LED LED O VOLmax = 0.45V VOHmin = 1.35V VOHmax = 1.85V If unused keep line open. VOLmax = 0.45V VOHmin = 1.35V VOHmax = 1.85V If unused keep line open. Pulse counter COUNTER ADC (Analog-toDigital converter) ADC1 SIM card detection CCIN I I VILmax = 0.63V VILmin = -0.3V VIHmin = 1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 20 of 106 2.1 Application Interface 56 Table 2: Signal properties (Continued) Function Signal name IO Signal form and level 1.8V SIM Card Interface CCRST O VOHtypical = 1.26V VOHmax = 1.8V VOLtypical = 0.1V @1mA VOLmax = 0.3V CCIO I/O VILmax = 0.27V VILmin=-0.15V VIHmin = 1.26V VIHmax = 2V Comment VOLtypical = 0.1V @1mA VOLmax = 0.3V VOHmin = 1.26V at I = -10µA VOHmax = 1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 21 of 106 2.1 Application Interface 56 2.1.2.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 3 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to ELS31-VA/ELS51-VA. Table 3: Absolute maximum ratings Parameter Min Max Unit Supply voltage BATT+BB, BATT+RF -0.3 +4.5 V Voltage at all digital lines in Power Down mode -0.3 +0.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 22 of 106 2.1 Application Interface 56 2.1.3 USB Interface ELS31-VA/ELS51-VA supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The VUSB line is used for cable detection only, this is to be supplied by the external device.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 23 of 106 2.1 Application Interface 56 2.1.3.1 Interface implementation Figure 5 shows a standard USB interfacing circuit for "off board" interfacing (connection directly to a USB connector). If the USB interface is directly wired to a Host interface, the additional ESD protection (U1 on Figure 5) is not necessary, as the final product will not be a "hot swappable" item.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 24 of 106 2.1 Application Interface 56 2.1.3.2 Reducing Power Consumption While a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 25 of 106 2.1 Application Interface 56 2.1.4 Serial Interface ASC0 ELS31-VA/ELS51-VA offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 2.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 26 of 106 2.1 Application Interface 56 2.1.4.1 Serial Interface Start-up Behavior The following figure shows the startup behavior of the asynchronous serial interface ASC0. Power supply active Start up Reset state Firmware initialization Command interface initialization Interface active ON VCORE V180 EMERG_RST TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 For pull-up and pull-down values see Table 15.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 27 of 106 2.1 Application Interface 56 2.1.5 Serial Interface ASC1 ELS31-VA/ELS51-VA provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 2.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 28 of 106 2.1 Application Interface 56 Power supply active Start up Reset state Firmware initialization Command interface initialization Interface active ON VCORE ~ 15sec V180 EMERG_RST TXD1 RXD1 RTS1 CTS1 *) For pull-down values see Table 15. Figure 9: ASC1 startup behavior  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 29 of 106 2.1 Application Interface 56 2.1.6 UICC/SIM/USIM Interface ELS31-VA/ELS51-VA has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 30 of 106 2.1 Application Interface 56 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC SIM 220nF 1nF CCRST CCIO CCCLK Figure 10: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on ELS31-VA/ELS51-VA and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 31 of 106 2.1 Application Interface 56 2.1.7 Digital Audio Interface ELS31-VA/ELS51-VA supports a digital audio interface that can be employed either as pulse code modulation interface (see Section 2.1.8) or as inter IC sound interface (see Section 2.1.9). Operation of these interface variants is mutually exclusive, and can be configured by AT command (see [1])). Default setting is pulse code modulation. 2.1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 32 of 106 2.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 33 of 106 2.1 Application Interface 56 2.1.9 Inter IC Sound Interface (I2S) The I2S Interface is a standardized bidirectional I2S ("Inter-IC Sound Interface") based digital audio interface for transmission of mono voice signals for telephony services. The I2S interface can be enabled and configured using the AT command AT^SAIC (see [1]). An activation is possible only out of call and out of tone presentation.