Cinterion® ELS31-US/ELS51-US Hardware Interface Overview Version: DocId: 01.000a ELS31-US_ELS51-US_HIO_v01.000a M2M.GEMALTO.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 2 of 46 2 Document Name: Cinterion® ELS31-/ELS51-US Hardware Interface Overview Version: 01.000a Date: 2016-12-28 DocId: ELS31-US_ELS51-US_HIO_v01.000a Status: Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 3 of 46 Contents 46 Contents 1 Introduction ................................................................................................................. 7 1.1 Key Features at a Glance .................................................................................. 7 1.2 ELS31-US/ELS51-US System Overview ......................................................... 10 2 Interface Characteristics .............................................
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 4 of 46 Contents 46 6 Document Information.............................................................................................. 39 6.1 Revision History ............................................................................................... 39 6.2 Related Documents ......................................................................................... 39 6.3 Terms and Abbreviations .............................................
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 5 of 46 Tables 46 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Signals of the SIM interface (SMT application interface) ............................... GPIO lines and possible alternative assignment............................................ SDIO interface features............................................................................
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 6 of 46 Figures 46 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: ELS31-US/ELS51-US system overview......................................................... USB circuit ..................................................................................................... Serial interface ASC0.........................
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 7 of 46 1 Introduction 10 1 Introduction This document1 describes the hardware of the Cinterion® ELS31-US and ELS51-US modules. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 8 of 46 1.1 Key Features at a Glance 10 Feature Implementation Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4].
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 9 of 46 1.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 10 of 46 1.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 11 of 46 2 Interface Characteristics 29 2 Interface Characteristics ELS31-US/ELS51-US is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interfaces. 2.1 Application Interface 2.1.1 USB Interface ELS31-US/ELS51-US supports a USB 2.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 12 of 46 2.1 Application Interface 29 2.1.2 Serial Interface ASC0 ELS31-US/ELS51-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). ELS31-US/ELS51-US is designed for use as a DCE.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 13 of 46 2.1 Application Interface 29 2.1.3 Serial Interface ASC1 ELS31-US/ELS51-US provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). The ASC1 interface lines are originally available as GPIO lines.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 14 of 46 2.1 Application Interface 29 2.1.4 UICC/SIM/USIM Interface ELS31-US/ELS51-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 15 of 46 2.1 Application Interface 29 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC SIM 220nF 1nF CCRST CCIO CCCLK Figure 5: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on ELS31-US/ELS51-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 16 of 46 2.1 Application Interface 29 2.1.5 GPIO Interface ELS31-US/ELS51-US offers a GPIO interface with 17 GPIO and 3 GPO lines. The lines are shared with other interfaces or functions: Fast shutdown (see Section 2.1.11.2), status LED (see Section 2.1.11.1), a pulse counter (see Section 2.1.8), ASC0 (see Section 2.1.2), ASC1 (see Section 2.1.3), SPI (see Section 2.1.7), and HSIC (see Section 2.1.9).
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 17 of 46 2.1 Application Interface 29 2.1.6 I2C Interface I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 100kbps. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 18 of 46 2.1 Application Interface 29 2.1.10 SDIO Interface (ELS51-US Only) The Secure Digital Input Output (SDIO) interface can be used to for instance connect an SD card. The SDIO interface has the following features: Table 3: SDIO interface features Feature Description/Value Interface Type SDIO/SD1 (1 data line), SDIO/SD4 (4 data lines), MMC4 (4 data lines) Voltage 1.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 19 of 46 2.1 Application Interface 29 2.1.11 2.1.11.1 Control Signals Status LED The LED line can also be configured as GPO5 line, and can be used to drive a status LED that indicates different operating modes of the module (for GPOs see Section 2.1.5). LED and GPO functionality are mutually exclusive. 