BGS2-E/BGS2-W Version: DocId: 01.300 BGS2_HIO_v01.
BGS2-E/BGS2-W Hardware Interface Overview 2 Document Name: BGS2-E/BGS2-W Hardware Interface Overview Version: 01.300 Date: 2011-03-08 DocId: BGS2_HIO_v01.300 Status Confidential / Released GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS.
BGS2-E/BGS2-W Hardware Interface Overview Contents 29 Contents 1 Introduction ................................................................................................................. 6 1.1 Related Documents ........................................................................................... 6 1.2 Terms and Abbreviations ................................................................................... 6 1.3 Regulatory and Type Approval Information ......................................
BGS2-E/BGS2-W Hardware Interface Overview Tables 110 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Directives ....................................................................................................... Standards of North American type approval .................................................. Standards of European type approval.....................................................
BGS2-E/BGS2-W Hardware Interface Overview Figures 110 Figures Figure 1: Figure 2: Figure 3: Numbering plan for connecting pads (bottom view)....................................... 24 BGS2-E/BGS2-W– top and bottom view........................................................ 27 Reference equipment for Type Approval ....................................................... 28 BGS2_HIO_v01.
BGS2-E/BGS2-W Hardware Interface Overview 1 Introduction 14 1 Introduction This document1 describes the hardware of the Cinterion BGS2-E/BGS2-W module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.1 [1] [2] Related Documents BGS2-E/BGS2-W AT Command Set BGS2-E/BGS2-W Release Note 1.
BGS2-E/BGS2-W Hardware Interface Overview 1.
BGS2-E/BGS2-W Hardware Interface Overview 1.
BGS2-E/BGS2-W Hardware Interface Overview 1.2 Terms and Abbreviations 14 Abbreviation Description Tx Transmit Direction UART Universal asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio BGS2_HIO_v01.
BGS2-E/BGS2-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 1.3 Regulatory and Type Approval Information 1.3.1 Directives and Standards BGS2-E/BGS2-W is designed to comply with the directives and standards listed below.
BGS2-E/BGS2-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 Table 3: Standards of European type approval ETSI EN 301 489-1 V1.8.1 Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common Technical Requirements ETSI EN 301 489-7 V1.3.
BGS2-E/BGS2-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 Table 6: Toxic or hazardous substances or elements with defined concentration limits BGS2_HIO_v01.
BGS2-E/BGS2-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 1.3.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy.
BGS2-E/BGS2-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 1.3.3 Safety Precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating BGS2-E/BGS2-W. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
BGS2-E/BGS2-W Hardware Interface Overview 2 Product Concept 16 2 Product Concept 2.1 Key Features at a Glance Feature Implementation General Frequency bands Dual band (BGS2-E): GSM 900/1800MHz Quad band (BGS2-W): GSM 850/900/1800/1900MHz GSM class Small MS Output power (according to Release 99, V5) Class 4 (+33dBm ±2dB) for EGSM850 (quad band only) Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900 (quad band only) Power supply 3.3V to 4.
BGS2-E/BGS2-W Hardware Interface Overview 2.1 Key Features at a Glance 16 Feature Implementation Software AT commands Hayes 3GPP TS 27.007, TS 27.005, Cinterion AT commands for RIL compatibility Microsoft™ compatibility RIL for Pocket PC and Smartphone SIM Application Toolkit SAT Release 99 TCP/IP stack Protocols: TCP server/client, UDP, HTTP, FTP, SMTP, POP3 Access by AT commands Firmware update Generic update from host application over ASC0 or ASC1.
BGS2-E/BGS2-W Hardware Interface Overview 3 Application Interface 18 3 Application Interface BGS2-E/BGS2-W is equipped with an SMT application interface that connects to the external application. The host interface incorporates several sub-interfaces: power supply, SIM interface, serial interface ASC0, serial interface ASC1, analog audio interface, GPIO interface, I2C interface and PWM interface (for details see Chapter 2 and Section 5.5). BGS2_HIO_v01.
BGS2-E/BGS2-W Hardware Interface Overview 3.1 Operating Modes 18 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 7: Overview of operating modes Normal operation GSM/GPRS SLEEP Various power save modes set with AT+CFUN command. Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too.
BGS2-E/BGS2-W Hardware Interface Overview 4 Antenna Interface 19 4 Antenna Interface The RF interface has an impedance of 50Ω. BGS2-E/BGS2-W is capable of sustaining a total mismatch at the antenna lines without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression.
BGS2-E/BGS2-W Hardware Interface Overview 5 Electrical, Reliability and Radio Characteristics 26 5 Electrical, Reliability and Radio Characteristics 5.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 9 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to BGS2-E/BGS2-W. Table 9: Absolute maximum ratings Parameter Min Max Unit Supply voltage BATT+ -0.3 +6.0 V Voltage at all digital lines in Power Down mode -0.
BGS2-E/BGS2-W Hardware Interface Overview 5.2 Operating Temperatures 26 5.2 Operating Temperatures Please note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the restriced temperature range. A special URC reports whether the module enters or leaves the restriced temperature range (see [1]; AT^SCTM).
BGS2-E/BGS2-W Hardware Interface Overview 5.3 Storage Conditions 26 5.3 Storage Conditions BGS2-E/BGS2-W modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum.
BGS2-E/BGS2-W Hardware Interface Overview 5.4 Reliability Characteristics 26 5.4 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications.
BGS2-E/BGS2-W Hardware Interface Overview 5.5 Pad Assignment 26 5.5 Pad Assignment The SMT application interface on the BGS2-E/BGS2-W provides connecting pads to integrate the module into external applications. Figure 1 shows the connecting pads’ numbering plan, the following Table 15 lists the pads’ assignments.
BGS2-E/BGS2-W Hardware Interface Overview 5.5 Pad Assignment 26 Table 15: Pad assignments Pad no. Signal name Pad no. Signal name Pad no.
BGS2-E/BGS2-W Hardware Interface Overview 5.6 Power Supply Ratings 26 5.6 Power Supply Ratings Table 16: Power supply ratings1 Parameter Description Conditions BATT+ Supply voltage Voltage must stay within the min/ 3.3 max values, including voltage drop, ripple and spikes.
BGS2-E/BGS2-W Hardware Interface Overview 6 Mechanics, Mounting and Packaging 27 6 Mechanics, Mounting and Packaging The following sections describe the mechanical dimensions of BGS2-E/BGS2-W and give recommendations for integrating BGS2-E/BGS2-W into the host application. 6.1 Mechanical Dimensions of BGS2-E/BGS2-W Figure 2 shows the top and bottom view of BGS2-E/BGS2-W and provides an overview of the board's mechanical dimensions.
BGS2-E/BGS2-W Hardware Interface Overview 7 Reference Approval 29 7 Reference Approval 7.
BGS2-E/BGS2-W Hardware Interface Overview 7.2 Compliance with FCC and IC Rules and Regulations 29 7.2 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Cinterion Wireless Modules reference application described in Section 7.