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 34 of 106 2.1 Application Interface 56 2.1.10 GPIO Interface ELS31-VA/ELS51-VA offers a GPIO interface with 17 GPIO and 3 GPO lines. The lines are shared with other interfaces or functions: Fast shutdown (see Section 2.1.16.4), status LED (see Section 2.1.16.1), a pulse counter (see Section 2.1.13), ASC0 (see Section 2.1.4), ASC1 (see Section 2.1.5), SPI (see Section 2.1.12), HSIC (see Section 2.1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 35 of 106 2.1 Application Interface 56 The following figure shows the startup behavior of the GPIO interface. With an active state of the ASC0 interface line CTS0, the initialization of the GPIO interface lines is also finished.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 36 of 106 2.1 Application Interface 56 2.1.11 I2C Interface I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 100kbps. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 37 of 106 2.1 Application Interface 56 The following figure shows the startup behavior of the I2C interface. With an active state of the ASC0 interface (i.e. CTS0 is at low level) the initialization of the I2C interface is also finished.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 38 of 106 2.1 Application Interface 56 2.1.12 SPI Interface The ELS31-VA/ELS51-VA GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface for control and data transfer between ELS31-VA/ELS51-VA and the external application. Only one application can be connected to the SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/ s.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 39 of 106 2.1 Application Interface 56 2.1.13 Pulse Counter The GPIO8 line can be configured as pulse counter line COUNTER (for GPIOs see Section 2.1.10). The pulse counter interface can be used, for example, as a clock - it is designed to measure signals from 0 to 1000 pulses per second. Note that the pulse counter works in batches of 8 pulses, i.e., the URC indicates the number of pulses counted in batches of 8 pulses.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 40 of 106 2.1 Application Interface 56 Table 9 lists the six SDIO interface lines: Table 9: SDIO interface lines Signal Direction Description SDIOCLK Out SD master clock output to SD/MMC/SDIO device. SDIOCMD I/O Command line. SDIO0 I/O SDIO1 I/O Data lines. Only SDIO0 carries data in 1-bit SD mode, SDIO0..3 carry data in 4-bits mode. SDIO interrupt is multiplexed with SDIO1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 41 of 106 2.1 Application Interface 56 Table 10: SDIO timings Mode Parameter Minimum High speed TISU Input set-up time 6ns TIH Input hold time 2ns TODLY Output delay time during Date Transfer Mode 0ns TOH Output hold time 2.5ns TISU Input set-up time 3ns TIH Input hold time 0.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 42 of 106 2.1 Application Interface 56 2.1.16 2.1.16.1 Control Signals Status LED The LED line can also be configured as GPO5 line, and can be used to drive a status LED that indicates different operating modes of the module (for GPOs see Section 2.1.10). LED and GPO functionality are mutually exclusive. To take advantage of this function connect an LED to the LED/GPO5 line as shown in Figure 18.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 43 of 106 2.1 Application Interface 56 2.1.16.2 Power Indication Circuit In Power Down mode the maximum voltage at any digital or analog interface line must not exceed +0.3V (see also Section 2.1.2.1). Exceeding this limit for any length of time might cause permanent damage to the module.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 44 of 106 2.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 45 of 106 2.1 Application Interface 56 2.1.16.4 Fast Shutdown The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The configured FST_SHDN line is an active low control signal. Before setting the FST_SHDN line to low, the ON signal should be set to low (see Figure 21). By default, the fast shutdown feature is disabled. It has to be enabled using the AT command AT^SCFG "MEShutdown/Fso". For details see [1].