2.1.11.2 Fast Shutdown The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 20 of 46 2.2 RF Antenna Interface 29 2.2 RF Antenna Interface The RF interface has an impedance of 50Ω. ELS31-US/ELS51-US is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 21 of 46 2.2 RF Antenna Interface 29 2.2.1 Antenna Installation The antenna is connected by soldering the antenna pads (RF_OUT, pad #59 and DIV_ANT, pad 56) its neighboring ground pads (GND, i.e., pads #55, #57, #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for ELS31-US/ELS51US. All RF data specified throughout this document is related to the ARP.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 22 of 46 2.2 RF Antenna Interface 29 2.2.2 2.2.2.1 RF Line Routing Design RF Interface Signals Circuit Diagram Example Figure 6 is a topology reference, and it is recommended not to deviate from this circuit for your external application. The RF inter-connects called RF Port 1 and RF Port 2 are examples only. Depending on the RF antenna, the interfacing system will dictate the RF inter-connects.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 23 of 46 2.2 RF Antenna Interface 29 2.2.2.2 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 24 of 46 2.2 RF Antenna Interface 29 Micro-Stripline This section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 8: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ELS31-US_ELS51-US_HIO_v01.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 25 of 46 2.2 RF Antenna Interface 29 Application board Ground line Antenna line Ground line Figure 9: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 ELS31-US_ELS51-US_HIO_v01.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 26 of 46 2.2 RF Antenna Interface 29 • Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 10: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 ELS31-US_ELS51-US_HIO_v01.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 27 of 46 2.2 RF Antenna Interface 29 Application board Ground line Antenna line Ground line Figure 11: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 ELS31-US_ELS51-US_HIO_v01.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 28 of 46 2.3 Sample Application 29 2.3 Sample Application Figure 12 shows a typical example of how to integrate a ELS31-US/ELS51-US module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 29 of 46 2.3 Sample Application 29 ELS31/ELS51 Main Antenna SDIO WiFi Div.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 30 of 46 3 Operating Characteristics 30 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 6: Overview of operating modes Mode Function Normal operation LTE IDLE No data transfer is in progress and the USB connection is suspended by host (or is not present) and no active communication via ASC0/ ASC1.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 31 of 46 4 Mechanical Dimensions, Mounting and Packaging 32 4 Mechanical Dimensions, Mounting and Packaging The following sections describe the mechanical dimensions of ELS31-US/ELS51-US and give recommendations for integrating ELS31-US/ELS51-US into the host application. 4.1 Mechanical Dimensions of ELS31-US/ELS51-US Figure 13 shows the top and bottom view of ELS31-US/ELS51-US and provides an overview of the board's mechanical dimensions.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 32 of 46 4.1 Mechanical Dimensions of ELS31-US/ELS51-US 32 0.1 0.1(TOTAL) 0.31 0.04(PCB) 27.6 0.1 18.8 2.05 TOP VIEW Figure 14: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) 18.8 1.64 0.16 2.6 1.45 0.4 1.2 0.8 0.4 1.05 27.6 0.9 1.1 1.1 0.15 1.05 0.4 0.55 0.55 #0550. 7*&8 Figure 15: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) - bottom view ELS31-US_ELS51-US_HIO_v01.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 33 of 46 5 Regulatory and Type Approval Information 38 5 Regulatory and Type Approval Information 5.1 Directives and Standards ELS31-US/ELS51-US is designed to comply with the directives and standards listed below.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 34 of 46 5.1 Directives and Standards 38 Table 11: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 35 of 46 5.2 SAR requirements specific to portable mobiles 38 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 36 of 46 5.3 Reference Equipment for Type Approval 38 5.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 37 of 46 5.4 Compliance with FCC and IC Rules and Regulations 38 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 38 of 46 5.4 Compliance with FCC and IC Rules and Regulations 38 quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 39 of 46 6 Document Information 43 6 Document Information 6.1 Revision History New document: "Cinterion® ELS31-/ELS51-US Hardware Interface Overview" v01.000a Chapter What is new -- Initial document setup. 6.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 40 of 46 6.3 Terms and Abbreviations 43 Abbreviation Description dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 41 of 46 6.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 42 of 46 6.3 Terms and Abbreviations 43 Abbreviation Description TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TLS Transport Layer Security Tx Transmit Direction UART Universal asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio ELS31-US_ELS51-US_HIO_v01.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 43 of 46 6.4 Safety Precaution Notes 43 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS31-US/ELS51-US.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 44 of 46 7 Appendix 45 7 Appendix 7.
Cinterion® ELS31-/ELS51-US Hardware Interface Overview Page 45 of 46 7.1 List of Parts and Accessories 45 Table 15: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
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