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 46 of 106 2.2 RF Antenna Interface 56 2.2 RF Antenna Interface The RF interface has an impedance of 50Ω. ELS31-VA/ELS51-VA is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 47 of 106 2.2 RF Antenna Interface 56 2.2.2 Antenna Installation The antenna is connected by soldering the antenna pads (RF_OUT, pad #59 and DIV_ANT, pad 56) its neighboring ground pads (GND, i.e., pads #55, #57, #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for ELS31-VA/ELS51VA. All RF data specified throughout this document is related to the ARP.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 48 of 106 2.2 RF Antenna Interface 56 2.2.3 2.2.3.1 RF Line Routing Design RF Interface Signals Circuit Diagram Example Figure 23 is a topology reference, and it is recommended not to deviate from this circuit for your external application. The RF inter-connects called RF Port 1 and RF Port 2 are examples only. Depending on the RF antenna, the interfacing system will dictate the RF inter-connects.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 49 of 106 2.2 RF Antenna Interface 56 2.2.3.2 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 50 of 106 2.2 RF Antenna Interface 56 Micro-Stripline This section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 25: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 51 of 106 2.2 RF Antenna Interface 56 Application board Ground line Antenna line Ground line Figure 26: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 52 of 106 2.2 RF Antenna Interface 56 • Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 27: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 53 of 106 2.2 RF Antenna Interface 56 Application board Ground line Antenna line Ground line Figure 28: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 54 of 106 2.3 Sample Application 56 2.3 Sample Application Figure 29 shows a typical example of how to integrate a ELS31-VA/ELS51-VA module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 55 of 106 2.3 Sample Application 56 ELS31/ELS51 Main Antenna SDIO WiFi Div.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 56 of 106 2.3 Sample Application 56 2.3.1 Prevent Back Powering Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided in any case, for example reverse current from high state external control lines while the module is powered down. Therefore, the controlling application must be designed to prevent reverse current flow.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 57 of 106 3 Operating Characteristics 76 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 14: Overview of operating modes Mode Function Normal operation LTE IDLE No data transfer is in progress and the USB connection is suspended by host (or is not present) and no active communication via ASC0/ ASC1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 58 of 106 3.2 Power Up/Power Down Scenarios 76 3.2 Power Up/Power Down Scenarios Do not turn on the ELS31-VA/ELS51-VA while it is beyond the safety limits of voltage and temperature stated in Section 2.1.2.1. ELS31-VA/ELS51-VA will immediately switch off when these conditions are detected. In extreme cases this can cause permanent damage to the module. 3.2.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 59 of 106 3.2 Power Up/Power Down Scenarios 76 3.2.1.2 Switch on ELS31-VA/ELS51-VA Using ON Signal When the operating voltage BATT_BB is applied, ELS31-VA/ELS51-VA can be switched on by means of the ON signal. The ON signal is an edge triggered signal. The module starts into normal mode on detecting a rising edge at the ON signal. The subsequent high level at the ON signal should last for at least 100µs.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 60 of 106 3.2 Power Up/Power Down Scenarios 76 3.2.2 Restart ELS31-VA/ELS51-VA After startup ELS31-VA/ELS51-VA can be re-started as described in the following sections: • Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.2.2.1) • Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.2.2.2) 3.2.2.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 61 of 106 3.2 Power Up/Power Down Scenarios 76 It is recommended to control this EMERG_RST line with an open collector transistor or an open drain field-effect transistor. Note: It is necessary to trigger EMERG_RST after a module turn off by a sudden (incomplete) power drop, and before using ON to restart the module (see also Section 3.2.1.2).
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 62 of 106 3.2 Power Up/Power Down Scenarios 76 3.2.3 Signal States after First Startup Table 15 lists the states each interface signal passes through during reset and first firmware initialization. For further firmware startup initializations the values may differ because of different GPIO line configurations.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 63 of 106 3.2 Power Up/Power Down Scenarios 76 3.2.4 Turn off ELS31-VA/ELS51-VA To switch the module off the following procedures may be used: • Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1. • Hardware controlled shutdown procedure: Hardware controlled by employing the FST_SHDN line. See Section 2.1.16.4.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 64 of 106 3.2 Power Up/Power Down Scenarios 76 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs: • The ELS31-VA/ELS51-VA board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.2.5.1) • Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT command, i.e.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 65 of 106 3.2 Power Up/Power Down Scenarios 76 3.2.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 2. When the average supply voltage measured by ELS31-VA/ELS51-VA approaches the undervoltage shutdown threshold (i.e., 0.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 66 of 106 3.3 Power Saving 76 3.3 Power Saving ELS31-VA/ELS51-VA can be configured in two ways to control power consumption: • • Being set by configuration, it is possible to specify a so-called power saving mode for the module (for details on the command see [1]).
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 67 of 106 3.3 Power Saving 76 3.3.2 Wake-up via RTS0/RTS1 RTS0/RTS1 can be used to wake up ELS31-VA/ELS51-VA from SLEEP mode configured with AT command. Assertion of either RTS0 or RTS1 (i.e., toggle from inactive high to active low) serves as wake up event, thus allowing an external application to almost immediately terminate power saving. After RTS0/RTS1 assertion, the CTS0/CTS1 line signals module wake up, i.e.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 68 of 106 3.4 Power Supply 76 3.4 Power Supply ELS31-VA/ELS51-VA needs to be connected to a power supply at the SMT application interface - 2 BATT lines and GND. There are two separate voltage domains for BATT: • BATT_BB with a line mainly for the baseband power supply. • BATT_RF with a line for the RF power amplifier supply.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 69 of 106 3.4 Power Supply 76 3.4.1 Power Supply Ratings Table 17 and Table 18 assemble various voltage supply and current consumption ratings of the module. Table 17: Voltage supply ratings BATT_BB BATT_RF Description Conditions Min Supply voltage Directly measured at Module. Voltage must stay within the min/max values, including voltage drop, ripple, spikes 3.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 70 of 106 3.4 Power Supply 76 3.4.2 Minimizing Power Losses When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage of BATT_BB/BATT_RF never drops below 3.3V on the ELS31-VA/ELS51-VA board. 3.4.3 Measuring the Supply Voltage (BATT_BB) To measure the supply voltage of BATT_BB/BATT_RF it is possible to define three reference points GND ,BATT_BB and BATT_RF.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 71 of 106 3.5 Operating Temperatures 76 3.5 Operating Temperatures Please note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the extended temperature range. Table 19: Board temperature Parameter Normal operation 1 Min Typ Max Unit -30 +25 +85 °C +90 °C >+90 °C Extended operation -40 Automatic shutdown2 Temperature measured on ELS31-VA/ELS51-VA board <-40 --- 1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 72 of 106 3.6 Electrostatic Discharge 76 3.6 Electrostatic Discharge The LTE module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a ELS31-VA/ELS51-VA module.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 73 of 106 3.7 Blocking against RF on Interface Lines 76 3.7 Blocking against RF on Interface Lines To reduce EMI issues there are serial resistors, or capacitors to GND, implemented on the module for the ignition, emergency restart, and SIM interface lines (cp. Section 2.3). However, all other signal lines have no EMI measures on the module and there are no blocking measures at the module’s interface to an external application.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 74 of 106 3.7 Blocking against RF on Interface Lines 76 The following table lists EMI measures that may be implemented for each signal line at the module‘s SMT application interface.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 75 of 106 3.7 Blocking against RF on Interface Lines 76 Table 21: EMI measures on the application interface Signal name EMI measures A B BATT_RF x BATT_BB x C Measures required if BATT+RF is close to internal LTE antenna e.g.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 76 of 106 3.8 Reliability Characteristics 76 3.8 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 77 of 106 4 Mechanical Dimensions, Mounting and Packaging 92 4 Mechanical Dimensions, Mounting and Packaging The following sections describe the mechanical dimensions of ELS31-VA/ELS51-VA and give recommendations for integrating ELS31-VA/ELS51-VA into the host application. 4.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 78 of 106 4.1 Mechanical Dimensions of ELS31-VA/ELS51-VA 92 0.1 0.1(TOTAL) 0.31 0.04(PCB) 27.6 0.1 18.8 2.05 TOP VIEW Figure 41: Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm) 18.8 1.64 0.16 2.6 1.45 0.4 1.2 0.8 0.4 1.05 27.6 0.9 1.1 1.1 0.15 1.05 0.4 0.55 0.55 #0550. 7*&8 Figure 42: Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm) - bottom view  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 79 of 106 4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform 92 4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform This section describes how to mount ELS31-VA/ELS51-VA onto the PCBs (=printed circuit boards), including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [4].
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 80 of 106 4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform 92 The stencil design illustrated in Figure 44 is recommended by Gemalto M2M as a result of extensive tests with Gemalto M2M Daisy Chain modules. Figure 44: Recommended design for 120 micron thick stencil (top view, dual design)  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 81 of 106 4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform 92 4.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT process. Characterization tests should attempt to optimize the SMT process with regard to board level reliability.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 82 of 106 4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform 92 4.2.3 Soldering Conditions and Temperature 4.2.3.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 83 of 106 4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform 92 4.2.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module: • A maximum module temperature of 240°C. This specifies the temperature as measured at the module’s top side. • A maximum duration of 15 seconds at this temperature.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 84 of 106 4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform 92 4.2.4 Durability and Mechanical Handling 4.2.4.1 Storage Conditions ELS31-VA/ELS51-VA modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 85 of 106 4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform 92 4.2.4.2 Processing Life ELS31-VA/ELS51-VA must be soldered to an application within 72 hours after opening the MBB (=moisture barrier bag) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%. 4.2.4.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 86 of 106 4.3 Packaging 92 4.3 Packaging 4.3.1 Tape and Reel The single-feed tape carrier for ELS31-VA/ELS51-VA is illustrated in Figure 46. The figure also shows the proper part orientation. The tape width is 44 mm and the ELS31-VA/ELS51-VA modules are placed on the tape with a 28-mm pitch. The reels are 330 mm in diameter with a core diameter of 100 mm. Each reel contains 500 modules. 4.3.1.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 87 of 106 4.3 Packaging 92 4.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 48: Barcode label on tape reel  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 88 of 106 4.3 Packaging 92 4.3.2 Shipping Materials ELS31-VA/ELS51-VA is distributed in tape and reel carriers. The tape and reel carriers used to distribute ELS31-VA/ELS51-VA are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card • Transportation box 4.3.2.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 89 of 106 4.3 Packaging 92 Figure 50: Moisture Sensitivity Label  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 90 of 106 4.3 Packaging 92 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 91 of 106 4.3 Packaging 92 4.3.3 Trays If small module quantities are required, e.g., for test and evaluation purposes, ELS31-VA/ELS51-VA may be distributed in trays (for dimensions see Figure 55). The small quantity trays are an alternative to the single-feed tape carriers normally used. However, the trays are not designed for machine processing.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 92 of 106 4.3 Packaging 92 Figure 55: Tray dimensions  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 93 of 106 5 Regulatory and Type Approval Information 98 5 Regulatory and Type Approval Information 5.1 Directives and Standards ELS31-VA/ELS51-VA is designed to comply with the directives and standards listed below.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 94 of 106 5.1 Directives and Standards 98 Table 30: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 95 of 106 5.2 SAR requirements specific to portable mobiles 98 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 96 of 106 5.3 Reference Equipment for Type Approval 98 5.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 97 of 106 5.4 Compliance with FCC and IC Rules and Regulations 98 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 98 of 106 5.4 Compliance with FCC and IC Rules and Regulations 98 will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 99 of 106 6 Document Information 103 6 Document Information 6.1 Revision History New document: "Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description" v01.000 Chapter What is new -- Initial document setup.  ELS31-VA_ELS51-VA_HID_v01.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 100 of 106 6.2 Related Documents 103 6.2 [1] [2] [3] [4] [5] Related Documents ELS31-VA/ELS51-VA AT Command Set ELS31-VA/ELS51-VA Release Note Application Note 40: Thermal Solutions Application Note 48: SMT Module Integration Universal Serial Bus Specification Revision 2.0, April 27, 2000 6.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 101 of 106 6.3 Terms and Abbreviations 103 Abbreviation Description DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EIRP Equivalent Isotropic Radiated Power EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 102 of 106 6.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 103 of 106 6.4 Safety Precaution Notes 103 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS31-VA/ELS51-VA.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 104 of 106 7 Appendix 105 7 Appendix 7.
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Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Page 105 of 106 7.1 List of Parts and Accessories 105 Table 34: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
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About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2015 annual revenues of €3.1 billion and blue-chip customers in over 180 countries. Our 14,000+ employees operate out of 118 offices, 45 personalization and data centers, and 27 research and software development centers located in 49 countries. Gemalto develops secure embedded software and secure products which we design and personalize.